Patents by Inventor Yiyan Peng

Yiyan Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11187636
    Abstract: A method for detecting components of dielectric materials is disclosed. The method includes use of a sensor to obtain at least one of a strain-dielectric coefficient data series at multiple frequencies or a stress-dielectric coefficient data series at multiple frequencies and using a processor to analyze resulting data, when a strain field or a stress field is known. The method also includes use of a sensor to obtain rheo-dielectric coefficient data at single frequency or data series at multiple frequencies and using a processor to analyze resulting data, when shear rate is known. The resulting data is used to perform material process or operation monitoring and control, quality examination, and characterization. Systems for detecting components of dielectric materials and for dielectrostriction measurement are also disclosed.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: November 30, 2021
    Assignee: Kelvin Innovations LLC
    Inventor: Yiyan Peng
  • Patent number: 10732055
    Abstract: Interdigitated dielectrostrictive sensors are employed to measure shear stress, and for obtaining strain-dielectric and stress-dielectric coefficients to monitor a process, and examine quality of dielectric materials, including but not limited to polymer, composite, grease, food, biofluids and etc. Each dielectrostrictive sensor includes at least two interdigitated sensors, each having at least two electrodes and a central axis. The central axes are disposed in a common plane and are oriented at different directions.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: August 4, 2020
    Assignee: Northwestern University
    Inventors: Yiyan Peng, Qian Wang
  • Publication number: 20170122820
    Abstract: Devices and methods employing interdigitated dielectrostrictive sensors are disclosed for measuring shear stress, and obtaining strain-dielectric and stress-dielectric coefficients to monitor a process, and examine quality of dielectric materials, including but not limited to polymer, composite, grease, food, biofluids and etc. The dielectrostrictive sensor includes at least two interdigitated sensors, each having at least two electrodes and a central axis. The central axes are disposed in a common plane and are oriented at different directions.
    Type: Application
    Filed: October 27, 2016
    Publication date: May 4, 2017
    Inventors: Yiyan Peng, Qian Wang
  • Patent number: 8475703
    Abstract: A method is provided of fabricating a composite incorporating fillers. The method includes the steps of depositing the fillers in a matrix material either in a rapid prototyping device or prior to inserting the matrix material into a mold. The mold is positioned at a desired location with respect to an electrical field such that at least a portion of the fillers in the matrix material align in a first direction in response thereto. For producing a heterogeneous composite through a rapid prototyping process, the electrodes are positioned at a desired orientation to align the fillers. Thereafter, at least a portion of the matrix material is cured with desirable filler orientation. The procedure is repeated with the desired filler orientation and distribution being introduced layer by layer within the composite.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: July 2, 2013
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Lih-Sheng Turng, Larry R. Holmes, Jr., Yiyan Peng, Xiaochun Li
  • Publication number: 20110175259
    Abstract: A method is provided of fabricating a composite incorporating fillers. The method includes the steps of depositing the fillers in a matrix material either in a rapid prototyping device or prior to inserting the matrix material into a mold. The mold is positioned at a desired location with respect to an electrical field such that at least a portion of the fillers in the matrix material align in a first direction in response thereto. For producing a heterogeneous composite through a rapid prototyping process, the electrodes are positioned at a desired orientation to align the fillers. Thereafter, at least a portion of the matrix material is cured with desirable filler orientation. The procedure is repeated with the desired filler orientation and distribution being introduced layer by layer within the composite.
    Type: Application
    Filed: January 15, 2010
    Publication date: July 21, 2011
    Inventors: Lih-Sheng Turng, Larry R. Holmes, JR., Yiyan Peng, Xiaochun Li
  • Patent number: 7726199
    Abstract: An apparatus and method directed to a solid-state capacitance sensor for measuring a strain force on a dielectric including at least one pair of electrostriction sensors each sensor having at least two electrodes and each having a central axis. The central axes are disposed in a common plane and are oriented substantially mutually perpendicularly to one another. Preferably, at least two pairs of sensors, forming a rosette, are provided to facilitate multi-component analysis of a sample having dielectric properties under stress/strain.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: June 1, 2010
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Yuri Michael Shkel, Ho Young Lee, Yiyan Peng
  • Publication number: 20090249885
    Abstract: An apparatus and method directed to a solid-state capacitance sensor for measuring a strain force on a dielectric including at least one pair of electrostriction sensors each sensor having at least two electrodes and each having a central axis. The central axes are disposed in a common plane and are oriented substantially mutually perpendicularly to one another. Preferably, at least two pairs of sensors, forming a rosette, are provided to facilitate multi-component analysis of a sample having dielectric properties under stress/strain.
    Type: Application
    Filed: April 23, 2008
    Publication date: October 8, 2009
    Inventors: Yuri Michael Shkel, Ho Young Lee, Yiyan Peng