Patents by Inventor Yixuan FENG

Yixuan FENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093571
    Abstract: A wellbore is plugged using a bismuth alloy. In one embodiment, the bismuth alloy comprises an alloy of bismuth and tin. In another embodiment, the bismuth alloy comprises an alloy of bismuth and silver. The wellbore can be arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance. Other aspects are described and claimed.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 21, 2024
    Inventors: Terizhandur S. Ramakrishnan, Quincy K. Elias, Hua Zhang, Youssef Magdy Abdou Mohamed Elkady, Yixuan Feng
  • Patent number: 11739609
    Abstract: A wellbore is plugged using a bismuth alloy. In one embodiment, the bismuth alloy comprises an alloy of bismuth and tin. In another embodiment, the bismuth alloy comprises an alloy of bismuth and silver. The wellbore can be arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance. Other aspects are described and claimed.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: August 29, 2023
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Terizhandur S. Ramakrishnan, Quincy K. Elias, Hua Zhang, Youssef Magdy Abdou Mohamed Elkady, Yixuan Feng
  • Publication number: 20210155841
    Abstract: A wellbore is plugged using a bismuth alloy. In one embodiment, the bismuth alloy comprises an alloy of bismuth and tin. In another embodiment, the bismuth alloy comprises an alloy of bismuth and silver. The wellbore can be arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance. Other aspects are described and claimed.
    Type: Application
    Filed: February 8, 2019
    Publication date: May 27, 2021
    Inventors: Terizhandur S. RAMAKRISHNAN, Quincy K. ELIAS, Hua ZHANG, Youssef Magdy Abdou Mohamed ELKADY, Yixuan FENG