Abstract: A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.

Abstract: Techniques for generating customized learning paths are provided. In one technique, consumption data that indicates consumption of multiple learning resources by multiple users is recorded. Based on the consumption data, multiple learning resource tuples are generated, each learning resource tuple indicating that one learning resource that was consumed by a user prior to another learning resource that was consumed by the user. Multiple aggregations are performed, where each aggregation involves aggregating different sets of learning resource tuples, where each set of learning resource tuples comprises the same two learning resources in the same order. Based on a subset of the aggregations, a customized learning path that comprises a set of learning resources is generated for a particular user. The customized learning path is presented to the particular user.

Abstract: Techniques for generating customized learning paths are provided. In one technique, consumption data that indicates consumption of multiple learning resources by multiple users is recorded. Based on the consumption data, multiple learning resource tuples are generated, each learning resource tuple indicating that one learning resource that was consumed by a user prior to another learning resource that was consumed by the user. Multiple aggregations are performed, where each aggregation involves aggregating different sets of learning resource tuples, where each set of learning resource tuples comprises the same two learning resources in the same order. Based on a subset of the aggregations, a customized learning path that comprises a set of learning resources is generated for a particular user. The customized learning path is presented to the particular user.

Abstract: The disclosed embodiments provide a system that processes data. During operation, the system obtains a set of features for a customer of an educational technology product. Next, the system uses an account type of the customer to select a statistical model from a set of statistical models for evaluating potential customer spending with the educational technology product. The system then uses the statistical model and the features to predict a potential spending of the customer with the educational technology product. Finally, the system outputs the potential spending for use in managing sales activity with the customer.

Abstract: The disclosed embodiments provide a system for processing data. During operation, the system obtains a set of overall scores representing predicted purchase behaviors of a set of customers with an educational technology product. Next, the system displays a graphical user interface (GUI) comprising a customer prioritization chart for the educational technology product. The system then displays representations of the overall scores in the customer prioritization chart. Finally, the system displays, in the GUI, the set of overall scores and a breakdown of the overall scores into a set of sub-scores that characterize different components of the overall scores.

Abstract: In an example embodiment, a server accesses, for a plurality of customer accounts within a professional networking service, a plurality of features of the customer accounts stored with the professional networking service. The server accesses, for the plurality of customer accounts within the professional networking service, past sales records of products from the professional networking service to the plurality of employer accounts. The server determines, based on the past sales records and based on one or more features from the plurality of features, a product to upsell or cross-sell to a specific customer account. The server provides, as a digital transmission, indicia of the one or more features and the determined product.

Abstract: A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.

Abstract: A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.

Abstract: One or more pods for adjusting at least one of an oxygen content or a water content therein and methods of their use are provided, where one or more semiconductor wafer are selectively stored within a storage chamber of the pod. The pod comprises a storage chamber having a side wall surface defining an opening at one side thereof and a pod door fitted to the storage chamber at the opening so as to provide ingress and egress to the storage chamber. The pod door comprises a door body, a first door locking mechanism on the door body and a seal band configured to engage the sidewall surface. The first door locking mechanism comprises a first pressure applicator, a first key assembly and a first connector-rod.

Abstract: Embodiments of mechanisms for controlling a gas flow in an interface module are provided. A method for controlling a gas flow in an enclosure includes providing the enclosure which is capable of containing a substrate. The method also includes providing a gas into the enclosure. The method further includes cleaning the gas. In addition, the method includes actuating the gas to generate the gas flow, and the gas flow passes through the substrate when the substrate is located in the enclosure.

Abstract: Embodiments of mechanisms for controlling a gas flow in an interface module are provided. A method for controlling a gas flow in an enclosure includes providing the enclosure which is capable of containing a substrate. The method also includes providing a gas into the enclosure. The method further includes cleaning the gas. In addition, the method includes actuating the gas to generate the gas flow, and the gas flow passes through the substrate when the substrate is located in the enclosure.