Patents by Inventor Yi Ping Lin

Yi Ping Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967898
    Abstract: A soft-switching power converter includes a main switch, an energy-releasing switch, and an inductive coupled unit. The main switch is a controllable switch. The energy-releasing switch is coupled to the main switch. The inductive coupled unit is coupled to the main switch and the energy-releasing switch. The inductive coupled unit includes a first inductance, a second inductance coupled to the first inductance, and an auxiliary switch unit. The auxiliary switch unit is coupled to the second inductance to form a closed loop. The main switch and the energy-releasing switch are alternately turned on and turned off. The auxiliary switch unit is controlled to start turning on before the main switch is turned on so as to provide at least one current path.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: April 23, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hung-Chieh Lin, Yi-Ping Hsieh, Jin-Zhong Huang, Hung-Yu Huang, Chih-Hsien Li, Ciao-Yin Pan
  • Patent number: 11936238
    Abstract: An uninterruptible power apparatus is coupled between a power grid and a load. The uninterruptible power apparatus includes a bypass path, a power conversion module, and a control module. The bypass path is coupled to the power grid through a grid terminal, and coupled to the load through a load terminal. The control module turns off a first thyristor and a second thyristor by injecting a second voltage into the load terminal during a forced commutation period. The control module calculates a magnetic flux offset amount based on an error amount between the second voltage and a voltage command, and provides a compensation command in response to the magnetic flux offset amount. The control module controls the DC/AC conversion circuit to provide a third voltage to the load terminal based on the compensation command and the voltage command.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: March 19, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hsin-Chih Chen, Hung-Chieh Lin, Chao-Lung Kuo, Yi-Ping Hsieh, Chien-Shien Lee
  • Publication number: 20240077374
    Abstract: A single-barometer device, a method for fall detection and a system are provided. The single-barometer device worn on a user is used to measure multiple barometric values continuously by a barometer inside the device. The barometric values are stored in a memory of the single-barometer device. When a current barometric value is produced, the current barometric value is compared with a previous barometric value retrieved from the memory. A barometric difference can be obtained. The barometric difference is then compared with a threshold, and a comparison result is used to determine whether or not a fall event is present. The fall event is confirmed if the barometric difference is larger than the threshold. Further, an acceleration change obtained by an accelerometer inside the single-barometer device can be used to reconfirm the fall event.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 7, 2024
    Inventors: YI-PING CHENG, SHENG-RON CHANG, CHING-CHANG LIN
  • Publication number: 20240060909
    Abstract: A cylindrical shell detection method includes generating a first and a second terahertz transmitting electromagnetic waves; detecting a plurality of first terahertz reflected electromagnetic waves reflected by the first terahertz transmitting electromagnetic wave incident in a plurality of inner interface layers of a cylindrical shell; detecting a plurality of second terahertz reflected electromagnetic waves reflected by the second terahertz transmitting electromagnetic wave incident in a plurality of outer interface layers of a cylindrical shell; measuring a plurality of first characteristic signals according to the first terahertz transmitting electromagnetic waves and the first terahertz reflected electromagnetic waves to determine a plurality of first characteristics of the plurality of inner interface layers; and measuring a plurality of second characteristic signals according to the second terahertz transmitting electromagnetic waves and the plurality of second terahertz reflected electromagnetic waves
    Type: Application
    Filed: November 14, 2022
    Publication date: February 22, 2024
    Applicant: Advanced ACEBIOTEK CO., LTD.
    Inventors: Jyh-Chern Chen, Yi-Ping Lin, Yung-Chou Hsu, Shen-Fu Hsu
  • Patent number: 11749699
    Abstract: A method of fabricating a solid-state image sensor, including steps of forming a second type doped semiconductor layer and a semiconductor material layer sequentially on a first type doped semiconductor substrate to constitute a photoelectric conversion portion, forming a multilayer structure on the semiconductor material layer, wherein a refractive index of the multilayer structure gradually decreases from a bottom layer to a top layer of the multilayer structure and is smaller than a refractive index of the semiconductor material layer, and performing a photolithography process to the multiplayer structure and the photoelectric conversion portion to form multiple micro pillars, wherein the micro pillars protrude from the semiconductor material layer and are isolated by recesses extending into the photoelectric conversion portion.
