Abstract: Composite backplate architectures for backside power delivery and associated methods are disclosed. An example backplate includes a first layer including a first material, and a second layer attached to the first layer. The second layer includes a second material different from the first material. The example backplate further includes a bus bar attached to the first layer.

Abstract: A multi-entry socket power delivery structure is attachable to a printed circuit board to provide improved delivery of one or more power supply signals to a socket. The power delivery structure provides an additional path for power supply signals to be delivered to a socket (in addition to the “power corridor” of the printed circuit board). The power delivery structure comprises one or more portions, with individual portions comprising a printed circuit board connection portion that attaches to the printed circuit board to receive a power supply signal generated by a voltage regulator, and a socket connection portion that attaches to the printed circuit board to deliver the power supply signal to the socket via the printed circuit board. The power delivery structure can be located in the recess of a reinforced backplate that provides structural integrity to a processor stack and associated thermal management solution loading mechanism.