Abstract: A photomask cleaning apparatus includes a photomask receiving stage and a laser supply unit. The photomask receiving stage is configured to receive and retain a photomask in a desired orientation. The photomask has a front face having a pellicle adhesive residue region thereon. The desired orientation is with the front face positioned to allow gravity to move particles on the front face away from the front face without interference from the front face of the photomask. The laser supply unit is configured to generate a laser beam that irradiates a target region on the front face of the photomask to remove a pellicle adhesive residue from the target region. The photomask cleaning apparatus is configured to move the target region on the front face of the photomask to irradiate the entire pellicle adhesive residue region. Methods of using the photomask cleaning apparatus are also provided.

Abstract: A photomask cleaning apparatus includes a photomask receiving stage and a laser supply unit. The photomask receiving stage is configured to receive and retain a photomask in a desired orientation. The photomask has a front face having a pellicle adhesive residue region thereon. The desired orientation is with the front face positioned to allow gravity to move particles on the front face away from the front face without interference from the front face of the photomask. The laser supply unit is configured to generate a laser beam that irradiates a target region on the front face of the photomask to remove a pellicle adhesive residue from the target region. The photomask cleaning apparatus is configured to move the target region on the front face of the photomask to irradiate the entire pellicle adhesive residue region. Methods of using the photomask cleaning apparatus are also provided.

Abstract: A contamination analysis unit and method for inspecting pollutants remaining on a target side of an inspection object such as a reticle after cleaning the object is provided. After steeping the target side in a solution, a sampling liquid may be abstracted therefrom after a predetermined time and may be analyzed.

Abstract: The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.

Abstract: An air filtering device and an air cleaning system of a semiconductor manufacturing apparatus to reduce cost and increase manufacturing productivity. The air filtering device may include a frame having an open aperture coupled to an air supply line. A buffer frame configured to be inserted into the frame may include a plurality of slot parts, each slot part having a plurality of air in/out apertures through which air may flow in or out from the buffer frame. A plurality of filters may be releasably fastened to the plurality of slot parts to filter pollution material contained in air flowing through the air in/out apertures. An air interrupter for interrupting air flowing through the air in/out apertures may be used when replacing the plurality of filters, thereby providing purified air to the semiconductor manufacturing apparatus during the replacement.

Abstract: In an embodiment, heat treatment equipment comprises a process tube, an exhaust duct connected to the process tube, and, during operation, exhausting gases present within the process tube. The heat treatment equipment also comprises a hollow pressure control member interposed between the process tube and the exhaust duct, the pressure control member being operatively connected to the process tube and the exhaust duct respectively, and including one or a number of openings. Negative pressure is avoided in the process tube during heat treatment processes so that unwanted gas and impurities cannot enter the process tube from outside.

Abstract: The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.

Abstract: An air filtering device and an air cleaning system of a semiconductor manufacturing apparatus to reduce cost and increase manufacturing productivity. The air filtering device may include a frame having an open aperture coupled to an air supply line. A buffer frame configured to be inserted into the frame may include a plurality of slot parts, each slot part having a plurality of air in/out apertures through which air may flow in or out from the buffer frame. A plurality of filters may be releasably fastened to the plurality of slot parts to filter pollution material contained in air flowing through the air in/out apertures. An air interrupter for interrupting air flowing through the air in/out apertures may be used when replacing the plurality of filters, thereby providing purified air to the semiconductor manufacturing apparatus during the replacement.

Abstract: A contamination analysis unit and method for inspecting pollutants remaining on a target side of an inspection object such as a reticle after cleaning the object is provided. After steeping the target side in a solution, a sampling liquid may be abstracted therefrom after a predetermined time and may be analyzed.

Abstract: A substrate exposing apparatus includes an immersion exposure unit, disposed between a projection optical system and a substrate, including a vessel disposed on an optical path and filled with a liquid, a supply line connected to one side of the vessel to supply the liquid to the vessel, a first drain line connected to the other side of the vessel to drain the liquid from the vessel, and a monitoring unit including at least one first measuring unit connected to the first drain line to detect a property of the liquid flowing through the first drain line. The monitoring unit can include a collection line connected to the first drain line to collect the liquid, a first bath storing the collected liquid, and a first distribution line through which the liquid in the first bath can flow. The first measuring unit is installed on the first distribution line.

Abstract: An air-conditioning system of a substrate processing apparatus includes an air inlet line for providing air to a clean room. A contamination control apparatus for removing contaminants in the air is connected to the air inlet line. A controller controls temperature and humidity of the air without the contaminants. An air outlet line provides the air having the controlled temperature and humidity to a substrate processing chamber that is disposed in the clean room. The contamination control apparatus includes a spray unit having at least one nozzle that sprays water. At least one eliminator that traps the water for capturing contaminants in the air and drops the trapped water into a tank. A water circulation unit provides the water that includes an additive for controlling pH of the water to the spray unit.

