Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.

Abstract: A touch pad comprises a capacitive sensor for sensing a manipulation gesture; a light guiding plate arranged on the capacitive sensor; an identification layer having a pattern disposed on the light guiding plate; a filter layer disposed on the identification layer, the filter layer having a first filter region and a second filter region, wherein the first filter region and the second filter region do not overlap; and a light emitting module having a light emitting surface, wherein the light emitting module is disposed at the periphery of the light guiding plate; wherein the light emitting surface provides light to the light guiding plate; the light passes through the first filter region to be a first shade, and the light passes through the second filter region to be a second shade; the color of the first shade is different from the color of the second shade.

Abstract: The present disclosure provides an illumination structure and a light distributing method. The illumination structure includes a substrate, a first light emitting element, a second light emitting element, a reflection housing and a hooding board. The reflection housing has a first focal point and a second focal point. The first light emitting element is disposed on the substrate and located at the first focal point of the reflection housing. The second focal point is positioned within the hooding board. Therefore, a portion of light emitted by the first light emitting element will be reflected by the reflection housing and pass through a hollow portion of the hooding board to generate low beam light.

Abstract: A touch pad comprises a capacitive sensor for sensing a manipulation gesture; a light guiding plate arranged on the capacitive sensor; an identification layer having a pattern disposed on the light guiding plate; a filter layer disposed on the identification layer, the filter layer having a first filter region and a second filter region, wherein the first filter region and the second filter region do not overlap; and a light emitting module having a light emitting surface, wherein the light emitting module is disposed at the periphery of the light guiding plate; wherein the light emitting surface provides light to the light guiding plate; the light passes through the first filter region to be a first shade, and the light passes through the second filter region to be a second shade; the color of the first shade is different from the color of the second shade.

Abstract: The present disclosure provides an illumination structure and a light distributing method. The illumination structure includes a substrate, a first light emitting element, a second light emitting element, a reflection housing and a hooding board. The reflection housing has a first focal point and a second focal point. The first light emitting element is disposed on the substrate and located at the first focal point of the reflection housing. The second focal point is positioned within the hooding board. Therefore, a portion of light emitted by the first light emitting element will be reflected by the reflection housing and pass through a hollow portion of the hooding board to generate low beam light.

Abstract: The instant disclosure relates to a method for manufacturing high-strength structural stacked capacitor. The novel feature of the instant disclosure is forming a part of upper electrode layer to cover the first/outer surface of each of the lower electrode layers before removing the sacrificial layer, and forming another part of upper electrode layer to cover the second/inner surface of each of the lower electrode layers after removing the sacrificial layer. Hence, the structure strength of the lower electrode layer in all process steps has been improved.

Abstract: The instant disclosure relates to a method for manufacturing high-strength structural stacked capacitor. The novel feature of the instant disclosure is forming a part of upper electrode layer to cover the first/outer surface of each of the lower electrode layers before removing the sacrificial layer, and forming another part of upper electrode layer to cover the second/inner surface of each of the lower electrode layers after removing the sacrificial layer. Hence, the structure strength of the lower electrode layer in all process steps has been improved.