Abstract: A headband structure of a headphone, including a headband assembly and a telescopic adjustment module, is provided. The headband assembly has a steel belt. The steel belt has multiple positioning slots. The telescopic adjustment module includes a fixing base, an elastic sheet, and a positioning ball. The fixing base is slidably disposed to the steel belt. The elastic sheet is disposed to the fixing base, and the elastic sheet has an accommodating groove. The positioning ball is disposed in the accommodating groove, and the positioning ball is located between the steel belt and the elastic sheet. The elastic sheet constantly pushes the positioning ball to keep the positioning ball in contact with the steel belt, and the positioning slots are located on moving paths of the positioning ball.