Abstract: Electronic assemblies with absorbing layers are described. In an embodiment, an electronic assembly includes an absorbing layer embedded in a substrate, a landing pad formed on a top surface of the substrate, and an electronic component bonded to the landing pad by a bonding layer, where the absorbing layer is located below the electronic component and absorbs a particular wavelength to a greater extent than the substrate.

Abstract: An integrated photonic system including multiple photonic dies that are laterally aligned using contact between pairs of vertical surfaces. The vertical surfaces can be manufactured by defining, via photolithography processes for example, the shape of the vertical surfaces. Thereafter, the vertical surfaces can be aligned and engaged, thereby optically and mechanically intercoupling the multiple photonic dies.

Abstract: A droop reduction circuit on a die includes a voltage detector circuit to detect voltage droop in a supply voltage received by a first load. The droop reduction circuit further includes a driver controller circuit to drive power switch (PSH) banks in response to detection of the voltage droop. Each of the PSH banks includes at least one power switch having an input terminal, a gate terminal, and an output terminal. The input terminal is to receive a secondary voltage, which is higher than the supply voltage and is also received by a second load on the die. The gate terminal is to receive a drive signal from the driver controller, and the output terminal is to pull up the voltage droop in the supply voltage.

Abstract: A droop reduction circuit on a die includes a voltage detector circuit to detect voltage droop in a supply voltage received by a first load. The droop reduction circuit further includes a driver controller circuit to drive power switch (PSH) banks in response to detection of the voltage droop. Each of the PSH banks includes at least one power switch having an input terminal, a gate terminal, and an output terminal. The input terminal is to receive a secondary voltage, which is higher than the supply voltage and is also received by a second load on the die. The gate terminal is to receive a drive signal from the driver controller, and the output terminal is to pull up the voltage droop in the supply voltage.

Abstract: A device for reducing leakage current includes a memory cell array, a power switch and a core logic. The memory cell array is electrically connected to a first power rail which supplies a first voltage level. The core logic circuitry is electrically connected to a second power rail via the power switch when the power switch is turned on. The second power rail supplies a second voltage level which is lower than the first voltage level. The power switch is to be turned off by the first voltage level supplied to a gate terminal of the power switch, to thereby disconnect the core logic circuitry in a sleep state from the second power rail.

Abstract: A device for reducing leakage current includes a memory cell array, a power switch and a core logic. The memory cell array is electrically connected to a first power rail which supplies a first voltage level. The core logic circuitry is electrically connected to a second power rail via the power switch when the power switch is turned on. The second power rail supplies a second voltage level which is lower than the first voltage level. The power switch is to be turned off by the first voltage level supplied to a gate terminal of the power switch, to thereby disconnect the core logic circuitry in a sleep state from the second power rail.

Abstract: A circuitry includes a functional circuit providing a predetermined function and a resistive device coupled between a power supply and the functional circuit to contribute a resistance on a power supplying path for the power supply to supply power to the functional circuit. The resistance is tunable.

Abstract: A circuitry includes a functional circuit providing a predetermined function and a resistive device coupled between a power supply and the functional circuit to contribute a resistance on a power supplying path for the power supply to supply power to the functional circuit. The resistance is tunable.

Abstract: A tunable delay circuit includes a first multiplexer, a delay chain, and a second multiplexer. The first multiplexer selects an input signal or a feedback signal as a first output signal according to an enable signal. The delay chain delays the first output signal for different time periods so as to generate a plurality of delay signals. One of the delay signals is used as the feedback signal. The second multiplexer selects one of the delay signals as a second output signal according to a pass signal.

Abstract: A method for providing an on-chip variation determination and an integrated circuit utilizing the same are provided. The method includes: outputting, by a launch register circuit, a test data to the capture register circuit according to the first clock; receiving, by a capture register circuit, the test data from the launch register circuit according to the second clock; adjusting, by a control circuit, a first number of a first chain of delay elements to generate the first clock and a second number of a second chain of delay elements for the capture register circuit to just capture the test data to generate the second clock; and determining, by the control circuit, a path delay between the launch register circuit and the capture register circuit based on the first number of the first chain of delay elements and the second number of the second chain of delay elements.

Abstract: A digital circuit comprises a plurality of functional circuits and a finite state machine. Each functional circuit comprises a digital macro, a resistance control device and at least one device with capacitance. The digital macro is coupled to a ground. The resistance control device is electrically connected between the digital macro and an always-on power mesh. The at least one device with capacitance is electrically connected between the resistance control device and the ground. The finite state machine is electrically connected to the resistance control device, and is configured to adjust the resistance of the resistance control device.

Abstract: An integrated circuit (IC) is provided. The IC includes an intellectual property (IP) module, and a dynamic voltage scaling regulator capable of providing an output signal to the IP module. The dynamic voltage scaling regulator includes an on-die low drop out (LDO) regulator, a current sensor coupled to the on-die LDO regulator and the IP module, and a control unit coupled to the current sensor and the on-die LDO regulator. The LDO regulator generates the output signal according to a control signal. The current sensor provides a sensing signal according to a current of the output signal. The control unit provides the control signal to the on-die LDO regulator according to the sensing signal. In response to a variation of the current of the output signal, the on-die LDO regulator adjusts a voltage value of the output signal according to the control signal.

Abstract: A tunable delay circuit includes a first multiplexer, a delay chain, and a second multiplexer. The first multiplexer selects an input signal or a feedback signal as a first output signal according to an enable signal. The delay chain delays the first output signal for different time periods so as to generate a plurality of delay signals. One of the delay signals is used as the feedback signal. The second multiplexer selects one of the delay signals as a second output signal according to a pass signal.

Abstract: A digital circuit comprises a plurality of functional circuits and a finite state machine. Each functional circuit comprises a digital macro, a resistance control device and at least one device with capacitance. The digital macro is coupled to a ground. The resistance control device is electrically connected between the digital macro and an always-on power mesh. The at least one device with capacitance is electrically connected between the resistance control device and the ground. The finite state machine is electrically connected to the resistance control device, and is configured to adjust the resistance of the resistance control device.

Abstract: A method for providing an on-chip variation determination and an integrated circuit utilizing the same are provided. The method includes: outputting, by a launch register circuit, a test data to the capture register circuit according to the first clock; receiving, by a capture register circuit, the test data from the launch register circuit according to the second clock; adjusting, by a control circuit, a first number of a first chain of delay elements to generate the first clock and a second number of a second chain of delay elements for the capture register circuit to just capture the test data to generate the second clock; and determining, by the control circuit, a path delay between the launch register circuit and the capture register circuit based on the first number of the first chain of delay elements and the second number of the second chain of delay elements.