Abstract: An electronic device assembly includes one or more discrete electronic components mounted onto a substrate having a 3D, 2.5D, or N×2D geometric classification. The substrate surface includes a specific mounting location to which an electronic component is to be electrically connected, where each specific mounting location includes one or more electrical connection points, such as contact pads. An anisotropic conductive film (ACF) is applied to the substrate surface covering the one or more electrical connection points of the specific mounting location, and the electronic component is placed on the ACF and properly aligned with the specific mounting location on the substrate surface. Pressure and heat are applied to compress the ACF to form an electrical interconnection between corresponding pairs of the electrical connection points on the electronic device and the specific mounting location on the substrate surface.

Abstract: The methods, systems, and devices of the present disclosure are directed to a capacitively coupled label antenna as a component in an antenna system comprising the label antenna, a feed block, an antenna coupler, and a gap between the antenna coupler and the feed block. The label antenna is electrically connected to the antenna coupler, and the antenna coupler is capacitively coupled to the feed block through the gap. By the addition of the gap between the feed block and antenna coupler, the label antenna may be placed on the surface of a container without requiring a wired connection to pass through the container. The feed block may be a small electronic component on a circuit board while the label antenna may be significantly larger thereby providing increased frequency bandwidth and an improved antenna radiation pattern.

Abstract: The methods, systems, and devices of the present disclosure are directed to a capacitively coupled label antenna as a component in an antenna system comprising the label antenna, a feed block, an antenna coupler, and a gap between the antenna coupler and the feed block. The label antenna is electrically connected to the antenna coupler, and the antenna coupler is capacitively coupled to the feed block through the gap. By the addition of the gap between the feed block and antenna coupler, the label antenna may be placed on the surface of a container without requiring a wired connection to pass through the container. The feed block may be a small electronic component on a circuit board while the label antenna may be significantly larger thereby providing increased frequency bandwidth and an improved antenna radiation pattern.

Abstract: An encapsulated circuit board assembly has a circuit board assembly that includes a substrate with a first surface and one or more electronic components mounted to the first surface to form an irregularly contoured front side of the circuit board assembly. A thermoformed sheet encapsulates the irregularly contoured front side of the circuit board assembly. Vacuum forming and pressure forming methods are used to apply a thermoformable sheet to the irregularly contoured front side of the circuit board assembly.

Abstract: A wearable device is provided having electronic components disposed therein. The electronic components maybe further attached to or disposed on a flexible circuit board and comprise inputs, outputs (e.g., LEDs, displays, etc.) and wireless communications. A user may operate the wearable device via an application executing on a secondary device in communication with the wearable device.