Patents by Inventor Yiu Keung Fung

Yiu Keung Fung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6935894
    Abstract: An electric device comprises a housing (1) with at least two housing parts (2, 3) and a seam (4) between the first two housing parts (2, 3) and an electric circuit (5, 6, 8) inside the housing (1). The housing (1) also comprises at least one molded, third housing part (10) sealing the seam (4). The third housing part (10) covers at least a surface portion (11, 12) of at least one of the first two housing parts (2, 3), adjacent the seam (4), thus compensating manufacturing tolerances between surfaces on opposite sides of the seam (4). A method of manufacturing a particular embodiment of the proposed device is also described.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: August 30, 2005
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Yiu Keung Fung
  • Patent number: 6632098
    Abstract: An electrical plug, for example an AC adaptor, has a pair of pins that may be moved between an operative position and a non-operative position in which the pins are received within slots formed in a body. When in the non-operative position the pins are completely received within the slots and a mechanism is provided for releasing the pins from the slots when it is desired to move the pins into their operative position. The pins pivot about a pivot axis located adjacent an edge of the body so that the pins pivot outwardly towards the edge into their operative position.
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: October 14, 2003
    Assignee: PI Electronics (HK) Ltd.
    Inventors: Wai Lun Wong, Yiu Keung Fung
  • Publication number: 20030119359
    Abstract: An electric device comprises a housing (1) with at least two housing parts (2, 3) and a seam (4) between the first two housing parts (2, 3) and an electric circuit (5, 6, 8) inside the housing (1). The housing (1) also comprises at least one molded, third housing part (10) sealing the seam (4). The third housing part (10) covers at least a surface portion (11, 12) of at least one of the first two housing parts (2, 3), adjacent the seam (4), thus compensating manufacturing tolerances between surfaces on opposite sides of the seam (4). A method of manufacturing a particular embodiment of the proposed device is also described.
    Type: Application
    Filed: December 19, 2002
    Publication date: June 26, 2003
    Inventor: Yiu Keung Fung