Abstract: Provided is a method and apparatus for preparing a silver compound from metallic silver. The method includes the following steps: (1) arranging at least one electrolytic cell with the metallic silver as an anode and an insoluble electrical conductor as a cathode; (2) feeding an alkaline electrolyte into the at least one electrolytic cell to be in contact with the anode; and (3) starting the electrolytic power supply to conduct electrolysis, such that the metallic silver undergoes a dissolution reaction at the anode and a silver ion resulting from the dissolution reaction reacts with the alkaline electrolyte to produce a solid silver compound and/or a soluble silver complex. This application addresses the major issues of safety, pollution, and cost in the existing production technologies for silver compounds.

Abstract: Provided is a process and apparatus for reducing stannic oxide into metallic tin. The process includes: establishing at least one electrolytic cell; feeding the stannic oxide and an electrolyte solution into the at least one electrolytic cell, such that the stannic oxide directly contacts the cathode or the metallic tin on the cathode; initiating electrolysis, where at the anode, an electrochemical oxidation reaction occurs to dissolve a soluble anode metal or allow evolution of chlorine and/or oxygen at an insoluble anode, and at the cathode, the stannic oxide undergoes an electrochemical reduction reaction to produce the metallic tin; and collecting the metallic tin produced from the electrolysis and/or a solid product and/or a solution product of a tin compound produced from a reaction of the metallic tin with the electrolyte solution.

Abstract: Provided is a method and apparatus for extracting a copper/tin source material from an oxalate of copper and/or tin. The method includes the following steps: (1) approach 1: allowing cupric oxalate and/or stannous oxalate to undergo a chemical reaction with a hypochlorite in a hypochlorite-containing aqueous solution to produce a copper compound-containing and/or tin compound-containing precipitate, which is accompanied by release of carbon dioxide; and/or approach 2: allowing the cupric oxalate and/or the stannous oxalate to undergo a chemical reaction in a solution including an alkaline substance to produce a copper compound-containing and/or tin compound-containing precipitate, where the alkaline substance includes a potassium-containing alkaline substance; and (2) solid-liquid separating to produce a filter residue A and a filtrate B, where the filter residue A is the copper compound-containing and/or tin compound-containing precipitate.

Abstract: Provided are a method for electrolysis-assisted oxidative regeneration of an alkaline copper-ammonia chloride etching working solution, and an apparatus using the same. The method includes the following steps: (1) selecting an electrolytic cell provided with an electrolytic cell separator; (2) with the alkaline copper-ammonia chloride etching working solution as an anode electrolyte, conducting electrolysis in the electrolytic cell, where a reaction of oxidatively regenerating a copper-etching agent occurs in the anode cell zone; and during the electrolysis, an etching working solution circularly flows between the etching machine and the anode cell zone of the electrolytic cell; and (3) during the electrolysis, controlling an oxidation-reduction potential (ORP) potential value of the anode electrolyte at 300 mV or less, and feeding an etching replenisher into the alkaline copper-ammonia chloride etching working solution to participate in the reaction of oxidatively regenerating the copper-etching agent.

Abstract: The present disclosure discloses a process for etching a circuit board with alkaline tetraamminecopper (II) sulfate, including an etching solution for etching the circuit board coated with an etching-resist metal layer, where the etching solution includes tetraamminecopper (II) sulfate, a complexed ammonia supply source, and a formate supply source; and the tetraamminecopper (II) sulfate serves as a copper etching agent to etch the circuit board, and the copper etching agent in the etching solution is regenerated by a copper etching agent-oxidation regeneration reaction supply source to maintain an etching rate. The present disclosure solves the production process problem that an etching solution causes corrosion to an etching-resist silver or tin layer in the prior art.

Abstract: The present disclosure discloses a method for water purification through fresh generation of a flocculant, including the following steps: (1) mixing a water-purifying agent precursor with a liquid, exciting a resulting mixture, and adding an excited mixture to water to be purified; and/or mixing the water-purifying agent precursor directly with the water to be purified, and exciting a resulting mixture, so that the water-purifying agent precursor undergoes a reaction to produce ferric hydroxide and the ferric hydroxide co-settles with suspended matters and/or impurities in the water to be purified, where the exciting includes addition of an oxidizing substance; and (2) subjecting a mixture obtained in step (1) to SLS to obtain purified water. This method can effectively settle suspended matters in water and adsorb some organic impurities without producing acids and salts during fresh generation of hydroxides, ensuring water-drinking health and reducing the adverse effects of recycling of industrial water.

Abstract: The present application relates to one-motor-duel-drive synchronous drive device. The drive device includes: a housing, wherein the housing is hollow, a telescopic mechanism is connected to the housing, the telescopic mechanism includes a screw rod, and one end of the screw rod extends into the housing; a transmission mechanism, wherein the transmission mechanism comprises a first transmission component rotatably connected to an inner wall of the housing, a second transmission component is fixedly connected to the screw rod, and the first transmission component and the second transmission component are staggered gears engaged with each other; a linkage lever provided between the housings, wherein two ends of the linkage lever are connected to the first transmission component, respectively; and a drive mechanism configured to act on the linkage lever to rotate the linkage lever.

