Abstract: A component in a semiconductor processing chamber is provided. An electrically conductive semiconductor or metal body has a CTE of less than 10.0×10?6/K. An intermediate layer is disposed over at least one surface of the body, the intermediate layer comprising a fluoropolymer. A perfluoroalkoxy alkane (PFA) layer is disposed over the intermediate layer to form the component.

Abstract: Provided are an oral solid tablet comprising (S)-7-[4-(1-acryloylpiperidine)]-2-(4-phenoxyphenyl)-4,5,6,7-tetrahydropyrazolo[1,5-a]pyrimidine-3-carboxamide and preparation method therefor. The oral solid tablet has good drug release characteristics, features easy administration, quick and high-efficient release, no particular requirements on equipment, and a simple formulation preparation process, can ensure formulation stability and facilitate transportation and storage, and is suitable for large-scale production.

Abstract: Disclosed is a target tracking method and apparatus. The target tracking apparatus includes a processor configured to obtain a first depth feature from a target region image and obtain a second depth feature from a search region image, obtain a global response diagram between the first depth feature and the second depth feature, acquire temporary bounding box information based on the global response diagram, updated the second depth feature based on the temporary bounding box information, obtain local feature blocks based on the first depth feature, obtain a local response diagram based on the local feature blocks and the updated second depth feature, and determine output bounding box information based on the local response diagram.

Abstract: The present invention discloses an oven lid of a large-capacity air oven. The key point of the technical solution of the present invention is that the oven lid of the large-capacity air oven includes a casing, a middle casing is arranged inside the casing, and an inner casing is fixedly connected to the bottom of the middle casing; a DC brushless motor is employed, and due to the fact that the size of the DC brushless motor is small, which allows the space between the inner casing and the middle casing to be compressed, thereby expanding the volume of an inner oven body and making the space of the air oven larger; and in addition, a first recess, a second recess and a third recess are provided, so that structures among the middle casing, the inner casing, an exhaust fan and a circulation fan are more compact.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.