Abstract: Described herein is a pixelated optical device (100) comprising a substrate (102) and a pair of electrodes (104, 106) including a first (104) and a second (106) electrode. The second electrode (106) is mounted to the substrate (102) and includes a two-dimensional array of pixels (108) extending in both a first and second dimension. Device (100) also comprises a solid-state thin film electro-optic material (112) that is disposed between the first and second electrodes (104, 106) and configured to be drivable into a plurality of states in response to an electric field applied to pixels (108) between the first and second electrodes (104, 106). The electric field applied across each pixel (108) is provided by a drive signal provided to the pixel of the second electrode.

Abstract: The invention relates to bioinformatics technology and specifically to an analysis method of a spatial transcriptome-based 4D-printed stem cell scaffold for enhancing diabetic skin injury healing. Spatial transcriptome sequencing is performed on tissues from both the PBS group and the combined treatment group. Cell clustering and annotation identify main cell types, followed by visualization of their spatial distributions in both groups. The proportions of various cell types are statistically quantified and plotted. Cell subsets exhibiting significant differential gene expression are enriched and verified. Using a 4D-printed stem cell scaffold combined with a piRNA inhibitor and stem cell therapy, the method reveals spatial distribution and dynamic cellular changes during wound healing. It identifies precise cellular locations and gene expression patterns within tissues, providing critical insights into the biological processes by which biomaterials promote diabetic injury repair.

Abstract: The present invention belongs to the field of biomedical technology, and specifically relates to a new application for piR-hsa-164586 and MYH9, based on the interaction between piR-hsa-164586 and MYH9: piR-hsa-164586 regulates the expression of MYH9 and promotes the metastasis of NSCLC, piR-hsa-164586 and MYH9 can be used as a therapeutic target for NSCLC, and have become a potential therapeutic drug, wherein the MYH9 is obtained by RNA pulldown assay and verified by protein mass spectrometry, molecular docking and RIP assays, the piR-hsa-164586 can positively regulate the expression of MYH9, and verified by performed qRT-PCR, western blotting and tissue immunofluorescence staining assays on the piR-hsa-164586 NC group, piR-hsa-164586 KD group, and piR-hsa-164586 OE group. The interaction between piR-hsa-164586 and MYH9 can up-regulate the expression of MYH9 in NSCLC cell lines, the verification experiment process was confirmed by Transwell experiment after knockdown of piR-hsa-164586 and MYH9 respectively.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: The present invention discloses an oven lid of a large-capacity air oven. The key point of the technical solution of the present invention is that the oven lid of the large-capacity air oven includes a casing, a middle casing is arranged inside the casing, and an inner casing is fixedly connected to the bottom of the middle casing; a DC brushless motor is employed, and due to the fact that the size of the DC brushless motor is small, which allows the space between the inner casing and the middle casing to be compressed, thereby expanding the volume of an inner oven body and making the space of the air oven larger; and in addition, a first recess, a second recess and a third recess are provided, so that structures among the middle casing, the inner casing, an exhaust fan and a circulation fan are more compact.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

Abstract: An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.

Abstract: An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.