Patents by Inventor Yinuo Jin
Yinuo Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967497Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device; before bubble cavitation in the liquid damaging patterned structure on the substrate, setting the ultra/mega sonic power supply at zero output; after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time ?1, or comparing the detected power off time with a preset time ?2, or comparing detected amplitude of each waveform with a preset value, if the detected power on timeType: GrantFiled: January 13, 2022Date of Patent: April 23, 2024Assignee: ACM Research (Shanghai) Inc.Inventors: Jun Wang, Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Xuejun Li
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Publication number: 20240126771Abstract: A multi-parameter data type framework can, among other things, provide a more comprehensive, systematic, and/or formal mechanisms for determining an appropriate data type for a data set. For example, the multi-parameter data type framework can be used to allow analytic tools to virtually automatically figure out an appropriate data type for a set of data values.Type: ApplicationFiled: October 13, 2022Publication date: April 18, 2024Applicant: Teradata US, Inc.Inventors: Sung Jin Kim, Yinuo Zhang, Wellington Marcos Cabrera Arevalo, Rehana Rahiman, Mohamed Mahmoud Hafez Mahmoud Abdelrahman, Venkat Swamy Godi
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Patent number: 11911808Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.Type: GrantFiled: March 9, 2023Date of Patent: February 27, 2024Assignee: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
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Publication number: 20240035189Abstract: A cup-shaped chuck of a substrate holding device includes an inner pressing ring, a middle frame, a sealing element, an outer pressing ring and a contact ring. The inner pressing ring is locked on the inner peripheral surface of the middle frame. The sealing element has an outer end part, a bottom part and an inner end part. The outer end part of the sealing element wraps the outer peripheral surface of at least part of the middle frame. The bottom part of the sealing element wraps the bottom of the middle frame, and is exposed to the outside of the cup-shaped chuck. The inner end part of the sealing element wraps the inner peripheral surface of at least part of the middle frame and is pressed between the inner pressing ring and the middle frame by the inner pressing ring.Type: ApplicationFiled: November 19, 2021Publication date: February 1, 2024Applicant: ACM RESEARCH (SHANGHAI), INC.Inventors: Hui Wang, Jian Wang, Zhaowei Jia, Yinuo Jin, Hongchao Yang
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Publication number: 20240018681Abstract: The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate.Type: ApplicationFiled: July 31, 2023Publication date: January 18, 2024Applicant: ACM RESEARCH (SHANGHAI), INC.Inventors: Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
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Patent number: 11848217Abstract: The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.Type: GrantFiled: June 14, 2021Date of Patent: December 19, 2023Assignee: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
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Patent number: 11781235Abstract: A plating apparatus and plating methods for plating metal layers on a substrate.Type: GrantFiled: December 28, 2018Date of Patent: October 10, 2023Assignee: ACM RESEARCH (SHANGHAI), INC.Inventors: Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
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Patent number: 11752529Abstract: A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.Type: GrantFiled: November 15, 2017Date of Patent: September 12, 2023Assignee: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
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Publication number: 20230256480Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.Type: ApplicationFiled: March 9, 2023Publication date: August 17, 2023Applicant: ACM Research (Shanghai) Inc.Inventors: Hui WANG, Fufa CHEN, Fuping CHEN, Jian WANG, Xi WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Liangzhi XIE, Jun WANG, Xuejun LI
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Publication number: 20230223301Abstract: Embodiments of the present invention provide a method for removing a barrier layer of a metal interconnection on a wafer, which remove a single-layer metal ruthenium barrier layer. A method comprises: oxidizing step, is to oxidize the single-layer metal ruthenium barrier layer into a ruthenium oxide layer by electrochemical anodic oxidation process; oxide layer etching step, is to etch the ruthenium oxide layer with etching liquid to remove the ruthenium oxide layer.Type: ApplicationFiled: May 31, 2021Publication date: July 13, 2023Applicant: ACM RESEARCH (SHANGHAI), INC.Inventors: Hui Wang, Hongwei Zhang, Yingwei Dai, Yinuo Jin, Jian Wang
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Patent number: 11638937Abstract: A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.Type: GrantFiled: July 16, 2021Date of Patent: May 2, 2023Assignee: ACM RESEARCH, INC.Inventors: Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
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Patent number: 11633765Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.Type: GrantFiled: September 9, 2021Date of Patent: April 25, 2023Assignee: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
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Patent number: 11581205Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned. Normally, if f1=f2, then P2 is equal to zero or much less than P1; if P1=P2, then f2 is higher than f1; if the f1<f2, then, P2 can be either equal or less than P1.Type: GrantFiled: January 4, 2021Date of Patent: February 14, 2023Assignee: ACM Research, Inc.Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
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Publication number: 20220139697Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device; before bubble cavitation in the liquid damaging patterned structure on the substrate, setting the ultra/mega sonic power supply at zero output; after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time ?1, or comparing the detected power off time with a preset time ?2, or comparing detected amplitude of each waveform with a preset value, if the detected power on timeType: ApplicationFiled: January 13, 2022Publication date: May 5, 2022Applicant: ACM Research (Shanghai) Inc.Inventors: Jun WANG, Hui WANG, Fufa CHEN, Fuping CHEN, Jian WANG, Xi WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Liangzhi XIE, Xuejun LI
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Publication number: 20220081796Abstract: A plating apparatus and plating methods for plating metal layers on a substrate.Type: ApplicationFiled: December 28, 2018Publication date: March 17, 2022Applicant: ACM Research (Shanghai) Inc.Inventors: Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
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Patent number: 11257667Abstract: A method for cleaning a semiconductor substrate without damaging its patterned structure via an ultra/mega sonic device comprises applying liquid into a space between the substrate and the sonic device; setting an ultra/mega sonic device power supply at a frequency f1 and power P1; and at zero output before bubble cavitation occurs; followed by at f1 and P1 again after bubble temperature is lowered; detecting power on time (at P1, f1), power off time or amplitude of each waveform output by the power supply; comparing the detected power on time with a preset time T1, power off time with a preset time ?2, amplitude of each waveform with a preset value, if the detected power on time is longer than ?1, or power off time is shorter than ?2, or amplitude of any waveform is larger than the preset value, shut down the power supply and send out an alarm.Type: GrantFiled: April 6, 2016Date of Patent: February 22, 2022Assignee: ACM Research (Shanghai) Inc.Inventors: Jun Wang, Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Xuejun Li
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Publication number: 20220032344Abstract: A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.Type: ApplicationFiled: July 16, 2021Publication date: February 3, 2022Inventors: Hui WANG, Xi WANG, Fuping CHEN, Fufa CHEN, Jian WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Jun WANG, Xuejun LI
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Publication number: 20220037172Abstract: The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.Type: ApplicationFiled: June 14, 2021Publication date: February 3, 2022Applicant: ACM Research (Shanghai) Inc.Inventors: Hui WANG, Xi WANG, Fuping CHEN, Fufa CHEN, Jian WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Jun WANG, Xuejun LI
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Publication number: 20210402444Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.Type: ApplicationFiled: September 9, 2021Publication date: December 30, 2021Applicant: ACM Research (Shanghai) Inc.Inventors: Hui WANG, Fufa CHEN, Fuping CHEN, Jian WANG, Xi WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Liangzhi XIE, Jun WANG, Xuejun LI
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Patent number: 11141762Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.Type: GrantFiled: November 15, 2017Date of Patent: October 12, 2021Assignee: ACM Research (Shanghai), Inc.Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li