    Type: Grant
    Filed: July 10, 2022
    Date of Patent: September 5, 2023
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shih-Ping Lee, Yi-Ping Lin, Yu-Ching Liao, Ya-Ting Chen, Hsin-Ying Tung
  • Publication number: 20230059771
    Abstract: An optical measurement system is provided, which includes a light source device, a fiber module, an optical detection device and a processing circuit. The light source device is configured to generate light to illuminate a target tissue area and a reference tissue area of a human body. The fiber module is configured to direct and transmit the light to illuminate the target tissue area and the reference tissue area and receive response beams from the target tissue area and the reference tissue area. The optical detection device is configured to detect the response beams from the target tissue area to obtain the target spectrum signal and detect the response beams from the reference tissue area to obtain a reference spectrum signal. The processing circuit configured to calculate a health status parameter of the target tissue area according to the target spectrum signal and reference spectrum signal.
    Type: Application
    Filed: April 13, 2022
    Publication date: February 23, 2023
    Applicant: Advanced ACEBIOTEK CO., LTD.
    Inventors: Yi-Ping Lin, Jyh-Chern Chen, Shen-Fu Hsu
  • Publication number: 20220344398
    Abstract: A method of fabricating a solid-state image sensor, including steps of forming a second type doped semiconductor layer and a semiconductor material layer sequentially on a first type doped semiconductor substrate to constitute a photoelectric conversion portion, forming a multilayer structure on the semiconductor material layer, wherein a refractive index of the multilayer structure gradually decreases from a bottom layer to a top layer of the multilayer structure and is smaller than a refractive index of the semiconductor material layer, and performing a photolithography process to the multiplayer structure and the photoelectric conversion portion to form multiple micro pillars, wherein the micro pillars protrude from the semiconductor material layer and are isolated by recesses extending into the photoelectric conversion portion.
    Type: Application
    Filed: July 10, 2022
    Publication date: October 27, 2022
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shih-Ping Lee, Yi-Ping Lin, Yu-Ching Liao, Ya-Ting Chen, Hsin-Ying Tung
  • Patent number: 11467085
    Abstract: A solid dosage component detection method for a solid dosage component measurement device comprises generating a transmitting electromagnetic wave with a terahertz frequency and emitting to a solid dosage component; detecting a receiving electromagnetic wave with a terahertz frequency through the solid dosage component; comparing the transmitting electromagnetic wave incident on the solid dosage component with the receiving electromagnetic wave received from the solid dosage component to detect a plurality of signal characteristics differences between the transmitting and receiving electromagnetic waves; and discriminating polymorphism of a testing pharmaceutical in the solid dosage component, calculating a concentration of the testing pharmaceutical in the solid dosage component, and analyzing a coating layer thickness and a porosity of the solid dosage component based on the plurality of signal characteristics differences.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: October 11, 2022
    Assignee: Advanced ACEBIOTEK CO., LTD.
