Patents by Inventor Yo-Shen Lin
Yo-Shen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7167688Abstract: An RF transceiver module for wireless communication devices includes a multi-layered substrate, an RF transceiver IC mounted on the multi-layered substrate for receiving and transmitting voice or data signals, at least one band selection filter mounted on the multi-layered substrate for filtering received RF signals, an antenna switch integrated in the multi-layered substrate which can be switched to transmit RF signals generated by the power amplifiers to the external antenna or to receive RF signals from an external antenna to the RF transceiver IC through the band selection filter, a plurality of passive devices embedded in the multi-layered substrate, and wiring embedded in the multi-layered substrate for electrically connecting the passive devices, the RF transceiver IC, and the band selection filter.Type: GrantFiled: July 30, 2003Date of Patent: January 23, 2007Assignee: Chi Mei Communication Systems, Inc.Inventors: Ko-Mai Li, Yo-Shen Lin, Chien-Chang Liu
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Patent number: 7135943Abstract: A lumped-element diplexer formed in a multi-layered substrate includes a high-pass filter circuit, a low-pass filter circuit, and a ground plane, the elements of the filter circuits being disposed as follows: a first capacitor plate on a first layer of the substrate connected to a first port and a first inductor plate on a third layer, a second capacitor plate on a second layer of the substrate connected to the first inductor plate and a third capacitor plate on a fourth layer, the third capacitor plate in turn being connected to a second port. A fourth capacitor plate on a fifth layer of the substrate is connected to a second inductor plate on a seventh layer, the second inductor plate in turn being connected to the ground plane on a zeroth layer. A fifth capacitor plate on a sixth layer of the substrate is connected to a third port.Type: GrantFiled: July 11, 2004Date of Patent: November 14, 2006Assignee: Chi Mei Communication Sytems, Inc.Inventors: Yo-Shen Lin, Ko-Mai Li
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Patent number: 7002434Abstract: A lumped-element transmission line is formed in a multi-layered substrate. A mutual inductance between first and second inductors in a T-equivalent circuit model is enlarged to a designed positive value to widen the application frequency bandwidth of the transmission line. The second inductor is electrically connected to the first inductor in series at one end. The first and second inductors are spiral in shape and the orientations of the first inductor and the second inductor are the same so that the spirals progress in the same sense such that a mutual inductance between the first and second inductors is positive and equals a first value. A first capacitor is electrically connected to ground at a first end of the first capacitor, and a second end of the first capacitor is electrically connected to the end of the second inductor at which the second inductor in connected to the first inductor.Type: GrantFiled: March 16, 2004Date of Patent: February 21, 2006Assignee: Chi Mei Communication Systems, Inc.Inventors: Yo-Shen Lin, Ko-Mai Li
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Patent number: 6998938Abstract: A lumped-element low-pass filter is formed in a multi-layered substrate. A negative mutual inductance between two inductors is adjusted to a designed value and utilized to improve the rejection in the stopband of the low-pass filter. The two inductors are spiral in shape and the orientations of the first inductor and the second inductor are of opposite sense such that a mutual inductance between the first inductor and the second inductor is negative and equals a designed value. A first capacitor and a second capacitor are shunt-connected to the first and the second inductor respectively to form the elliptic-type filter. A third capacitor is electrically connected to ground at its first end, and electrically connected to the end of the second inductor at which the second inductor in electrically connected to the first inductor in series at its second end.Type: GrantFiled: March 10, 2004Date of Patent: February 14, 2006Assignee: Chi Mei Communication Systems, Inc.Inventors: Yo-Shen Lin, Ko-Mai Li
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Publication number: 20060006960Abstract: A lumped-element diplexer formed in a multi-layered substrate includes a high-pass filter circuit, a low-pass filter circuit, and a ground plane, the elements of the filter circuits being disposed as follows: a first capacitor plate on a first layer of the substrate connected to a first port and a first inductor plate on a third layer, a second capacitor plate on a second layer of the substrate connected to the first inductor plate and a third capacitor plate on a fourth layer, the third capacitor plate in turn being connected to a second port. A fourth capacitor plate on a fifth layer of the substrate is connected to a second inductor plate on a seventh layer, the second inductor plate in turn being connected to the ground plane on a zeroth layer. A fifth capacitor plate on a sixth layer of the substrate is connected to a third port.Type: ApplicationFiled: July 11, 2004Publication date: January 12, 2006Inventors: Yo-Shen Lin, Ko-Mai Li
