Abstract: Some implementations described herein include operating components in a lithography system at variable speeds to reduce, minimize, and/or prevent particle generation due to rubbing of or collision between contact parts of the components. In some implementations, a component in a path of transfer of a semiconductor substrate in the lithography system is operated at a relatively high movement speed through a first portion of an actuation operation, and is operated at a reduced movement speed (e.g., a movement speed that is less than the high movement speed) through a second portion of the actuation operation in which contact parts of the component are to interact. The reduced movement speed reduces the likelihood of particle generation and/or release from the contact parts when the contact parts interact, while the high movement speed provides a high semiconductor substrate throughput in the lithography system.

Abstract: A method for manufacturing a magnet-conductive device includes performing a punch process to a plate by a glue-injectable punch structure, wherein the glue-injectable punch structure includes a punch head and a control member. The punch head comprises an accommodating cavity, an injection hole and an inlet, and a supply channel is formed by the accommodating cavity, the injection hole and the inlet. The control member selectively obstructs the supply channel or permits the supply channel into conduction. By using the method for manufacturing the magnet-conductive device, the stack between plural plates is simplified, and the coupling strength between adjacent plates is enhanced. In addition, this invention considers the gel between adjacent plates to be insulating medium to lower the iron loss of the magnet-conductive plates.

Abstract: A method for manufacturing a magnet-conductive device includes performing a punch process to a plate by a glue-injectable punch structure, wherein the glue-injectable punch structure includes a punch head and a control member. The punch head comprises an accommodating cavity, an injection hole and an inlet, and a supply channel is formed by the accommodating cavity, the injection hole and the inlet. The control member selectively obstructs the supply channel or permits the supply channel into conduction. By using the method for manufacturing the magnet-conductive device, the stack between plural plates is simplified, and the coupling strength between adjacent plates is enhanced. In addition, this invention considers the gel between adjacent plates to be insulating medium to lower the iron loss of the magnet-conductive plates.

Abstract: The present invention relates to a foldable honeycomb structure and method for making the same. The method comprises (a) providing a plurality of flat strips; (b) forming a pair of longitudinal creases in each strip thereby defining the first two longitudinal margins of each strip and a central portion of each strip between the creases; (c) folding each strip along said creases so that each folded strip has two exposed outside surfaces; (d) applying at least three longitudinal glue lines to the exposed outside surface of each folded strip; and (e) stacking the glued strips. As a result, it need not open the longitudinal margins during the process of applying the longitudinal glue lines, which can avoid the deformation of the strip and have a precise gluing position.

Abstract: The present invention relates to a foldable honeycomb structure and method for making the same. The method comprises (a) providing a plurality of flat strips; (b) forming a pair of longitudinal creases in each strip thereby defining the first two longitudinal margins of each strip and a central portion of each strip between the creases; (c) folding each strip along said creases so that each folded strip has two exposed outside surfaces; (d) applying at least three longitudinal glue lines to the exposed outside surface of each folded strip; and (e) stacking the glued strips. As a result, it need not open the longitudinal margins during the process of applying the longitudinal glue lines, which can avoid the deformation of the strip and have a precise gluing position.