Patents by Inventor Yo-Sung SHIM

Yo-Sung SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for optimizing component mounting sequence with variable pitch heads and component mounting device using the same
    Patent number: 8612041
    Abstract: A method is provided for determining a sequence of mounting a plurality of components on a board by using variable pitch heads having a plurality of pitches. The method includes: partitioning the board into a plurality of sectors, each of the sectors including a plurality of mounting points arranged in parallel with a direction in which the heads are arranged; dividing the board into a plurality of sub-boards including first sub-boards based on the sectors, each of the first sub-boards including as many mounting points as the heads; and determining a combination of a sequence of mounting the components on the board and at least one pitch among the pitches required to mount the components on the board in a shortest time, compared to another sequence or other sequences of mounting the components on the board and another pitch or other pitches among the pitches, based on the first sub-boards.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: December 17, 2013
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Yo-Sung Shim
  • METHOD FOR OPTIMIZING COMPONENT MOUNTING SEQUENCE WITH VARIABLE PITCH HEADS AND COMPONENT MOUNTING DEVICE USING THE SAME
    Publication number: 20120123575
    Abstract: A method is provided for determining a sequence of mounting a plurality of components on a board by using variable pitch heads having a plurality of pitches. The method includes: partitioning the board into a plurality of sectors, each of the sectors including a plurality of mounting points arranged in parallel with a direction in which the heads are arranged; dividing the board into a plurality of sub-boards including first sub-boards based on the sectors, each of the first sub-boards including as many mounting points as the heads; and determining a combination of a sequence of mounting the components on the board and at least one pitch among the pitches required to mount the components on the board in a shortest time, compared to another sequence or other sequences of mounting the components on the board and another pitch or other pitches among the pitches, based on the first sub-boards.
    Type: Application
    Filed: June 24, 2011
    Publication date: May 17, 2012
    Applicant: SAMSUNG TECHWIN CO., LTD.
    Inventor: Yo-Sung SHIM