Patents by Inventor Yiying JIAN

Yiying JIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11647608
    Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: May 9, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yiying Jian, Dingfang Li, Xinhu Gong, Gaoliang Xia
  • Publication number: 20220015268
    Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.
    Type: Application
    Filed: September 27, 2021
    Publication date: January 13, 2022
    Inventors: Yiying JIAN, Dingfang LI, Xinhu GONG, Gaoliang XIA