Patents by Inventor Yixing Lin

Yixing Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10631998
    Abstract: The disclosure claims a lumbar interbody fusion cage for treating lumbar spondylolisthesis via a lateral approach.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: April 28, 2020
    Assignees: The Second Affiliated Hospital of Wenzhou Medical University, Yuying Children's Hospital of Wenzhou Medical University
    Inventors: Aimin Wu, Xiangyang Wang, Yixing Huang, Wenfei Ni, Yan Lin, Zhongke Lin, Hui Xu
  • Patent number: 10583465
    Abstract: The implementations described herein generally relate to 30 nm in-line liquid particle count testing equipment which analyses and cleans semiconductor processing equipment. More specifically, the implementations described relate to a system for diluting, analyzing, and modifying fluids to enable the observation of the contents of the fluids. A dilution sampling tool is coupled with a liquid particle detector for reading the contents of an extraction solution containing particles from semiconductor processing equipment, such as a liner, a shield, a faceplate, or a showerhead, in a cleaning tank. As such, accurate liquid particle readings may be had which reduce oversaturation of the particle detector.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: March 10, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jianqi Wang, William Ming-ye Lu, Yixing Lin, Kevin A. Papke
  • Publication number: 20190264314
    Abstract: Disclosed herein is a poly-crystalline protective coating on a surface of a chamber component. The poly-crystalline protective coating may be deposited by thermal spraying and may comprise cubic yttria and monoclinic yttria. At least one of: (1) the ratio of the cubic yttria to monoclinic yttria, (2) the crystallite size of at least one of the cubic yttria or the monoclinic yttria, (3) the atomic ratio of oxygen (O) to yttria (Y), and/or (4) the dielectric properties of the poly-crystalline protective coating may be controlled to obtain consistent chamber performance when switching coated chamber components within a chamber of interest.
    Type: Application
    Filed: February 12, 2019
    Publication date: August 29, 2019
    Inventors: Ramesh Gopalan, Yixing Lin, Tasnuva Tabassum, Siamak Salimian, Yikai Chen, Kevin Papke
  • Patent number: 10253406
    Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: April 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Laksheswar Kalita, Prerna S. Goradia, Geetika Bajaj, Yogita Pareek, Yixing Lin, Dmitry Lubomirsky, Ankur Kadam, Bipin Thakur, Kevin A. Papke, Kaushik Vaidya
  • Patent number: 10233554
    Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: March 19, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yogita Pareek, Laksheswar Kalita, Geetika Bajaj, Kevin A. Papke, Ankur Kadam, Bipin Thakur, Yixing Lin, Dmitry Lubomirsky, Prerna S. Goradia
  • Publication number: 20170299487
    Abstract: The implementations described herein generally relate to 30 nm in-line liquid particle count testing equipment which analyses and cleans semiconductor processing equipment. More specifically, the implementations described relate to a system for diluting, analyzing, and modifying fluids to enable the observation of the contents of the fluids. A dilution sampling tool is coupled with a liquid particle detector for reading the contents of an extraction solution containing particles from semiconductor processing equipment, such as a liner, a shield, a faceplate, or a showerhead, in a cleaning tank. As such, accurate liquid particle readings may be had which reduce oversaturation of the particle detector.
    Type: Application
    Filed: April 13, 2017
    Publication date: October 19, 2017
    Inventors: Jianqi WANG, William Ming-ye LU, Yixing LIN, Kevin A. PAPKE
  • Publication number: 20170260618
    Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.
    Type: Application
    Filed: March 7, 2017
    Publication date: September 14, 2017
    Inventors: Laksheswar KALITA, Prerna A. GORADIA, Geetika BAJAJ, Yogita PAREEK, Yixing LIN, Dmitry LUBOMIRSKY, Ankur KADAM, Bipin THAKUR, Kevin A. PAPKE, Kaushik VAIDYA
  • Publication number: 20170260639
    Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.
    Type: Application
    Filed: March 7, 2017
    Publication date: September 14, 2017
    Inventors: Yogita PAREEK, Laksheswar KALITA, Geetika BAJAJ, Kevin A. PAPKE, Ankur KADAM, Bipin THAKUR, Yixing LIN, Dmitry LUBOMIRSKY, Prerna A. GORADIA
  • Patent number: 8021743
    Abstract: A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers, the first coating layer comprising a first material having a first thermal expansion coefficient and a first surface having an average surface roughness of less than about 25 micrometers. The second coating layer is over the first surface of the first coating layer, the second coating layer comprising a second material having a second thermal expansion coefficient that differs by less than 5% from the first thermal expansion coefficient of the first material and a second surface having an average surface roughness of at least about 50 micrometers.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: September 20, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Yixing Lin, Daijiang Xu, Clifford Stow
  • Patent number: 7910218
    Abstract: A component of a process chamber is refurbished and cleaned to remove an intermetallic compound from the component. The component has a structure having a coating that includes a first metal layer over the intermetallic compound. To refurbish the component, the first metal layer is removed to form an exposed surface that at least partially includes the intermetallic compound. The exposed surface is bead blasted in a penetrative bead blasting step by propelling blasting beads having a bead diameter of less than about 180 micrometers with a gas that is pressurized to a pressure of less than about 310 kPa (45 psi), towards the exposed surface, thereby removing the intermetallic compound from the exposed surface of the structure to form a cleaned surface. A second metal layer is then formed over the cleaned surface.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: March 22, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
  • Publication number: 20100086805
    Abstract: A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers, the first coating layer comprising a first material having a first thermal expansion coefficient and a first surface having an average surface roughness of less than about 25 micrometers. The second coating layer is over the first surface of the first coating layer, the second coating layer comprising a second material having a second thermal expansion coefficient that differs by less than 5% from the first thermal expansion coefficient of the first material and a second surface having an average surface roughness of at least about 50 micrometers.
