Abstract: A flexible display includes a flexible substrate that includes an active area, a pad area extending from the active area, and a bend allowance section extending from the pad area. A first buffer layer is disposed on the flexible substrate and includes at least three layers. A first insulation layer is disposed on the first buffer layer in the pad area, a gate line is disposed on the first insulation layer and extends from the active area to the pad area, a second insulation layer is disposed on the gate line in the pad area, a connection line is electrically connected to the gate line, and a second buffer layer covers the connection line. A top layer among the at least three layers of the first buffer layer is disposed in the active area and the pad area, a lower layer which is in contact with the top layer extends to the bend allowance section and a thickness of the lower layer bend allowance section is less than a thickness of the lower layer in the other areas.

Abstract: A flexible display includes a flexible substrate that includes an active area, a pad area extending from the active area, and a bend allowance section extending from the pad area. A first buffer layer is disposed on the flexible substrate and includes at least three layers. A first insulation layer is disposed on the first buffer layer in the pad area, a gate line is disposed on the first insulation layer and extends from the active area to the pad area, a second insulation layer is disposed on the gate line in the pad area, a connection line is electrically connected to the gate line, and a second buffer layer covers the connection line. A top layer among the at least three layers of the first buffer layer is disposed in the active area and the pad area, a lower layer which is in contact with the top layer extends to the bend allowance section and a thickness of the lower layer bend allowance section is less than a thickness of the lower layer in the other areas.

Abstract: A method of manufacturing an organic light emitting display device can include sequentially forming first and second metal films on a substrate, forming a gate electrode, a first storage electrode and a pad in a thin film transistor region, a storage capacitor region and a pad region, respectively, forming a gate insulation film forming a channel layer opposite to the gate electrode, forming an insulation film, forming an etch stopper on the channel layer and first through third contact holes exposing the gate electrode, the first storage electrode and the pad, forming source and drain electrodes, and a second storage electrode on the gate insulation film opposite to the first storage electrode, forming a third storage electrode overlapping the second storage electrode with a passivation film therebetween, forming color filters in respective pixel regions, and forming an organic light emitting diode electrically connected to the third storage electrode.

Abstract: A method of manufacturing an organic light emitting display device can include sequentially forming first and second metal films on a substrate, forming a gate electrode, a first storage electrode and a pad in a thin film transistor region, a storage capacitor region and a pad region, respectively, forming a gate insulation film forming a channel layer opposite to the gate electrode, forming an insulation film, forming an etch stopper on the channel layer and first through third contact holes exposing the gate electrode, the first storage electrode and the pad, forming source and drain electrodes, and a second storage electrode on the gate insulation film opposite to the first storage electrode, forming a third storage electrode overlapping the second storage electrode with a passivation film therebetween, forming color filters in respective pixel regions, and forming an organic light emitting diode electrically connected to the third storage electrode.

Abstract: A method of fabricating an organic light emitting display device is discussed. The method in one example includes: sequentially forming a first metal film and a second metal film on a substrate and performing a mask procedure for the first and second metal films, to form a gate electrode, a first storage electrode and a pad in a thin film transistor region, a storage capacitor region and a pad region; forming a gate insulation film on the substrate provided with the gate electrode; forming a third storage electrode which overlaps the second storage electrode with a passivation film therebetween and is connected to the drain electrode; forming red, green and blue color filters in respective pixel regions of the substrate; and forming an organic light emitting diode on the substrate provided with the color filter.

Abstract: A method of fabricating an organic light emitting display device is discussed. The method in one example includes: sequentially forming a first metal film and a second metal film on a substrate and performing a mask procedure for the first and second metal films, to form a gate electrode, a first storage electrode and a pad in a thin film transistor region, a storage capacitor region and a pad region; forming a gate insulation film on the substrate provided with the gate electrode; forming a third storage electrode which overlaps the second storage electrode with a passivation film therebetween and is connected to the drain electrode; forming red, green and blue color filters in respective pixel regions of the substrate; and forming an organic light emitting diode on the substrate provided with the color filter.