    Inventors: Jyh-Chern Chen, Yi-Ping Lin, Cho-Yen Tsai, Shen-Fu Hsu
  • Patent number: 11424280
    Abstract: A solid-state image sensor with pixels each including a photoelectric conversion portion made of a second type doped semiconductor layer and a semiconductor material layer, and the second type doped semiconductor layer contacts a first type doped semiconductor substrate. An anti-reflective portion is provided with multiple micro pillars on the semiconductor material layer, wherein micro pillars are isolated by recesses extending into the photoelectric conversion portion, and the refractive index of the micro pillar gradually decreases from bottom to top and is smaller than the refractive index of the light-receiving portion of the semiconductor material layer.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: August 23, 2022
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shih-Ping Lee, Yi-Ping Lin, Yu-Ching Liao, Ya-Ting Chen, Hsin-Ying Tung
  • Publication number: 20220107267
    Abstract: A solid dosage component detection method for a solid dosage component measurement device comprises generating a transmitting electromagnetic wave with a terahertz frequency and emitting to a solid dosage component; detecting a receiving electromagnetic wave with a terahertz frequency through the solid dosage component; comparing the transmitting electromagnetic wave incident on the solid dosage component with the receiving electromagnetic wave received from the solid dosage component to detect a plurality of signal characteristics differences between the transmitting and receiving electromagnetic waves; and discriminating polymorphism of a testing pharmaceutical in the solid dosage component, calculating a concentration of the testing pharmaceutical in the solid dosage component, and analyzing a coating layer thickness and a porosity of the solid dosage component based on the plurality of signal characteristics differences.
    Type: Application
    Filed: April 7, 2021
    Publication date: April 7, 2022
    Inventors: Jyh-Chern Chen, Yi-Ping Lin, Cho-Yen Tsai, Shen-Fu Hsu
  • Publication number: 20210288094
    Abstract: A solid-state image sensor with pixels each including a photoelectric conversion portion made of a second type doped semiconductor layer and a semiconductor material layer, and the second type doped semiconductor layer contacts a first type doped semiconductor substrate. An anti-reflective portion is provided with multiple micro pillars on the semiconductor material layer, wherein micro pillars are isolated by recesses extending into the photoelectric conversion portion, and the refractive index of the micro pillar gradually decreases from bottom to top and is smaller than the refractive index of the light-receiving portion of the semiconductor material layer.
    Type: Application
    Filed: April 9, 2020
    Publication date: September 16, 2021
    Inventors: Shih-Ping Lee, Yi-Ping Lin, Yu-Ching Liao, Ya-Ting Chen, Hsin-Ying Tung
  • Patent number: 10671139
    Abstract: The present disclosure provides a system and method for providing a basic power to a system in an event that a standby power of power supply units (PSUs) of the system fails. The system comprises a plurality of active components, one or more PSUs, and a power switch. The power switch is connected to a standby power output and a main power output of the PSUs. The power switch can receive status information of the PSUs and determine whether the main power of the PSUs is within a predetermined range. In an event that the standby power of the PSUs fails and the main power of the PSUs is within the predetermined range, the power switch can switch an input power from the standby power to the main power of the PSUs and output a basic power for system use.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: June 2, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Jen-Hsuen Huang, Fa-Da Lin, Yi-Ping Lin
  • Patent number: 10664030
    Abstract: A system and method to dynamically balance power to a multi-node system is disclosed. A chassis management controller is operable to regulate the power from a power source to each of the nodes. The chassis management controller determines a setting power for each nodes and a real power consumed by each node. The chassis management controller determines a next setting power for each node based on the real power and unused total power and total additional balance power for the plurality of nodes. The chassis management controller commands each node to regulate the power consumption of the node up to the setting power value.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: May 26, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Jen-Hsuen Huang, Fa-Da Lin, Yi-Ping Lin
  • Patent number: 10592462
    Abstract: A computing device configured to detect proper cable assembly to improve assembly and problem diagnosis is provided. The computing device includes a motherboard, a function board, and a middle plane connecting the motherboard and function board. The motherboard includes a baseboard management controller (BMC). The BMC is connected to I2C buses. The function board includes integrated circuits. The middle plane includes cable connections interconnecting the I2C buses that are connected to the BMC and the integrated circuits. The integrated circuits have unique system addresses that are identifiable by the BMC.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: March 17, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Jen-Hsuen Huang, Fa-Da Lin, Yi-Ping Lin
  • Publication number: 20200066177
    Abstract: A multi-view display device includes a display screen component and an optical structure component. The display screen component includes a plurality of pixels, and each of the plurality of pixels includes a left sub-pixel and a right sub-pixel. The optical structure component is disposed at the display screen component. When light beams from the left sub-pixel and light beams from the right sub-pixel of the each of the plurality of pixels pass through the optical structure component, the optical structure component separates the light beams from the left sub-pixel and the light beams from the right sub-pixel so as to generate correspondingly a left image and a right image to reach the first pilot position and the second pilot position, respectively. In addition, a manipulation simulation device is also provided.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 27, 2020
    Inventors: JUNG-YU LI, SHIH-PU CHEN, YI-PING LIN, HONG-HUI HSU, MEI-TAN WANG
  • Publication number: 20190384740
    Abstract: A computing device configured to detect proper cable assembly to improve assembly and problem diagnosis is provided. The computing device includes a motherboard, a function board, and a middle plane connecting the motherboard and function board. The motherboard includes a baseboard management controller (BMC). The BMC is connected to I2C buses. The function board includes integrated circuits. The middle plane includes cable connections interconnecting the I2C buses that are connected to the BMC and the integrated circuits. The integrated circuits have unique system addresses that are identifiable by the BMC.
