Abstract: A substrate processing apparatus includes a clamp mechanism, a spray head mechanism, a rotary drive mechanism, a heating mechanism, and a control mechanism. The heating mechanism includes a heating plate arranged below a substrate, wherein the heating plate is provided with at least two cavities in a radial direction, and the cavities are distributed at different radii. During the process of the liquid nozzle moving from the center of the substrate to the edge of the substrate along the radial direction of the substrate, when the liquid nozzle moves to a certain area above the substrate, the control mechanism controls the thermal energy of fluid in the cavity located at the corresponding radius of the area.

Abstract: Disclosed in an embodiment of the present invention is a substrate heating apparatus, comprising a holding unit, a rotating unit, a heating unit, and a control unit. The heating unit comprises multiple fluid supply pipes and multiple groups of fluid cartridges, a substrate region heated by the fluid cartridges in the same group is a circular ring or a circle, and substrate regions heated by the fluid cartridges in different groups are not overlapped with each other and are concentric. The control unit can measure and adjust the temperatures of the substrate regions in real time. Because the structure of the heating unit is optimally designed and the control unit is added, the substrate heating apparatus of the present invention can adjust the temperatures of the regions on the substrate in real time, so that the temperatures of the regions on the substrate tend to be consistent, and high substrate heating efficiency and high temperature adjustment response speed are achieved.