Abstract: In a silicon substrate a method is described for producing a recess for receiving an element. The method includes masking and etching areas on the substrate on either side of the intended recess, and masking at least one area of less width than the length of the intended recess and which, at least partly, extends over the intended recess to etch out a holding element corresponding to that area for holding an element received in the recess in place. The substrate is of a first doping type, and the masking is produced by doping the substrate with a dopant of a second doping type. The at least one area on the substrate, which, at least partly, extends over the intended recess is doped to a depth corresponding to the desired thickness of the holding element.

Abstract: In order to simplify handling and mounting of chips or chip-like structures/micro-blocks, a method and a device have been developed, by which, depending on the area of use, one or more chips can be assembled to act together and/or act together with other chip-like structures such as micromechanical building elements or microoptical elements. The actual retention of a micro-building-block (1) is achieved by micromechanical tongues (4) acting across holes or cavities (2) in a carrier material (3). Silicon tongues can, for example, be both flexible and sufficiently strong to retain a chip. In this manner, there is assured both precise vertical and horizontal positioning and mechanical retention. Electrical connection to the chip can be effected either by thin film technology or by more conventional wire-bonding.

Abstract: In silicon substrate having a recess for receiving an element, at least one holding element, integral with the substrate, extends, at least partly, over the recess to hold an element received in the recess in place.

Abstract: Optical components intended for telecommunications purposes must be manufactured and mounted with a great degree of accuracy, since a component, such as an optochip, when mounted must be coupled optically, electrically, mechanically and thermally at the same time. In order to obtain a right-angled geometry when using surface-emitting or surface-detecting components, and to obtain a reduced optical travel path and accurate fixation of an optofiber, a reflective surface (12) which slopes at an angle of 45 degrees is arranged between a light-conducting core (16) and the active surface (10) of an optochip, and the light-conducting core has been placed closer to the reflective surface by bevelling the optofiber (9) and fitting the fiber in a V-groove and accurately fixating the fiber in the groove by means of a flat cover means (20).