Patents by Inventor Yixing Lin
Yixing Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11898245Abstract: Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.Type: GrantFiled: February 26, 2021Date of Patent: February 13, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Chien-Min Liao, Chi-Feng Liu, Yi Nung Wu, Hsiu Yang, Yixing Lin, Boon Sen Chan, Siamak Salimian
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Patent number: 11866821Abstract: Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.Type: GrantFiled: March 2, 2020Date of Patent: January 9, 2024Assignee: Applied Materials, Inc.Inventors: Shuran Sheng, Lin Zhang, Jiyong Huang, Joseph C. Werner, Stanley Wu, Mahesh Adinath Kanawade, Yikai Chen, Yixing Lin, Ying Ma
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Publication number: 20220275505Abstract: Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.Type: ApplicationFiled: February 26, 2021Publication date: September 1, 2022Inventors: Chien-Min LIAO, Chi-Feng LIU, Yi Nung WU, Hsiu YANG, Yixing LIN, Boon Sen CHAN, Siamak SALIMIAN
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Patent number: 11047035Abstract: Disclosed herein is a poly-crystalline protective coating on a surface of a chamber component. The poly-crystalline protective coating may be deposited by thermal spraying and may comprise cubic yttria and monoclinic yttria. At least one of: (1) the ratio of the cubic yttria to monoclinic yttria, (2) the crystallite size of at least one of the cubic yttria or the monoclinic yttria, (3) the atomic ratio of oxygen (O) to yttria (Y), and/or (4) the dielectric properties of the poly-crystalline protective coating may be controlled to obtain consistent chamber performance when switching coated chamber components within a chamber of interest.Type: GrantFiled: February 12, 2019Date of Patent: June 29, 2021Assignee: Applied Materials, Inc.Inventors: Ramesh Gopalan, Yixing Lin, Tasnuva Tabassum, Siamak Salimian, Yikai Chen, Kevin Papke
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Publication number: 20200370174Abstract: Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.Type: ApplicationFiled: March 2, 2020Publication date: November 26, 2020Inventors: Shuran SHENG, Lin ZHANG, Jiyong HUANG, Joseph C. WERNER, Stanley WU, Mahesh Adinath KANAWADE, Yikai CHEN, Yixing LIN, Ying MA
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Patent number: 10583465Abstract: The implementations described herein generally relate to 30 nm in-line liquid particle count testing equipment which analyses and cleans semiconductor processing equipment. More specifically, the implementations described relate to a system for diluting, analyzing, and modifying fluids to enable the observation of the contents of the fluids. A dilution sampling tool is coupled with a liquid particle detector for reading the contents of an extraction solution containing particles from semiconductor processing equipment, such as a liner, a shield, a faceplate, or a showerhead, in a cleaning tank. As such, accurate liquid particle readings may be had which reduce oversaturation of the particle detector.Type: GrantFiled: April 13, 2017Date of Patent: March 10, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jianqi Wang, William Ming-ye Lu, Yixing Lin, Kevin A. Papke
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Publication number: 20190264314Abstract: Disclosed herein is a poly-crystalline protective coating on a surface of a chamber component. The poly-crystalline protective coating may be deposited by thermal spraying and may comprise cubic yttria and monoclinic yttria. At least one of: (1) the ratio of the cubic yttria to monoclinic yttria, (2) the crystallite size of at least one of the cubic yttria or the monoclinic yttria, (3) the atomic ratio of oxygen (O) to yttria (Y), and/or (4) the dielectric properties of the poly-crystalline protective coating may be controlled to obtain consistent chamber performance when switching coated chamber components within a chamber of interest.Type: ApplicationFiled: February 12, 2019Publication date: August 29, 2019Inventors: Ramesh Gopalan, Yixing Lin, Tasnuva Tabassum, Siamak Salimian, Yikai Chen, Kevin Papke
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Patent number: 10253406Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.Type: GrantFiled: March 7, 2017Date of Patent: April 9, 2019Assignee: Applied Materials, Inc.Inventors: Laksheswar Kalita, Prerna S. Goradia, Geetika Bajaj, Yogita Pareek, Yixing Lin, Dmitry Lubomirsky, Ankur Kadam, Bipin Thakur, Kevin A. Papke, Kaushik Vaidya
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Patent number: 10233554Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.Type: GrantFiled: March 7, 2017Date of Patent: March 19, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Yogita Pareek, Laksheswar Kalita, Geetika Bajaj, Kevin A. Papke, Ankur Kadam, Bipin Thakur, Yixing Lin, Dmitry Lubomirsky, Prerna S. Goradia
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Publication number: 20170299487Abstract: The implementations described herein generally relate to 30 nm in-line liquid particle count testing equipment which analyses and cleans semiconductor processing equipment. More specifically, the implementations described relate to a system for diluting, analyzing, and modifying fluids to enable the observation of the contents of the fluids. A dilution sampling tool is coupled with a liquid particle detector for reading the contents of an extraction solution containing particles from semiconductor processing equipment, such as a liner, a shield, a faceplate, or a showerhead, in a cleaning tank. As such, accurate liquid particle readings may be had which reduce oversaturation of the particle detector.Type: ApplicationFiled: April 13, 2017Publication date: October 19, 2017Inventors: Jianqi WANG, William Ming-ye LU, Yixing LIN, Kevin A. PAPKE
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Publication number: 20170260639Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.Type: ApplicationFiled: March 7, 2017Publication date: September 14, 2017Inventors: Yogita PAREEK, Laksheswar KALITA, Geetika BAJAJ, Kevin A. PAPKE, Ankur KADAM, Bipin THAKUR, Yixing LIN, Dmitry LUBOMIRSKY, Prerna A. GORADIA
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Publication number: 20170260618Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.Type: ApplicationFiled: March 7, 2017Publication date: September 14, 2017Inventors: Laksheswar KALITA, Prerna A. GORADIA, Geetika BAJAJ, Yogita PAREEK, Yixing LIN, Dmitry LUBOMIRSKY, Ankur KADAM, Bipin THAKUR, Kevin A. PAPKE, Kaushik VAIDYA
