Abstract: A MEMS loudspeaker manufacturing method and a MEMS loudspeaker are provided. The MEMS loudspeaker manufacturing method includes positioning a printed circuit board (PCB) substrate, inverting a MEMS chip and electrically connecting the PCB substrate to a first side of the PCB substrate having a first groove. filling and solidifying a polymer protection material in the gap between the MEMS chip and the PCB substrate, and combining the MEMS chip and the PCB substrate into a combination component. Since the PCB substrate and the MEMS chip are combined into the combination component through using the polymer protection component made of the polymer protection material, and the polymer protection component is coated with the conducting component, an overall packaging size of the MEMS loudspeaker basically is enabled to be consistent with a size of the MEMS chip, and sensitivity parameters of the MEMS loudspeaker may be significantly improved.

Abstract: A speaker structure includes a base, a diaphragm, a drive part, a first transmission part, and a second transmission part; the drive part including a first drive portion and a second drive portion, the first drive portion extending from the first end towards the second end, at least a segment of the first drive portion being disposed above the cavity, the second drive portion extending from the second end towards the first end, at least a segment of the second drive portion being disposed above the cavity, the segments of the first drive portion and the second drive portion disposed above the cavity being set in a crosswise configuration, the first transmission part being in direct contact with the first drive portion and the diaphragm, respectively, the second transmission part being in direct contact with the second drive portion and the diaphragm, respectively.

Abstract: A speaker module includes a first MEMS speaker and a second MEMS speaker disposed at two opposite surfaces of a circuit board and mounted in a flipped manner; the first MEMS speaker including a first diaphragm structure electrically connected to a first electrode connection point and is controlled by the circuit board to vibrate; the second MEMS speaker including a second diaphragm structure electrically connected to a second electrode connection point and is controlled by the circuit board to vibrate.

Abstract: A characterization protection method for a transfer film of a ring-block friction pair is provided, and relates to the technical field of friction testing. By utilizing a frame-shaped protective tape, the method effectively protects the transfer film on the surface of the friction pair, prevents contamination of the surface by the cutting fluid during the cutting process, and ensures the structural integrity of the transfer film and the analysis of composition and bonding structure of the transfer film. Depending on the test environmental conditions, the thickness and material of the functional layer are adjusted and optimized, thereby effectively maintaining the original state of the region to be analyzed on the ring specimen after the friction test under various test environmental conditions. This ensures more accurate results of subsequent characterization analyses and facilitates a more in-depth analysis of the ring-block friction and wear mechanisms under different working conditions.

Abstract: The present disclosure discloses a MEMS speaker including a substrate with a cavity and a sounding assembly connected with the substrate, the substrate comprising an outer surface away from the cavity and connected with the sounding assembly, a top surface opposite to the outer surface and a side surface respectively connected with the outer surface and the top surface; a printed circuit board with a through hole and connected with the outer surface of the substrate; a first shell connected with the top surface of the substrate; and a damping mesh covering the through hole and connected with the printed circuit board; wherein sounds emitted by the sounding assembly transmit outward through the through hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.

Abstract: An embodiment of the present disclosure provides an earphone, which includes a housing with a cavity, a first speaker housed in the cavity for producing low-frequency sounds, a second speaker for producing mid to high frequency sounds, and a sound damping mesh. The housing includes a sound outlet penetrating therethrough, and the cavity is connected with the outside through the sound outlet. The second speaker is fixed to the sound damping mesh. The sound damping mesh completely separates the first speaker from the second speaker. The low-frequency sound emitted by the first speaker is transmitted to the sound outlet through the sound damping mesh.

Abstract: A Micro-Electro-Mechanical System (MEMS) speaker is provided including only a substrate enclosing a cavity, a piezoelectric diaphragm disposed above the substrate and covering the cavity, and a flexible structure layer covering the piezoelectric diaphragm. Both the piezoelectric diaphragm and the flexible structure layer are complete sheet structures, a young modulus of the flexible structure layer is less than a young modulus of the piezoelectric diaphragm, and the young modulus of the flexible structure layer is in a range of 100 MPa to 50 GPa. The MEMS speaker in the present disclosure does away with a harder structure layer and adopts a softer flexible structure layer, which better enhances the displacement and has a more prominent acoustic performance.

