Patents by Inventor Yi-Sheng Wu

Yi-Sheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170709
    Abstract: A motion synchronized multi-tier pallet rack and a battery formation apparatus are provided. The pallet rack includes a fixation rack, two movable frames, and two actuators. The movable frames are coupled to two corresponding sides of the fixation rack and each includes telescopic arms, a motor, and a drive rod. The actuators are disposed on other the two corresponding sides of the fixation rack to drive the movable frames to move toward or away from each other. The telescopic arms are kinematically connected to the motor through the drive rod to extend from or retract into the movable frame. The battery formation apparatus includes a motion synchronized multi-tier pallet rack, a conveyor module, a formation cabinet, and a controller. The conveyor module carries a battery module. The controller controls the pallet rack to obtain the battery module from the conveyor module and place the battery module in the formation cabinet.
    Type: Application
    Filed: September 27, 2023
    Publication date: May 23, 2024
    Applicant: CHROMA ATE INC.
    Inventors: Ming-Cheng Huang, Jiun-Ren Chen, Chao-Cheng Wu, Yi-Sheng Hsu
  • Publication number: 20240162833
    Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
  • Publication number: 20240162308
    Abstract: The present disclosure provides a semiconductor structure with having a source/drain feature with a central cavity, and a source/drain contact feature formed in central cavity of the source/drain region, wherein the source/drain contact feature is nearly wrapped around by the source/drain region. The source/drain contact feature may extend to a lower most of a plurality semiconductor layers.
    Type: Application
    Filed: February 9, 2023
    Publication date: May 16, 2024
    Inventors: Pin Chun SHEN, Che Chia CHANG, Li-Ying WU, Jen-Hsiang LU, Wen-Chiang HONG, Chun-Wing YEUNG, Ta-Chun LIN, Chun-Sheng LIANG, Shih-Hsun CHANG, Chih-Hao CHANG, Yi-Hsien CHEN
  • Publication number: 20240136346
    Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.
    Type: Application
    Filed: April 17, 2023
    Publication date: April 25, 2024
    Inventors: Chien Hung LIU, Yu-Sheng CHEN, Yi Ching ONG, Hsien Jung CHEN, Kuen-Yi CHEN, Kuo-Ching HUANG, Harry-HakLay CHUANG, Wei-Cheng WU, Yu-Jen WANG
  • Publication number: 20240088026
    Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 14, 2024
    Inventors: Yi Ching Ong, Wei-Cheng Wu, Chien Hung Liu, Harry-Haklay Chuang, Yu-Sheng Chen, Yu-Jen Wang, Kuo-Ching Huang
  • Publication number: 20240065765
    Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Inventors: Alvin Chao-Yu CHEN, Yi-Sheng CHAN, Chi-Pin HSU, Shang-Chih LIN, Chin-Ju WU, Jeng-Ywan JENG
  • Publication number: 20220276556
    Abstract: The present disclosure provides a photoresist composition comprising an alkali soluble resin, a photopolymerizable compound, a photoinitiator, a thermal initiator, a black colorant, and a solvent, wherein the photopolymerizable compound contains at least one ethylenically unsaturated monomer and at least one epoxy compound. The present disclosure also provides an optical film and a preparing method of the optical film.
    Type: Application
    Filed: February 25, 2022
    Publication date: September 1, 2022
    Inventors: Hao Lun Huang, Yi Sheng Wu
  • Publication number: 20200019055
    Abstract: A photosensitive composition, a color filter prepared by using the photosensitive composition and a method for preparing the color filter. The photosensitive composition includes an alkali-soluble resin (A); an ethylenically unsaturated monomer (B); a photopolymerization initiator (C); a solvent (D); and a colorant (E), wherein the content of the photopolymerization initiator (C) is from 32 parts by weight to 70 parts by weight based on 100 parts by weight of the ethylenically unsaturated monomer(B).
    Type: Application
    Filed: June 5, 2019
    Publication date: January 16, 2020
    Applicant: eChem Solutions Corp.
    Inventors: Yi-Sheng Wu, Hsin-Chieh Yang, Ping-Sung Tsai
  • Patent number: 10530701
    Abstract: A Reliable User Datagram Protocol (RUDP) apparatus and a dynamic adjustment method of a sliding window parameter of RUDP are provided. The dynamic adjustment method of the sliding window parameter of RUDP includes the following steps. In accordance with whether the acknowledgement from the receiver is overtime, and in accordance with the difference between the sliding window parameter and an estimated maximum value, the transmitter adjusts a step value. The transmitter adjusts the sliding window parameter according to the step value.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: January 7, 2020
    Assignee: Acer Incorporated
    Inventors: Yi-Sheng Wu, Yuan-Hsiu Lee
  • Publication number: 20190075057
    Abstract: A Reliable User Datagram Protocol (RUDP) apparatus and a dynamic adjustment method of a sliding window parameter of RUDP are provided. The dynamic adjustment method of the sliding window parameter of RUDP includes the following steps. In accordance with whether the acknowledgement from the receiver is overtime, and in accordance with the difference between the sliding window parameter and an estimated maximum value, the transmitter adjusts a step value. The transmitter adjusts the sliding window parameter according to the step value.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 7, 2019
    Applicant: Acer Incorporated
    Inventors: Yi-Sheng Wu, Yuan-Hsiu Lee