    Type: Application
    Filed: June 19, 2018
    Publication date: December 19, 2019
    Inventors: Jen-Hsuen HUANG, Fa-Da LIN, Yi-Ping LIN
  • Patent number: 10236181
    Abstract: A manufacturing system and a method for forming a clean interface between a functional layer and a 2D layered semiconductor are provided herein. In the steps of the method, the substrate equipped with the 2D layered semiconductor is exposed to a reaction gas, and a stimulus is applied to the reaction gas to generate active particles having higher selectivity toward contaminants on the exposed surface of the 2D layered semiconductor so that the contaminants can be decomposed and removed. Additionally, the contaminants can be removed without damage to the 2D layered semiconductor. A functional layer is in-situ deposited to be in contact with the 2D layered semiconductor. Without the contaminants, a clean interface between the functional layer and the 2D layered semiconductor can be obtained and the 2D layered semiconductor can exhibit better electrical properties.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: March 19, 2019
    Assignee: BEST CHAMPION TECHNOLOGY CO., LTD.
    Inventors: Chiu-Chuan Liao, Yi-Ping Lin, Chao-Hui Yeh
  • Publication number: 20190043720
    Abstract: A manufacturing system and a method for forming a clean interface between a functional layer and a 2D layered semiconductor are provided herein. In the steps of the method, the substrate equipped with the 2D layered semiconductor is exposed to a reaction gas, and a stimulus is applied to the reaction gas to generate active particles having higher selectivity toward contaminants on the exposed surface of the 2D layered semiconductor so that the contaminants can be decomposed and removed. Additionally, the contaminants can be removed without damage to the 2D layered semiconductor. A functional layer is in-situ deposited to be in contact with the 2D layered semiconductor. Without the contaminants, a clean interface between the functional layer and the 2D layered semiconductor can be obtained and the 2D layered semiconductor can exhibit better electrical properties.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 7, 2019
    Inventors: CHIU-CHUAN LIAO, YI-PING LIN, CHAO-HUI YEH
  • Publication number: 20190006437
    Abstract: A light emitting device is disclosed and defined with a plurality of light emitting regions. The light emitting device includes a first electrode layer, a second electrode layer, an organic material layer, and an insulating material layer formed between the first and second electrode layers. The light emitting regions are exposed from the insulating material layer, and have different areas. Regions of the first electrode layer corresponding in position to the light emitting regions have the same areas, or regions of the organic material layer corresponding in position to the light emitting regions have the same areas. Voltages applied across the first electrode layer and the second electrode layer corresponding in position to the light emitting regions are the same. The light emitting device displays grayscale or color images.
    Type: Application
    Filed: January 5, 2018
    Publication date: January 3, 2019
    Inventors: Yi-Ping Lin, Jung-Yu Li, Guan-Yu Chen, Shih-Pu Chen
  • Patent number: D998763
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: September 12, 2023
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi Ping Lin, Chun Hung Li