Abstract: The present disclosure provides a preparation method of arsenic iron alloy, which includes the following steps: ball milling arsenic powder and iron powder under the protection of inert atmosphere according to a molar ratio of 0.1˜0.35:1 or 0.35˜2:1 to obtain pretreated material; vacuum hot pressed sintering the pretreated material to obtain arsenic iron alloy. The vacuum hot press sintering process includes: placing the pretreated material in a vacuum environment; and sintering the pretreated material; in the sintering process, a pressure of 30˜50 MPa is applied to the pretreated material. The sintering process includes: heating the pretreated material from room temperature to 400˜500° C., and holding for 0.5˜1 h; and heating the pretreated material from 400˜500° C. to 600˜800° C., and holding for 0.5˜1 h. The present disclosure can obtain arsenic iron alloy with high performance and low leaching toxicity.

Abstract: The present invention provides a MEMS piezoelectric speaker including a substrate with a back cavity, a diaphragm, a capacitive system and a flexible film. The diaphragm includes a fixed end, a suspended end. Adjacent suspended ends are at least partially spaced to form a slit. The suspended end includes a support section and a piezoelectric section. Along the thickness direction of the MEMS piezoelectric speaker, a flexible film is at least partially spaced from the diaphragm and the flexible film is spaced from the substrate. This design can improve the sound pressure level of the MEMS piezoelectric speaker in the middle and high frequency, and improve the acoustic performance of the MEMS piezoelectric speaker.

Abstract: The present invention provides a MEMS piezoelectric speaker including a substrate with a back cavity, a diaphragm, a capacitive system and a flexible film. The diaphragm includes a fixed end, a suspended end. Adjacent suspended ends are at least partially spaced to form a slit. The suspended end includes a support section and a piezoelectric section. Along the thickness direction of the MEMS piezoelectric speaker, a flexible film is at least partially spaced from the diaphragm and the flexible film is spaced from the substrate. This design can improve the sound pressure level of the MEMS piezoelectric speaker in the middle and high frequency, and improve the acoustic performance of the MEMS piezoelectric speaker.

Abstract: The present invention provides a MEMS speaker including a substrate sidewall enclosing a cavity. The substrate sidewall includes a first surface and a second surface, a sounding assembly that is arranged on the first surface of the substrate sidewall and also seals the cavity at the opening of the first surface, and a bracket disposed in the cavity. The sounding assembly includes a first sounding assembly and the second sounding assembly. Each sounding assembly includes a driving part and a flexible diaphragm. The flexible diaphragm closes the gap formed between the free ends of adjacent driving parts and between the free ends of the driving parts and the substrate sidewall. The present invention also provides a manufacturing method of MEMS speaker. The MEMS speakers provided by the present invention have high-quality acoustic performance.

Abstract: The invention provides a MEMS speaker including a substrate enclosing a cavity, a cantilever beam at least partially suspended above the cavity, a piezoelectric actuator away from the cavity, a polymer layer away from the cavity and attached to the cantilever beam and the piezoelectric actuator for completely covering the cantilever beam, the piezoelectric actuator and the cavity, and a piezoelectric composite vibration structure formed by the polymer layer. The cantilever beam includes a first section fixed to the substrate, a second section extending from the first section to the cavity and suspended above the cavity, and a third section extending from the second section away from the first section, an end of the third section away from the second section being suspended; and the piezoelectric actuator is only fixed with the third section.

Abstract: The present disclosure provides a preparation method of arsenic iron alloy, which includes the following steps: ball milling arsenic powder and iron powder under the protection of inert atmosphere according to a molar ratio of 0.1˜0.35:1 or 0.35˜2:1 to obtain pretreated material; vacuum hot pressed sintering the pretreated material to obtain arsenic iron alloy. The vacuum hot press sintering process includes: placing the pretreated material in a vacuum environment; and sintering the pretreated material; in the sintering process, a pressure of 30˜50 MPa is applied to the pretreated material. The sintering process includes: heating the pretreated material from room temperature to 400˜500° C., and holding for 0.5˜1 h; and heating the pretreated material from 400˜500° C. to 600˜800° C., and holding for 0.5˜1 h. The present disclosure can obtain arsenic iron alloy with high performance and low leaching toxicity.

Abstract: A MEMS speaker is provided, including only a substrate enclosing a cavity, a piezoelectric diaphragm disposed above the substrate and covering the cavity, and a flexible structure layer covering the piezoelectric diaphragm. Both the piezoelectric diaphragm and the flexible structure layer are complete sheet structures, a young modulus of the flexible structure layer is less than a young modulus of the piezoelectric diaphragm, and the young modulus of the flexible structure layer is in a range of 100 MPa to 50 GPa. The MEMS speaker in the present disclosure does away with a harder structure layer and adopts a softer flexible structure layer, which better enhances the displacement and has a more prominent acoustic performance.

Abstract: The invention discloses a piezoelectric speaker, including a substrate with a cavity therethrough a supporting structure covering the cavity a first drive structure stacked on the supporting structure, including alternately stacked first electrode layers and first piezoelectric layers a transmission structure stacked on the first drive structure, and a separation slot penetrating the supporting structure and the first drive structure to separate the first drive structure into a first piezoelectric driving part and a second piezoelectric driving part. A rigidity of the transmission structure is less than or equal to a rigidity of the first drive structure, and the rigidity of the first drive structure is less than or equal to a rigidity of the supporting structure. Compared with the prior art, the sound pressure level generated at the same moment is higher.

Abstract: A MEMS loudspeaker manufacturing method and a MEMS loudspeaker are provided. The MEMS loudspeaker manufacturing method includes positioning a printed circuit board (PCB) substrate, inverting a MEMS chip and electrically connecting the PCB substrate to a first side of the PCB substrate having a first groove. filling and solidifying a polymer protection material in the gap between the MEMS chip and the PCB substrate, and combining the MEMS chip and the PCB substrate into a combination component. Since the PCB substrate and the MEMS chip are combined into the combination component through using the polymer protection component made of the polymer protection material, and the polymer protection component is coated with the conducting component, an overall packaging size of the MEMS loudspeaker basically is enabled to be consistent with a size of the MEMS chip, and sensitivity parameters of the MEMS loudspeaker may be significantly improved.

Abstract: One of the main objects of the present invention is to provide a speaker with optimized overall acoustic performance. To achieve the above-mentioned object, the present invention provides a speaker including: a base with an accommodation cavity; a vibration sounding assembly accommodated in the accommodation cavity, including a first diaphragm and a second diaphragm, and a driver fixed to the first diaphragm for driving the first diaphragm and the second diaphragm to vibrate and produce sound. The second diaphragm stacks on the first diaphragm, and a stiffness of the second diaphragm is different from a stiffness of the first diaphragm.

Abstract: An embodiment of the present disclosure provides an earphone, which includes a housing with a cavity, a first speaker housed in the cavity for producing low-frequency sounds, a second speaker, and a sound damping mesh for producing mid to high frequency sounds. The housing includes a sound outlet penetrating therethrough, and the cavity is connected with the outside through the sound outlet. The second speaker is fixed to the sound damping mesh. The sound damping mesh completely separates the first speaker from the second speaker. The low-frequency sound emitted by the first speaker is to transmitted to the sound outlet through the sound damping mesh. Compared with the related art, the acoustic performance of the earphone of the present disclosure is good.

Abstract: The present invention provides a micro electromechanical system (MEMS), which includes: a base with a cavity, a vibration structure includes a structural layer, a piezoelectric composite layer and a flexible layer; the structural layer includes a structural slab, a structural fixing portion and a plurality of structural springs; the piezoelectric composite layer includes a piezoelectric film, a first electrode layer and a second electrode layer; the stress of the piezoelectric composite layer can be released through the elastic actions of the structural springs. In addition, the rigidity of the overall structure is ensured and will not be too low. Therefore, the sound pressure level of the MEMS piezoelectric loudspeaker is improved, and the THD is reduced to improve the performance of the MEMS piezoelectric loudspeaker.

Abstract: A sound production device includes a substrate having a cavity and a plurality of cantilever diaphragms fixed on the substrate. Each of the plurality of the cantilever diaphragms includes a fixed end fixed on the substrate and a free end extending from the fixed end to a position suspended above the cavity. The free end includes a first surface and a second surface oppositely arranged. The free end and the substrate or other free ends are spaced to form a gap. The sound production device further includes a first dielectric elastomer actuator, a second dielectric elastomer actuator, and a flexible connector. The sound production device of the present disclosures adopts dielectric elastomer actuators on both of the upper and lower sides of the cantilever diaphragms to together act on the cantilever diaphragms, thereby improving the linearity of the sound production device.