Abstract: Disclosed is a method and device for recycling an acidic etching waste solution through progressive electrolysis. The method includes: introducing at least one electrolytic cell A, where the electrolytic cell A is divided into an anode chamber and a cathode chamber; during an electrolysis operation, a cathode electrolyte of the electrolytic cell A includes the acidic etching waste solution; and introducing at least one electrolytic cell B, where the electrolytic cell B is divided into an anode chamber and a cathode chamber; the cathode electrolyte of the electrolytic cell B includes a cathode electrolyte undergoing an electrolytic treatment from the electrolytic cell A or a mixed solution of the cathode electrolyte undergoing the electrolytic treatment with the acidic etching waste solution. With the present disclosure, PCB manufacturers can avoid the introduction of new impurities and reduce the electrolysis energy consumption during an electrolytic copper recovery process.

Abstract: The present disclosure discloses a method for recycling of PCB copper chloride etching waste solution through precipitation treatment and an apparatus applicable thereto, including mixing a PCB copper chloride etching waste solution with a pH value adjusting agent for reaction, so that copper salt precipitates in the solution, and at least one of the PCB copper chloride etching waste solution and the pH value adjusting agent contains a PCB copper chloride etching waste solution containing ammonium and/or ammonia; and, subjecting a solid-liquid mixture obtained in step (1) to SLS to obtain filtrate A and filter residue C; and carrying out ammonia nitrogen removal treatment on the filter residue C to generate recovered copper products; and finally, reusing all or part of the filtrate A directly or after composition adjustment to the PCB copper chloride etching system as a regenerated etching replenishment solution and/or an etching oxidant solution.

Abstract: The present invention provided an optimized method for an insoluble anode acid sulfate copper electroplating process, comprising following steps: providing an insoluble anode made of coated titanium in the form of a mesh or a perforated plate; providing at least one liquid outlet pipe/port on the side of the insoluble anode away from the cathode, to generate a liquid flow of an electroplating solution by overflow and/or power driven suction at the liquid outlet pipe/port; initiating an electroplating process by switching on an electroplating power supply, while the electroplating solution flows away due to the overflow and/or power driven suction at the liquid outlet pipe/port, the electroplating solution in the electroplating cell forms a liquid flow towards the liquid outlet pipe/port, and accordingly, adding electroplating solution to the electroplating cell to maintain the liquid volume in the cell until the electroplating process is completed and the electroplated cathode is removed.

Abstract: Provided are a linear driver for electric furniture and electric furniture. The linear driver for electric furniture includes a housing, a worm with one end extending into the housing, a worm wheel disposed in the housing and meshing with the worm, and a lead screw. The lead screw penetrates through the worm wheel and is in threaded connection with the worm wheel. At least one end of the lead screw extends out of the housing. At least one end of the worm wheel is provided with a guide structure. The guide structure is sleeved around the lead screw and is in clearance fit with the lead screw. The guide structure is fixed relative to the worm wheel or the housing.

Abstract: The present application relates to one-motor-duel-drive synchronous drive device. The drive device includes: a housing, wherein the housing is hollow, a telescopic mechanism is connected to the housing, the telescopic mechanism includes a screw rod, and one end of the screw rod extends into the housing; a transmission mechanism, wherein the transmission mechanism comprises a first transmission component rotatably connected to an inner wall of the housing, a second transmission component is fixedly connected to the screw rod, and the first transmission component and the second transmission component are staggered gears engaged with each other; a linkage lever provided between the housings, wherein two ends of the linkage lever are connected to the first transmission component, respectively; and a drive mechanism configured to act on the linkage lever to rotate the linkage lever.

Abstract: A method for electrolytic recycling and regenerating acidic cupric chloride etchants, comprising: (1) employing an acidic cupric chloride etchant that contains iron ions in PCB etching, controlling the oxidation-reduction potential (ORP) of said acidic cupric chloride etchant within the range of 360-700 mV; (2) transferring an etchant waste of step (1) to an electrolysis tank and electrolyzing said etchant waste; (3) the chlorine gas generated by electrolysis oxidizes the electrolyte in the electrolysis tank and thereby dissolved into the electrolyte, in the effect of the ORP of the electrolyte; (4) regenerating an etchant by oxidizing Fe(II) ions and Cu(I) ions in the electrolyte to Fe(III) ions and Cu(II) ions using the chlorine gas of step (3) that is dissolved into the electrolyte, and when the chlorine gas is fully dissolved into the electrolyte, the oxidizing step of the electrolyte is finished and an etchant is regenerated; (5) transferring the etchant regenerated in step (4) to an etching production l

Abstract: A method for electrolytic recycling and regenerating acidic cupric chloride etchants, comprising: (1) employing an acidic cupric chloride etchant that contains iron ions in PCB etching, controlling the oxidation-reduction potential (ORP) of said acidic cupric chloride etchant within the range of 360-700 mV; (2) transferring an etchant waste of step (1) to an electrolysis tank and electrolysing said etchant waste; (3) the chlorine gas generated by electrolysis oxidizes the electrolyte in the electrolysis tank and thereby dissolved into the electrolyte, in the effect of the ORP of the electrolyte; (4) regenerating an etchant by oxidizing Fe(II) ions and Cu(I) ions in the electrolyte to Fe(III) ions and Cu(II) ions using the chlorine gas of step (3) that is dissolved into the electrolyte, and when the chlorine gas is fully dissolved into the electrolyte, the oxidizing step of the electrolyte is finished and an etchant is regenerated; (5) transferring the etchant regenerated in step (4) to an etching production l