Abstract: In an embodiment, heat treatment equipment comprises a process tube, an exhaust duct connected to the process tube, and, during operation, exhausting gases present within the process tube. The heat treatment equipment also comprises a hollow pressure control member interposed between the process tube and the exhaust duct, the pressure control member being operatively connected to the process tube and the exhaust duct respectively, and including one or a number of openings. Negative pressure is avoided in the process tube during heat treatment processes so that unwanted gas and impurities cannot enter the process tube from outside.

Abstract: An apparatus for cleaning air, and a method for cleaning air using the apparatus, includes a housing including an air inlet through which air to be cleaned flows into the housing and an air outlet through which air that has been cleaned is exhausted from the housing, the housing isolating an interior thereof from external surroundings. A first filtering unit is disposed adjacent to the air inlet and includes a plurality of first filters for removing a first group of contaminants from the air to be cleaned. Each of the plurality of first filters is disposed substantially parallel to each other. A fan for drawing the air to be cleaned into the housing from the external surroundings is disposed in the housing.

Abstract: Water discharged at a top region of an eliminator flows, e.g., by gravity into, along, and between the portions of the eliminator while an air flow also travels therein, e.g., horizontally and transverse to the water flow. As the air flow encounters the water, e.g., strikes portions of the eliminator having water flowing downward therealong or encounters water falling between portions of the eliminator, contaminants pass from the air flow to the water flow. The air flow, relieved of certain contaminants, continues onward and the water flow collects at the bottom of the eliminator for filtration and re-circulation through the eliminator.

Abstract: Example embodiments of the present invention relate to an apparatus for manufacturing semiconductors and a method of inspecting a pellicle. Other example embodiments of the present invention relate to an exposure apparatus for manufacturing semiconductors. The apparatus may include a reticle, a pellicle and a reticle chuck. The reticle may be mounted on an upper surface of the reticle chuck and the pellicle may be attached to a lower surface of the reticle chuck so that the pellicle may be detached again. There may be an empty space formed between the pellicle and the reticle. The reticle chuck may include holes for supplying or exhausting a purging gas from the empty space. Because a simpler yet more efficient purging system may be installed to the reticle chuck, an effective measure may be provided against contaminations on the pattern surface of the reticle.

Abstract: A management system and method of a reticle in an exposing process are disclosed. A calculator calculates an accumulated dosage of an illuminating light irradiated onto a reticle used in a photolithography process. The calculator is connected to an exposing apparatus to expose photoresist on a semiconductor substrate. A comparator compares the calculated accumulated dosage with a preset reference dosage. When the calculated accumulated dosage is greater than or equal to the reference dosage, a controller suspends the photolithography process. Minimizing haze contamination on the reticle, thus preventing process failures.

Abstract: A method of controlling contamination in a substrate transfer chamber that is disposed between a load port for supporting a container to receive a plurality of substrates and a substrate process module for processing the substrates includes supplying a purge gas into the substrate transfer chamber to purge an interior of the substrate transfer chamber, circulating the purge gas supplied into the substrate transfer chamber through a gas circular pipe, removing particles and airborne molecular contaminants from the purge gas being circulated, and resupplying the circulated purge gas into the substrate transfer chamber.

Abstract: A module for transferring a substrate includes a load port for supporting a container to receive a plurality of substrates, a substrate transfer chamber disposed between the load port and a substrate process module, a substrate transfer robot disposed in the substrate transfer chamber for transferring the substrates between the container and the substrate process module, a gas supply unit connected to the substrate transfer chamber for supplying a purge gas into the substrate transfer chamber to purge an interior of the substrate transfer chamber, and a contamination control unit connected to the substrate transfer chamber for circulating the purge gas supplied into the substrate transfer chamber, resupplying the circulated purge gas into the substrate transfer chamber and removing particles and airborne molecular contaminants from the purge gas being circulated. Contamination of a substrate may be prevented and a necessary amount of purge gas may be reduced.

Abstract: A substrate processing apparatus for processing substrates prevents the substrates from contaminating as they are transferred. The apparatus includes a container, like a FOUP, for containing substrates, at least one processing chamber where the substrates are processed, a substrate transferring module including a substrate transfer chamber and at least one load port for supporting a container, and a contamination controlling system for the substrate transfer chamber. The contamination controlling system includes a purge gas supply inlet connected to the substrate transfer chamber, and a gas circulating tube for recycling the purging gas to circulate through the chamber. The substrate transfer chamber is purged using the purging gas to remove moisture and contaminating materials from the substrate transfer chamber. The formation of particles on the substrate otherwise caused by a reaction between the moisture and contaminating materials while the substrate is standing by in the container can be prevented.

Abstract: A management system and method of a reticle in an exposing process are disclosed. A calculator calculates an accumulated dosage of an illuminating light irradiated onto a reticle used in a photolithography process. The calculator is connected to an exposing apparatus to expose photoresist on a semiconductor substrate. A comparator compares the calculated accumulated dosage with a preset reference dosage. When the calculated accumulated dosage is greater than or equal to the reference dosage, a controller suspends the photolithography process. Minimizing haze contamination on the reticle, thus preventing process failures.