Abstract: An electrooptic device and method for making the same, including one or more of substrate, a buffer layer, a charge dissipation layer, and electrodes are disclosed. Active ions, such as F− ions, are implanted the buffer layer. The active ions react with positive ions, such as Li+ from the substrate to form stable compounds such as LiF. The reduced number of mobile Li+ ions reduces the DC drift of the associated electrooptic device. The profile of the implanted ions may be adjusted to control and/or optimize the properties of the electrooptic device. Fluorine is particularly advantageous because it also lowers the dielectric constant, thereby facilitating higher frequency operation.

Abstract: An electrooptic device and method for making the same, including one or more of substrate, a buffer layer, a charge dissipation layer, and electrodes. An F− containing active trapping layer is deposited at the substrate/buffer interface, within the buffer layer, and/or on top of the buffer layer. The active F− ions in the F− containing active trapping layer react with positive ions, such as Li+ from the substrate to form stable compounds such as LiF. Porous material such as carbon nanotubes may be used in place of or in addition to the F− containing active trapping layer. The reduced number of Li+ ions reduces the DC drift of the associated electrooptic device. The profile of the implanted ions may be adjusted to control and/or optimize the properties of the electrooptic device. Fluorine is particularly advantageous because it also lowers the dielectric constant thereby facilitating higher frequency operation.

Abstract: The invention is an optical waveguide device and method of fabrication, where the device includes a pyroelectric substrate such as lithium niobate, a waveguide formed in the substrate, a buffer layer formed over the substrate, and at least one electrode formed over the buffer layer. The device further includes a dielectric diffusion barrier layer formed between the substrate and the buffer layer. The dielectric material is preferably a fluorine-doped nitride or a deuterated nitride.

Abstract: An improved method and composition for achieving a kinetically-controlled solder bond is disclosed having particular application to the fabrication of hybrid integrated circuits and optical subassemblies. The method involves the use of a solder layer, a quenching layer, and a control layer disposed between the solder layer and quenching layer, in which the control layer is advantageously comprised of a thin film of platinum. Additionally, a barrier layer, also preferably comprised of a thin film of platinum, is disposed between the solder layer and the parts to be bonded to prevent the oxidation of solder materials during the soldering process or later storage of the soldered parts.

Abstract: A laser device is bonded to a diamond submount by means of a procedure including (1) codepositing an auxiliary layer, on a layer of barrier metal that has been deposited overlying the submount, followed by (2) depositing a wetting layer on the auxiliary layer, and (3) by depositing a solder layer comprising alternating metallic layers, preferably of gold and tin sufficient to form an overall tin-rich gold-tin eutectic composition. The barrier metal is typically W, Mo, Cr, or Ru. Prior to bonding, a conventional metallization such as Ti-Pt-Au (three layers) is deposited on the laser device's bottom ohmic contact, typically comprising Ge. Then, during bonding, the solder layer is brought into physical contact with the laser device's metallization under enough heat and pressure, followed by cooling, to form a permanent joint between them. The thickness of the solder layer is advantageously less than approximately 5 .mu.m. The wetting layer is preferably the intermetallic compound Ni.sub.3 Sn.sub.

Abstract: A device such as a laser is bonded to a submount such as diamond by a process in which the submount is successively coated with an adhesion layer such as titanium, a barrier layer such as nickel, and a gold-tin solder-metallization composite layer formed by sequential deposition on the barrier layer a number (preferably greater than seven) of multiple alternating layers of gold and tin, the last layer being gold having a thickness that is equal to approximately one-half or less than the thickness of the (next-to-last) tin layer that it contacts immediately beneath it. The bonding is performed under applied heat that is sufficient to melt the solder-metallization composite layer. Prior to the bonding, (in addition to the submount) the device advantageously is coated with gold and optionally with a similar gold-tin solder-metallization composite layer, at least at locations where it comes in contact with the gold-tin solder-metallization composite layer.

Abstract: Alignment of each of a plurality of depending first conductive members (16), in an array of orthogonal rows and columns on an article (12), with a corresponding second conductive member (18) arranged in a like array on a substrate (14), is accomplished by positioning the article in spaced relationship from the substrate. The arrays of first and second conductive members (16,18) are first angularly aligned by rotating the article (12) so that the offset between a first column of first and second conductive members on the article and substrate, respectively, as seen by a television camera (32) at a first end of the article and substrate is the same as the offset between a second column of first and second members on the article and substrate, respectively, at the other end thereof as seen by a second camera (30).

Abstract: Alignment of each of a plurality of depending first conductive members (16), in an array of orthogonal rows and columns on an article (12), with a corresponding second conductive member (18) arranged in a like array on a substrate (14), is accomplished by positioning the article in spaced relationship from the substrate. The arrays of first and second conductive members (16,18) are first angularly aligned by rotating the article (12) so that the offset between a first column of first and second conductive members on the article and substrate, respectively, as seen by a television camera (32) at a first end of the article and substrate is the same as the offset between a second column of first and second members on the article and substrate, respectively, at the other end thereof as seen by a second camera (30).