Patents by Inventor Yiqin HUANG

Yiqin HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411179
    Abstract: The present disclosure generally relates to ensuring a plasma plume or cloud that forms during a laser cutting process does not lead to undesired re-deposition of material onto the substrate. At least one electrode is biased to draw the electrons of the plasma plume or cloud towards the electrode and away from the substrate. A vacuum port and/or a blower may be strategically located to ensure proper gas flow away from the substrate and hence, directing of the electrons away from the substrate. In so doing, material re-deposition is less likely to occur.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 21, 2023
    Applicant: Western Digital Technologies, Inc.
    Inventors: Cong ZHANG, Hope CHIU, Yiqin HUANG, Guocheng ZHONG, Weiting JIANG, Dongpeng XUE