Patents by Inventor Yiu C. Ngan

Yiu C. Ngan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5309163
    Abstract: A "packageless" diode chip is integrated into a microstrip patch antenna. Application of DC current to the device results in efficient radiation of high powered microwave frequency signals directly into free space.
    Type: Grant
    Filed: September 12, 1991
    Date of Patent: May 3, 1994
    Assignee: TRW Inc.
    Inventors: Yiu C. Ngan, Wayne W. Lam, Yoshio Saito
  • Patent number: 4259647
    Abstract: A millimeter wave integrated oscillator circuit utilizing an active device uch as an IMPATT or Gunn diode device located in a metallized dielectric cavity which is an extension of a half-height rectangular cross-sectional boron nitride image guide having a metallized under surface solder bonded to a metallic substrate forming an image plane. The diode is energized by means of a bias conductor fed into the cavity through a small slot in the cavity wall. One end of the image guide terminates in the cavity, while the opposite end is tapered along its sides and terminates in a full height hollow metal waveguide section partially including the metallic substrate. The metal waveguide section, moreover, includes flanges for coupling external circuit means to the image guide to metal waveguide transition.
    Type: Grant
    Filed: August 20, 1979
    Date of Patent: March 31, 1981
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Yu-Wen Chang, Yiu C. Ngan