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Patent number: 8021743Abstract: A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers, the first coating layer comprising a first material having a first thermal expansion coefficient and a first surface having an average surface roughness of less than about 25 micrometers. The second coating layer is over the first surface of the first coating layer, the second coating layer comprising a second material having a second thermal expansion coefficient that differs by less than 5% from the first thermal expansion coefficient of the first material and a second surface having an average surface roughness of at least about 50 micrometers.Type: GrantFiled: August 24, 2009Date of Patent: September 20, 2011Assignee: Applied Materials, Inc.Inventors: Yixing Lin, Daijiang Xu, Clifford Stow
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Patent number: 7910218Abstract: A component of a process chamber is refurbished and cleaned to remove an intermetallic compound from the component. The component has a structure having a coating that includes a first metal layer over the intermetallic compound. To refurbish the component, the first metal layer is removed to form an exposed surface that at least partially includes the intermetallic compound. The exposed surface is bead blasted in a penetrative bead blasting step by propelling blasting beads having a bead diameter of less than about 180 micrometers with a gas that is pressurized to a pressure of less than about 310 kPa (45 psi), towards the exposed surface, thereby removing the intermetallic compound from the exposed surface of the structure to form a cleaned surface. A second metal layer is then formed over the cleaned surface.Type: GrantFiled: October 22, 2003Date of Patent: March 22, 2011Assignee: Applied Materials, Inc.Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
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Publication number: 20100086805Abstract: A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers, the first coating layer comprising a first material having a first thermal expansion coefficient and a first surface having an average surface roughness of less than about 25 micrometers. The second coating layer is over the first surface of the first coating layer, the second coating layer comprising a second material having a second thermal expansion coefficient that differs by less than 5% from the first thermal expansion coefficient of the first material and a second surface having an average surface roughness of at least about 50 micrometers.Type: ApplicationFiled: August 24, 2009Publication date: April 8, 2010Applicant: Applied Materials, Inc.Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
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Patent number: 7579067Abstract: A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers. The first coating layer is formed over the underlying structure, and has a first surface with an average surface roughness of less than about 25 micrometers. The second coating layer is formed over the first coating layer, and has a second surface with an average surface roughness of at least about 50 micrometers. Process residues can adhere to the surface of the second coating layer to reduce the contamination of processed substrates.Type: GrantFiled: November 24, 2004Date of Patent: August 25, 2009Assignee: Applied Materials, Inc.Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
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Publication number: 20080213496Abstract: Methods of applying specialty ceramic materials to semiconductor processing apparatus, where the specialty ceramic materials are resistant to halogen-comprising plasmas. The specialty ceramic materials contain at least one yttrium oxide-comprising solid solution. Some embodiments of the specialty ceramic materials have been modified to provide a resistivity which reduces the possibility of arcing within a semiconductor processing chamber.Type: ApplicationFiled: August 2, 2007Publication date: September 4, 2008Inventors: Jennifer Y. Sun, Shun Jackson Wu, Senh Thach, Ananda Kumar, Robert W. Wu, Hong Wang, Yixing Lin, Clifford C. Stow, Jim Dempster, Li Xu, Kenneth S. Collins, Ren-Guan Duan, Thomas Graves, Xiaoming He, Jie Yuan
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Patent number: 7055732Abstract: We have discovered a method of producing a complex-shaped aluminum alloy article, where welding has been employed to form the article, where an anodized aluminum coating is produced over a surface of the article including the weld joint, and where the anodized aluminum coating is uniform, providing improved performance over that previously known in the art for welded articles exposed to a corrosive plasma environment.Type: GrantFiled: August 28, 2003Date of Patent: June 6, 2006Assignee: Applied Materials, Inc.Inventors: Senh Thach, Jennifer Y. Sun, Shun Jackson Wu, Yixing Lin, Clifford C. Stow
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Publication number: 20060110620Abstract: A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers. The first coating layer is formed over the underlying structure, and has a first surface with an average surface roughness of less than about 25 micrometers. The second coating layer is formed over the first coating layer, and has a second surface with an average surface roughness of at least about 50 micrometers. Process residues can adhere to the surface of the second coating layer to reduce the contamination of processed substrates.Type: ApplicationFiled: November 24, 2004Publication date: May 25, 2006Inventors: Yixing Lin, Dajiang Xu, Clifford Stow
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Patent number: 7048814Abstract: We have discovered that the formation of particulate inclusions at the surface of an aluminum alloy article, which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminum oxide protective film can be controlled by maintaining the content of mobile impurities within a specific range and controlling the particulate size and distribution of the mobile impurities and compounds thereof; by heat-treating the aluminum alloy at a temperature less than about 330° C.; and by creating the aluminum oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminum oxide protective film is obtained.Type: GrantFiled: February 8, 2002Date of Patent: May 23, 2006Assignee: Applied Materials, Inc.Inventors: Yixing Lin, Brian T. West, Hong Wang, Shun Jackson Wu, Jennifer Y Sun, Clifford C. Stow, Senh Thach