    Type: Application
    Filed: August 24, 2009
    Publication date: April 8, 2010
    Applicant: Applied Materials, Inc.
    Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
  • Patent number: 7579067
    Abstract: A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers. The first coating layer is formed over the underlying structure, and has a first surface with an average surface roughness of less than about 25 micrometers. The second coating layer is formed over the first coating layer, and has a second surface with an average surface roughness of at least about 50 micrometers. Process residues can adhere to the surface of the second coating layer to reduce the contamination of processed substrates.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: August 25, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
  • Publication number: 20080213496
    Abstract: Methods of applying specialty ceramic materials to semiconductor processing apparatus, where the specialty ceramic materials are resistant to halogen-comprising plasmas. The specialty ceramic materials contain at least one yttrium oxide-comprising solid solution. Some embodiments of the specialty ceramic materials have been modified to provide a resistivity which reduces the possibility of arcing within a semiconductor processing chamber.
    Type: Application
    Filed: August 2, 2007
    Publication date: September 4, 2008
    Inventors: Jennifer Y. Sun, Shun Jackson Wu, Senh Thach, Ananda Kumar, Robert W. Wu, Hong Wang, Yixing Lin, Clifford C. Stow, Jim Dempster, Li Xu, Kenneth S. Collins, Ren-Guan Duan, Thomas Graves, Xiaoming He, Jie Yuan
  • Patent number: 7055732
    Abstract: We have discovered a method of producing a complex-shaped aluminum alloy article, where welding has been employed to form the article, where an anodized aluminum coating is produced over a surface of the article including the weld joint, and where the anodized aluminum coating is uniform, providing improved performance over that previously known in the art for welded articles exposed to a corrosive plasma environment.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: June 6, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Senh Thach, Jennifer Y. Sun, Shun Jackson Wu, Yixing Lin, Clifford C. Stow
  • Publication number: 20060110620
    Abstract: A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers. The first coating layer is formed over the underlying structure, and has a first surface with an average surface roughness of less than about 25 micrometers. The second coating layer is formed over the first coating layer, and has a second surface with an average surface roughness of at least about 50 micrometers. Process residues can adhere to the surface of the second coating layer to reduce the contamination of processed substrates.
    Type: Application
    Filed: November 24, 2004
    Publication date: May 25, 2006
    Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
  • Patent number: 7048814
    Abstract: We have discovered that the formation of particulate inclusions at the surface of an aluminum alloy article, which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminum oxide protective film can be controlled by maintaining the content of mobile impurities within a specific range and controlling the particulate size and distribution of the mobile impurities and compounds thereof; by heat-treating the aluminum alloy at a temperature less than about 330° C.; and by creating the aluminum oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminum oxide protective film is obtained.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: May 23, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Yixing Lin, Brian T. West, Hong Wang, Shun Jackson Wu, Jennifer Y Sun, Clifford C. Stow, Senh Thach
  • Patent number: 7033447
    Abstract: We have discovered that the formation of particulate inclusions at the surface of an aluminum alloy article, which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminum oxide protective film, can be controlled by maintaining the content of mobile and nonmobile impurities within a specific range and controlling the particulate size and distribution of the mobile and nonmobile impurities and compounds thereof; by heat-treating the aluminum alloy at a temperature less than about 330° C.; and by creating the aluminum oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminum oxide protective film is obtained.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: April 25, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Yixing Lin, Brian T West, Shun Jackson Wu, Clifford C Stow, Senh Thach, Hong Wang, Jennifer Y Sun
  • Publication number: 20050238807
    Abstract: A component of a process chamber is cleaned and refurbished. The component has a structure with an overlying coating having of a first layer. To refurbish the component, the first layer is removed to form an exposed surface on the structure. During or after the removal of the coating, the exposed surface is cleaned with a cleaning fluid, which deposits cleaning residue on the exposed surface. The exposed surface is heated in a substantially non-oxidizing atmosphere to a temperature that is sufficiently high to vaporize the cleaning residue from the surface, thereby forming a cleaned surface. A second layer is formed over the cleaned surface.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 27, 2005
    Inventors: Yixing Lin, Dajiang Xu, Robert Haney, Clifford Stow
  • Publication number: 20050089699
    Abstract: A component of a process chamber is refurbished and cleaned to remove an intermetallic compound from the component. The component has a structure having a coating that includes a first metal layer over the intermetallic compound. To refurbish the component, the first metal layer is removed to form an exposed surface that at least partially includes the intermetallic compound. The exposed surface is bead blasted in a penetrative bead blasting step by propelling blasting beads having a bead diameter of less than about 180 micrometers with a gas that is pressurized to a pressure of less than about 310 kPa (45 psi), towards the exposed surface, thereby removing the intermetallic compound from the exposed surface of the structure to form a cleaned surface. A second metal layer is then formed over the cleaned surface.
    Type: Application
    Filed: October 22, 2003
    Publication date: April 28, 2005
    Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
  • Patent number: 6776873
    Abstract: To further enhance the chamber material performance of anodized aluminum alloy materials against fluorine and oxygen plasma attack, a ceramic-based surface coating, high purity yttrium oxide coating, is provided on the anodized aluminum alloy parts.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: August 17, 2004
    Inventors: Jennifer Y Sun, Shun Jackson Wu, Senh Thach, Ananda H Kumar, Robert W Wu, Hong Wang, Yixing Lin, Clifford C Stow