Patents by Inventor Yiuto D. Ng

Yiuto D. Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5378740
    Abstract: A waterborne structural adhesive bonding primer composition (a) that can be effectively applied to an adherend for structural adhesive applications, (b) that emits a VOC content of less than about 250 grams per liter, (c) is thermally stable, and (d) may be employed with 350.degree. F. (176.7.degree. C.) cure epoxy resin systems, which contains the combination of (i) a dialkanol amine adduct of an oxazolidinone modified polyglycidyl ether of a tris(hydroxyphenyl)alkane dissolved in a water vehicle, and (ii) a rigid ring substituted polyethylenically unsaturated carboxylate, carboxamide or carboximide intimately dispersed in the water vehicle and the dialkanol amine adduct of an oxazolidinone modified polyglycidyl ether of a tris(hydroxyphenyl)alkane. Formulations are described that contain chromate-free corrosion inhibitors.
    Type: Grant
    Filed: April 30, 1992
    Date of Patent: January 3, 1995
    Assignee: The Dexter Corporation
    Inventor: Yiuto D. Ng