Patents by Inventor Yiu-Wai Lai
Yiu-Wai Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10084389Abstract: A power module includes a substrate, a first sub-module and a second sub-module. Each of the first sub-module and the second sub-module includes a semiconductor switch and a diode. The first sub-module is formed as the high-voltage-side switching element. The second sub-module is formed as the low-voltage-side switching element. The plural electrodes of the high-voltage-side switching element and the plural electrodes of the low-voltage-side switching element are electrically connected with the conducting terminals of the corresponding semiconductor switches and the corresponding diodes. The high-voltage-side switching element is disposed on the substrate and electrically connected with the corresponding conducting parts of the substrate. The low-voltage-side switching element is disposed on the high-voltage-side switching element and electrically connected with the corresponding conducting parts of the substrate through the high-voltage-side switching element.Type: GrantFiled: May 26, 2016Date of Patent: September 25, 2018Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Patent number: 9973104Abstract: A power module includes a substrate, a first sub-module, a second sub-module and a circuit board. The semiconductor switches and the diodes of the first sub-module and the second sub-module are embedded within insulation layers. Consequently, the first sub-module and the second sub-module are formed as a high-voltage-side switching element and a low-voltage-side switching element of a bridge circuit. The first sub-module and the second sub-module are disposed on a first surface of the substrate. An electrode of the first sub-module and some electrodes of the second sub-module are electrically connected with corresponding conducting parts of a circuit board. A heat sink is disposed on a second surface of the substrate.Type: GrantFiled: October 12, 2016Date of Patent: May 15, 2018Assignee: DELTA ELECTRONICS, INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Patent number: 9913380Abstract: An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.Type: GrantFiled: April 18, 2017Date of Patent: March 6, 2018Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Patent number: 9871463Abstract: A power module includes a substrate, a first sub-module and a second sub-module. The substrate includes plural first conducting parts, plural second conducting parts and a third conducting part. The first sub-module is disposed on the substrate, and includes a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected with the corresponding first conducting parts. The third electrode is electrically connected with the third conducting part. The second sub-module is disposed on the substrate, and includes a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode. The fourth electrode and the fifth electrode are electrically connected with the corresponding second conducting parts. The sixth electrode is electrically connected with the third conducting part.Type: GrantFiled: May 26, 2016Date of Patent: January 16, 2018Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Publication number: 20170347458Abstract: An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.Type: ApplicationFiled: April 18, 2017Publication date: November 30, 2017Inventors: Yiu-Wai Lai, Da-Jung Chen
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Patent number: 9735114Abstract: A first insulation layer comprising stacked prepreg layers is provided, and a metallic protective layer is formed on the first insulation layer. A first alignment mark is formed on the first insulation layer, and an accommodation cavity is formed in the first insulation layer according to the first alignment mark. A second alignment mark is formed on the first insulation layer according to the first alignment mark. A carrier plate is attached on the first insulation layer through a thermal release tape layer, and the semiconductor device is temporarily fixed on the thermal release tape layer within the accommodation cavity according to the second alignment mark. A semi-cured second insulation layer is placed over the first insulation layer, and the second insulation layer is laminated and cured. A re-distribution layer is formed on the second insulation layer, and the re-distribution layer is electrically connected with the semiconductor device.Type: GrantFiled: December 27, 2016Date of Patent: August 15, 2017Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTDInventors: Xiaofeng Xu, Beng Beng Lim, Yiu Wai Lai
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Patent number: 9673156Abstract: A package structure includes a first insulation layer, at least one first electronic component, and a first re-distribution layer. The first electronic component is embedded within the first insulation layer, and the first electronic component includes plural first conducting terminals disposed on a bottom surface of the first electronic component. At least part of the bottom surface of the first electronic component is exposed from a bottom surface of the first insulation layer. The first re-distribution layer is formed on the bottom surface of the first insulation layer and contacted with the corresponding first conducting terminals.Type: GrantFiled: February 4, 2016Date of Patent: June 6, 2017Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTDInventors: Yiu-Wai Lai, Da-Jung Chen
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Publication number: 20170110978Abstract: A power module includes a substrate, a first sub-module, a second sub-module and a circuit board. The semiconductor switches and the diodes of the first sub-module and the second sub-module are embedded within insulation layers. Consequently, the first sub-module and the second sub-module are formed as a high-voltage-side switching element and a low-voltage-side switching element of a bridge circuit. The first sub-module and the second sub-module are disposed on a first surface of the substrate. An electrode of the first sub-module and some electrodes of the second sub-module are electrically connected with corresponding conducting parts of a circuit board. A heat sink is disposed on a second surface of the substrate.Type: ApplicationFiled: October 12, 2016Publication date: April 20, 2017Inventors: Yiu-Wai Lai, Da-Jung Chen