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Patent number: 6970057Abstract: A lowpass filter formed in a multi-layered substrate includes a first capacitor formed on at least one layer of the multi-layered substrate and being electrically connected to a first node, a first inductor being electrically connected to the first capacitor at the first node, and a second inductor being electrically connected to the first inductor and the first capacitor at the first node. In the lowpass filter, negative mutual inductance exists between the first inductor and the second inductor.Type: GrantFiled: April 2, 2004Date of Patent: November 29, 2005Assignee: Chi Mei Communication Systems, Inc.Inventors: Yo-Shen Lin, Ko-Mai Li
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Publication number: 20050219011Abstract: A lowpass filter formed in a multi-layered substrate includes a first capacitor formed on at least one layer of the multi-layered substrate and being electrically connected to a first node, a first inductor being electrically connected to the first capacitor at the first node, and a second inductor being electrically connected to the first inductor and the first capacitor at the first node. In the lowpass filter, negative mutual inductance exists between the first inductor and the second inductor.Type: ApplicationFiled: April 2, 2004Publication date: October 6, 2005Inventors: Yo-Shen Lin, Ko-Mai Li
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Publication number: 20050206470Abstract: A lumped-element transmission line is formed in a multi-layered substrate. A mutual inductance between first and second inductors in a T-equivalent circuit model is enlarged to a designed positive value to widen the application frequency bandwidth of the transmission line. The second inductor is electrically connected to the first inductor in series at one end. The first and second inductors are spiral in shape and the orientations of the first inductor and the second inductor are the same so that the spirals progress in the same sense such that a mutual inductance between the first and second inductors is positive and equals a first value. A first capacitor is electrically connected to ground at a first end of the first capacitor, and a second end of the first capacitor is electrically connected to the end of the second inductor at which the second inductor in connected to the first inductor.Type: ApplicationFiled: March 16, 2004Publication date: September 22, 2005Inventors: Yo-Shen Lin, Ko-Mai Li
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Publication number: 20050200431Abstract: A lumped-element low-pass filter is formed in a multi-layered substrate. A negative mutual inductance between two inductors is adjusted to a designed value and utilized to improve the rejection in the stopband of the low-pass filter. The two inductors are spiral in shape and the orientations of the first inductor and the second inductor are of opposite sense such that a mutual inductance between the first inductor and the second inductor is negative and equals a designed value. A first capacitor and a second capacitor are shunt-connected to the first and the second inductor respectively to form the elliptic-type filter. A third capacitor is electrically connected to ground at its first end, and electrically connected to the end of the second inductor at which the second inductor in electrically connected to the first inductor in series at its second end.Type: ApplicationFiled: March 10, 2004Publication date: September 15, 2005Inventors: Yo-Shen Lin, Ko-Mai Li
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Publication number: 20050026647Abstract: An RF transceiver module for wireless communication devices includes a multi-layered substrate, an RF transceiver IC mounted on the multi-layered substrate for receiving and transmitting voice or data signals, at least one band selection filter mounted on the multi-layered substrate for filtering received RF signals, an antenna switch integrated in the multi-layered substrate which can be switched to transmit RF signals generated by the power amplifiers to the external antenna or to receive RF signals from an external antenna to the RF transceiver IC through the band selection filter, a plurality of passive devices embedded in the multi-layered substrate, and wiring embedded in the multi-layered substrate for electrically connecting the passive devices, the RF transceiver IC, and the band selection filter.Type: ApplicationFiled: July 30, 2003Publication date: February 3, 2005Inventors: Ko-Mai Li, Yo-Shen Lin, Chien-Chang Liu