Abstract: One of the main objects of the present invention is to provide a speaker with optimized overall acoustic performance. To achieve the above-mentioned object, the present invention provides a speaker including: a base with an accommodation cavity; a vibration sounding assembly accommodated in the accommodation cavity, including a first diaphragm and a second diaphragm, and a driver fixed to the first diaphragm for driving the first diaphragm and the second diaphragm to vibrate and produce sound. The second diaphragm stacks on the first diaphragm, and a stiffness of the second diaphragm is different from a stiffness of the first diaphragm.

Abstract: Provided are a data processing system and method based on dynamic redundancy heterogeneous encoding, and a device. The method comprises: respectively performing error correction encoding on information to be processed and a processing rule, so as to form encoded information to be processed and an encoded processing rule; processing, by using the encoded processing rule, the encoded information to be processed, so as to obtain response data; and then performing error correction decoding on N pieces of response data, so as to obtain processing result information of the information to be processed.

Abstract: An embodiment of the present disclosure provides an earphone, which includes a housing with a cavity, a first speaker housed in the cavity for producing low-frequency sounds, a second speaker, and a sound damping mesh for producing mid to high frequency sounds. The housing includes a sound outlet penetrating therethrough, and the cavity is connected with the outside through the sound outlet. The second speaker is fixed to the sound damping mesh. The sound damping mesh completely separates the first speaker from the second speaker. The low-frequency sound emitted by the first speaker is to transmitted to the sound outlet through the sound damping mesh. Compared with the related art, the acoustic performance of the earphone of the present disclosure is good.

Abstract: The present invention provides a micro electromechanical system (MEMS), which includes: a base with a cavity, a vibration structure includes a structural layer, a piezoelectric composite layer and a flexible layer; the structural layer includes a structural slab, a structural fixing portion and a plurality of structural springs; the piezoelectric composite layer includes a piezoelectric film, a first electrode layer and a second electrode layer; the stress of the piezoelectric composite layer can be released through the elastic actions of the structural springs. In addition, the rigidity of the overall structure is ensured and will not be too low. Therefore, the sound pressure level of the MEMS piezoelectric loudspeaker is improved, and the THD is reduced to improve the performance of the MEMS piezoelectric loudspeaker.

Abstract: A sound production device includes a substrate having a cavity and a plurality of cantilever diaphragms fixed on the substrate. Each of the plurality of the cantilever diaphragms includes a fixed end fixed on the substrate and a free end extending from the fixed end to a position suspended above the cavity. The free end includes a first surface and a second surface oppositely arranged. The free end and the substrate or other free ends are spaced to form a gap. The sound production device further includes a first dielectric elastomer actuator, a second dielectric elastomer actuator, and a flexible connector. The sound production device of the present disclosures adopts dielectric elastomer actuators on both of the upper and lower sides of the cantilever diaphragms to together act on the cantilever diaphragms, thereby improving the linearity of the sound production device.

Abstract: The present disclosure discloses a MEMS speaker including a housing with a receiving space; a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity; a sound hole communicating with the first cavity or the second cavity; and a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.

Abstract: A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.

Abstract: The invention provides a MEMS speaker including a substrate enclosing a cavity, a cantilever beam at least partially suspended above the cavity, a piezoelectric actuator away from the cavity, a polymer layer away from the cavity and attached to the cantilever beam and the piezoelectric actuator for completely covering the cantilever beam, the piezoelectric actuator and the cavity, and a piezoelectric composite vibration structure formed by the polymer layer. The cantilever beam includes a first section fixed to the substrate, a second section extending from the first section to the cavity and suspended above the cavity, and a third section extending from the second section away from the first section, an end of the third section away from the second section being suspended; and the piezoelectric actuator is only fixed with the third section.

Abstract: The present disclosure discloses a MEMS speaker including a housing with a receiving space; a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity; a sound hole communicating with the first cavity or the second cavity; and a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.

