Patents by Inventor Yo Seph JEONG

Yo Seph JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STACK PACKAGE AND METHOD FOR MANUFACTURING THE STACK PACKAGE
    Publication number: 20170033081
    Abstract: A stack package may include a substrate, and a first semiconductor chip mounted over the substrate. The stack package may include a support member disposed over the substrate and the first semiconductor chip, and spaced apart from the substrate and the first semiconductor chip. The stack package may include a plurality of second semiconductor chips stacked over the support member.
    Type: Application
    Filed: October 28, 2015
    Publication date: February 2, 2017
    Inventors: Je Sik YOO, Jong Hyun KIM, Yo Seph JEONG, Han Jun BAE