Abstract: The present invention relates to a system and method for improving glucose sensor accuracy by utilizing multiple calibration methods and selecting the most accurate method depending on a consensus glucose concentration estimate. Embodiments of the present invention comprise the steps of performing at least one in vivo update of surrounding glucose to acquire glucose values; calculating multiple updated calibration estimates using the updated glucose values; calculating an initial consensus glucose estimate from sensor output using each updated calibration estimate; applying a smooth crossover function to the multiple calibration estimates based on the value of the initial consensus glucose estimate; and adding weights to the multiple calibration estimates to acquire a consensus glucose estimate.

Abstract: A package and method for packaging a semiconductor device formed in a surface portion of a semiconductor wafer. The package includes: a dielectric layer disposed on the surface portion of the semiconductor wafer having a device exposing opening to expose one of the devices and an electrical contacts pad opening to expose an electrical contact pad; and a porous material in the device exposing opening over said one of the devices.

Abstract: A compound semiconductor thin film solar cell is provided, which includes a light-absorbing layer made of a compound semiconductor and a buffer layer formed on the light-absorbing layer. The buffer layer is formed with use of an ink containing nanoparticles each containing at least a metal element and an element of Group 16.

Abstract: Embodiments provide a system including a first host computing device that includes a first virtual machine (VM) and a first application. The system also includes a second host computing device including a virtualization software layer, a second VM, and an auto-discovery service at least partially instantiated within the virtualization software layer. The auto-discovery service is configured to receive a message and an auto-discovery packet from a second application executing on the second VM. The auto-discovery service inserts an option into the auto-discovery packet, and transmits the auto-discovery packet to the first application. The option in the auto-discovery packet includes the message received from the second application.

Abstract: A package and method for packaging a semiconductor device formed in a surface portion of a semiconductor wafer. The package includes: a dielectric layer disposed on the surface portion of the semiconductor wafer having a device exposing opening to expose one of the devices and an electrical contacts pad opening to expose an electrical contact pad; and a porous material in the device exposing opening over said one of the devices.

Abstract: One embodiment of the present invention is an antireflection laminated body having a transparent substrate, a lower layer of low refractive index layer including a low refractive index particle, and an upper layer of low refractive index layer without a particle. In addition, in another embodiment of the present invention, the refractive index of the lower layer of low refractive index layer is 1.28-1.42, and the refractive index of the upper layer of low refractive index layer is 1.38-1.46.

Abstract: A method for packaging a plurality of semiconductor devices formed in a surface portion of a semiconductor wafer. The method includes: lithographically forming in a material disposed on the surface portion of the semiconductor wafer device-exposing openings to exposed the devices and electrical contacts pads openings to expose electrical contact pads for devices; mounting a rigid dielectric layer over the formed material, such rigid material being suspended over the device exposing openings in the material and over the electrical contacts pads openings in the material; and forming electrical contact pad openings in portions of the rigid dielectric layer disposed over electrical contact pads of the devices with other portions of the rigid dielectric layer remaining suspended over the device exposing openings in the material.