Abstract: A routable electroforming substrate for assembling a semiconductor package is manufactured by providing a carrier and plating a patterned first metallic layer onto the carrier which is configured to function as a surface mount pad or input/output pad in an assembled semiconductor package. A patterned second metallic layer comprising copper is plated over the first metallic layer, and a third metallic layer, which is configured for mounting a plurality of semiconductor dice, is plated over the second metallic layer. The carrier is then removed to expose the first metallic layer.

Abstract: A routable electroforming substrate for assembling a semiconductor package is manufactured by providing a carrier and plating a patterned first metallic layer onto the carrier which is configured to function as a surface mount pad or input/output pad in an assembled semiconductor package. A patterned second metallic layer comprising copper is plated over the first metallic layer, and a third metallic layer, which is configured for mounting a plurality of semiconductor dice, is plated over the second metallic layer. The carrier is then removed to expose the first metallic layer.

Abstract: A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.

Abstract: A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.

Abstract: A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame.

Abstract: A pre-plated lead frame comprises a substrate comprising copper or a copper alloy which has a first side and a second side opposite to the first side. A first plating layer comprising nickel is plated on the first and second sides of the substrate and a second plating layer comprising palladium is plated onto the first plating layer on the first and second sides of the substrate. A third plating layer comprising gold is then plated onto the second plating layer on the second side of the substrate, the third plating layer on the second side of the substrate having a thickness of more than 3 nm. On the first side of the substrate, there is either no gold plated onto the second plating layer, or a third plating layer comprising gold plated onto the second plating layer which has a thickness of 1.5 nm or less.

Abstract: A method is provided for treating a leadframe comprising copper or copper alloy to enhance adhesion of molding compound to it. The leadframe is oxidized in an oxidation treatment bath to form copper oxide on the surface of the leadframe. It is then dipped in a complexing or chelating agent to enhance the purity of the copper oxide formed. Thereafter, the leadframe is cleaned with an acid to remove any contaminants remaining on the leadframe.

Abstract: Method of manufacturing a lead frame wherein a bare lead frame material is immersed in a salt solution. Gas bubbles are provided in the salt solution next to the bare lead frame material such that the bubbles contact a surface of the lead frame material and pop in proximity to the bare lead frame material causing chemical reactions on the surface of the lead frame, thereby forming a plurality of dimples of irregular sizes on the surface of the lead frame.

Abstract: A process for producing a pre-plated leadframe that has enhanced adhesion by molding compound is provided, wherein a base leadframe material is first plated with multiple layers of metallic material. Thereafter, the plated base leadframe material is covered with a mask, so as to expose selected surfaces thereof at unmasked areas where enhanced adhesion of molding compound is desired. The said unmasked areas are plated with a layer of copper before removing the mask. Optionally, the layer of copper may further be oxidized to form a layer of specially controlled copper oxide.

Abstract: A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

Abstract: A process for producing a pre-plated leadframe that has enhanced adhesion by molding compound is provided, wherein a base leadframe material is first plated with multiple layers of metallic material. Thereafter, the plated base leadframe material is covered with a mask, so as to expose selected surfaces thereof at unmasked areas where enhanced adhesion of molding compound is desired. The said unmasked areas are plated with a layer of copper before removing the mask. Optionally, the layer of copper may further be oxidized to form a layer of specially controlled copper oxide.

Abstract: A method is provided for treating a leadframe comprising copper or copper alloy to enhance adhesion of molding compound to it. The leadframe is oxidized in an oxidation treatment bath to form copper oxide on the surface of the leadframe. It is then dipped in a complexing or chelating agent to enhance the purity of the copper oxide formed. Thereafter, the leadframe is cleaned with an acid to remove any contaminants remaining on the leadframe.

Abstract: A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.

Abstract: A leadframe having a metallic substrate and comprising layers of plated material, and a method of manufacturing said leadframe are provided. The substrate is plated with a layer of oxidizable material comprising nickel and a noble metal is selectively plated on the layer of oxidizable material. Thereafter, an exposed portion of the oxidizable material that is not plated with the noble metal is passivated to enhance adhesion of an encapsulation compound molded to the leadframe.