Patents by Inventor Yo Kotani

Yo Kotani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • One-part, room temperature moisture curable resin composition
    Patent number: 6936676
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at ? position and a polyamine having at least two amino groups within its molecule wherein ? position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, room t
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: August 30, 2005
    Assignee: Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • One-part, room temperature moisture curable resin composition
    Publication number: 20040192873
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part
    Type: Application
    Filed: April 13, 2004
    Publication date: September 30, 2004
    Applicant: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • One-part, room temperature moisture curable resin composition
    Patent number: 6756466
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: June 29, 2004
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • One-part, room temperature moisture curable resin composition
    Publication number: 20040106766
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at a position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, ro
    Type: Application
    Filed: November 24, 2003
    Publication date: June 3, 2004
    Applicant: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • One-part, room temperature moisture curable resin composition
    Publication number: 20030139559
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part
    Type: Application
    Filed: November 12, 2002
    Publication date: July 24, 2003
    Applicant: THE YOKOHAMA RUBBER CO., LTD.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • One-pack cold moisture curable resin compositions
    Patent number: 6525159
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: February 25, 2003
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani