Abstract: An electrode including a current collector; and an electrode active material layer disposed on at least one surface of the current collector is disclosed. The electrode active material layer includes a lower layer region facing the current collector, and an upper layer region facing the lower layer region and extended to the surface of the electrode active material layer. The lower layer region includes a first active material and a first non-rubbery binder and is free from a rubbery binder. The upper layer region includes a second active material, a second non-rubbery binder, and a rubbery binder. The rubbery binder is a hydrogenated nitrile butadiene rubber (H-NBR). Each of the first non-rubbery binder and the second non-rubbery binder includes a polyvinylidene fluoride (PVDF)-based polymer, and the weight ratio of the second non-rubbery binder to the rubbery binder in the upper layer region is 1:0.03-1:0.07.

Abstract: This invention includes a circuit board cleaning apparatus comprising a circuit board support structure configured to receive a circuit board for cleaning. A plurality of spray openings is oriented to spray cleaning fluid onto said circuit board as received by the support structure. The spray openings are mounted above the support structure for movement relative to the support structure across the circuit board during cleaning of the circuit board. Additional and/or other apparatus are disclosed, as are inventive methods using such apparatus and other apparatus.

Abstract: The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wave former to increase the total height of enclosing walls thereof for increasing the wave height, and the gland is disposed on the partial opening of the wave former to press the molten solder for have higher solder wave on other partial opening of the wave former uncovered by the gland.

Abstract: The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wave former to increase the total height of enclosing walls thereof for increasing the wave height, and the gland is disposed on the partial opening of the wave former to press the molten solder for have higher solder wave on other partial opening of the wave former uncovered by the gland.

Abstract: The invention is proposed to efficiently dispatch wafers into tools, and particularly to provide a real-time and automatic way to dispatch wafers. In addition, a method for dispatching wafers, a system for dispatching wafers into tools and a system for processing numerous lots by number of tools with automatic dispatch are present as examples. One main characteristic of the invention is that each pending wafer is given an individual priority before it is processed by any tool and the priority is automatically calculated in accordance with to a ranking algorithm. Another main characteristic of the invention is that whenever a tool is available to process at least one pending wafer, part of pending wafers is automatically assigned to the available tool in accordance with an assignment algorithm and a required limitation database that is provided by the dispatcher.