Patents by Inventor Yi Qi ZHANG

Yi Qi ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board and smart card module and smart card utilizing the same
    Patent number: 10032708
    Abstract: A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component, and comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the pads has an arc edge. In the present invention, the distance between the pads is easy to be controlled during fabrication, and the stability of the adhesion between the chip and pad region is enhanced.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: July 24, 2018
    Assignee: Johnson Electric S.A.
    Inventors: Dominic John Ward, Rong Zhang, Yi Qi Zhang
  • Circuit board and smart card module and smart card utilizing the same
    Patent number: 10014249
    Abstract: A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component. The pad region comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the traces comprises an extension which extends along a perimeter of the pad region. The present invention provides a reliable adhesion between the chip and pad region.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: July 3, 2018
    Assignee: Johnson Electric S.A.
    Inventors: Dominic John Ward, Rong Zhang, Yi Qi Zhang
  • Circuit Board and Smart Card Module and Smart Card Utilizing the Same
    Publication number: 20170221807
    Abstract: A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component. The pad region comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the traces comprises an extension which extends along a perimeter of the pad region. The present invention provides a reliable adhesion between the chip and pad region.
    Type: Application
    Filed: February 2, 2017
    Publication date: August 3, 2017
    Inventors: Dominic John Ward, Rong ZHANG, Yi Qi ZHANG
  • Circuit Board and Smart Card Module and Smart Card Utilizing the Same
    Publication number: 20170221806
    Abstract: A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component, and comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the pads has an arc edge. In the present invention, the distance between the pads is easy to be controlled during fabrication, and the stability of the adhesion between the chip and pad region is enhanced.
    Type: Application
    Filed: February 2, 2017
    Publication date: August 3, 2017
    Inventors: Dominic John Ward, Rong ZHANG, Yi Qi ZHANG