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Publication number: 20160351478Abstract: A power module includes a substrate, a first sub-module and a second sub-module. Each of the first sub-module and the second sub-module includes a semiconductor switch and a diode. The first sub-module is formed as the high-voltage-side switching element. The second sub-module is formed as the low-voltage-side switching element. The plural electrodes of the high-voltage-side switching element and the plural electrodes of the low-voltage-side switching element are electrically connected with the conducting terminals of the corresponding semiconductor switches and the corresponding diodes. The high-voltage-side switching element is disposed on the substrate and electrically connected with the corresponding conducting parts of the substrate. The low-voltage-side switching element is disposed on the high-voltage-side switching element and electrically connected with the corresponding conducting parts of the substrate through the high-voltage-side switching element.Type: ApplicationFiled: May 26, 2016Publication date: December 1, 2016Inventors: Yiu-Wai Lai, Da-Jung Chen
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Publication number: 20160352246Abstract: A power module includes a substrate, a first sub-module and a second sub-module. The substrate includes plural first conducting parts, plural second conducting parts and a third conducting part. The first sub-module is disposed on the substrate, and includes a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected with the corresponding first conducting parts. The third electrode is electrically connected with the third conducting part. The second sub-module is disposed on the substrate, and includes a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode. The fourth electrode and the fifth electrode are electrically connected with the corresponding second conducting parts. The sixth electrode is electrically connected with the third conducting part.Type: ApplicationFiled: May 26, 2016Publication date: December 1, 2016Inventors: Yiu-Wai Lai, Da-Jung Chen
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Publication number: 20160233140Abstract: A package structure includes a first insulation layer, at least one first electronic component, and a first re-distribution layer. The first electronic component is embedded within the first insulation layer, and the first electronic component includes plural first conducting terminals disposed on a bottom surface of the first electronic component. At least part of the bottom surface of the first electronic component is exposed from a bottom surface of the first insulation layer. The first re-distribution layer is formed on the bottom surface of the first insulation layer and contacted with the corresponding first conducting terminals.Type: ApplicationFiled: February 4, 2016Publication date: August 11, 2016Inventors: Yiu-Wai LAI, Da-Jung CHEN
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Patent number: 8553412Abstract: An electronic device includes a case, a latch, and a detachable member. The case has a first surface and a second surface opposite to each other. The latch is movably configured on the first surface back and forth. The latch has a first pushing portion and a second pushing portion. The first and second pushing portions are located at two moving axes parallel to a moving direction of the latch. The detachable member is assembled to the case from the second surface, and a portion of the detachable member protrudes from the first surface and is locked to the latch. When the latch moves back and forth relatively to the case, the first and second pushing portions sequentially push the detachable member, so as to drive the detachable member to move relatively to the case and be disassembled from the case.Type: GrantFiled: June 9, 2011Date of Patent: October 8, 2013Assignee: Inventec CorporationInventor: Yiu-Wai Lai
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Publication number: 20120243150Abstract: An electronic device includes a case, a latch, and a detachable member. The case has a first surface and a second surface opposite to each other. The latch is movably configured on the first surface back and forth. The latch has a first pushing portion and a second pushing portion. The first and second pushing portions are located at two moving axes parallel to a moving direction of the latch. The detachable member is assembled to the case from the second surface, and a portion of the detachable member protrudes from the first surface and is locked to the latch. When the latch moves back and forth relatively to the case, the first and second pushing portions sequentially push the detachable member, so as to drive the detachable member to move relatively to the case and be disassembled from the case.Type: ApplicationFiled: June 9, 2011Publication date: September 27, 2012Applicant: INVENTEC CORPORATIONInventor: Yiu-Wai Lai
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Patent number: 7611113Abstract: A portable electronic device including a secondary body having a touch screen and a primary body having a keyboard is provided. The secondary body slides and rotates relative to the primary body, such that the secondary body selectively makes the touch screen is back towards the primary body and cover the keyboard, so as to provide a first operation mode for operating the touch screen; or the secondary body is inclined relative to the primary body at a certain angle to show the keyboard on the primary body, so as to provide a second operation mode for operating the keyboard. Thus, various operation and accommodation aspects are provided.Type: GrantFiled: January 30, 2007Date of Patent: November 3, 2009Assignee: Inventec CorporationInventor: Yiu-Wai Lai
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Publication number: 20080180892Abstract: A portable electronic device including a secondary body having a touch screen and a primary body having a keyboard is provided. The secondary body slides and rotates relative to the primary body, such that the secondary body selectively makes the touch screen is back towards the primary body and cover the keyboard, so as to provide a first operation mode for operating the touch screen; or the secondary body is inclined relative to the primary body at a certain angle to show the keyboard on the primary body, so as to provide a second operation mode for operating the keyboard. Thus, various operation and accommodation aspects are provided.Type: ApplicationFiled: January 30, 2007Publication date: July 31, 2008Inventor: Yiu-Wai Lai