Abstract: The present disclosure discloses a MEMS speaker including a substrate with a cavity and a sounding assembly connected with the substrate, the substrate comprising an outer surface away from the cavity and connected with the sounding assembly, a top surface opposite to the outer surface and a side surface respectively connected with the outer surface and the top surface; a printed circuit board with a through hole and connected with the outer surface of the substrate; a first shell connected with the top surface of the substrate; and a damping mesh covering the through hole and connected with the printed circuit board; wherein sounds emitted by the sounding assembly transmit outward through the through hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.

Abstract: The invention discloses a piezoelectric speaker, including a substrate with a cavity therethrough a supporting structure covering the cavity a first drive structure stacked on the supporting structure, including alternately stacked first electrode layers and first piezoelectric layers a transmission structure stacked on the first drive structure, and a separation slot penetrating the supporting structure and the first drive structure to separate the first drive structure into a first piezoelectric driving part and a second piezoelectric driving part. A rigidity of the transmission structure is less than or equal to a rigidity of the first drive structure, and the rigidity of the first drive structure is less than or equal to a rigidity of the supporting structure. Compared with the prior art, the sound pressure level generated at the same moment is higher.

Abstract: A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.

Abstract: A sound production device includes a substrate having a cavity and a plurality of cantilever diaphragms fixed on the substrate. Each of the plurality of the cantilever diaphragms includes a fixed end fixed on the substrate and a free end extending from the fixed end to a position suspended above the cavity. The free end includes a first surface and a second surface oppositely arranged. The free end and the substrate or other free ends are spaced to form a gap. The sound production device further includes a first dielectric elastomer actuator, a second dielectric elastomer actuator, and a flexible connector. The sound production device of the present disclosures adopts dielectric elastomer actuators on both of the upper and lower sides of the cantilever diaphragms to together act on the cantilever diaphragms, thereby improving the linearity of the sound production device.

Abstract: One of the main objects of the present invention is to provide a speaker with optimized overall acoustic performance. To achieve the above-mentioned object, the present invention provides a speaker including: a base with an accommodation cavity; a vibration sounding assembly accommodated in the accommodation cavity, including a first diaphragm and a second diaphragm, and a driver fixed to the first diaphragm for driving the first diaphragm and the second diaphragm to vibrate and produce sound. The second diaphragm stacks on the first diaphragm, and a stiffness of the second diaphragm is different from a stiffness of the first diaphragm.

Abstract: The present invention provides a MEMS speaker including a substrate sidewall enclosing a cavity. The substrate sidewall includes a first surface and a second surface, a sounding assembly that is arranged on the first surface of the substrate sidewall and also seals the cavity at the opening of the first surface, and a bracket disposed in the cavity. The sounding assembly includes a first sounding assembly and the second sounding assembly. Each sounding assembly includes a driving part and a flexible diaphragm. The flexible diaphragm closes the gap formed between the free ends of adjacent driving parts and between the free ends of the driving parts and the substrate sidewall. The present invention also provides a manufacturing method of MEMS speaker. The MEMS speakers provided by the present invention have high-quality acoustic performance.

Abstract: One of the main objects of the present invention is to provide a MEMS speaker with improved high frequency acoustic performance. To achieve the above-mentioned object, the present invention provides a MEMS speaker including a base with a first cavity and two openings opposite to each other; a substrate covering one of the openings; a diaphragm fixed to the base and covers the other opening; and a MEMS driver. The MEMS driver includes a first support part forming a distance from the diaphragm, a second support part extending from an edge of the first support part toward the diaphragm for supporting the diaphragm, and a piezoelectric member attached to the first support part.

Abstract: One of the main objects of the present invention is to provide a MEMS acoustic sensor with improved acoustic performance and liability. To achieve the above-mentioned objects, the present invention provides a MEMS acoustic sensor, including: a base with a cavity; a number of structural layers fixed on the base, each including a fixed end fixed to the base and a suspension end extending from the fixed end for being suspended above the cavity, the suspension end being spaced from the base for forming a slit; a piezoelectric functional layer on the suspension end; and a flexible connector completely covering the slit; wherein a Young's modulus of the flexible connector is smaller than a Young's modulus of the structural layer.