Abstract: A semiconductor device includes: a semiconductor element provided on a semiconductor layer; a light-blocking wall provided around the semiconductor element; and a wiring layer electrically coupled to the semiconductor element and extended from an aperture not having the light-blocking wall to an outside of the light-blocking wall; wherein the wiring layer has a pattern containing a first section positioned in the aperture and a second section which has a width not narrower than a width of the aperture by providing a branched portion intersecting with an extension direction of the wiring layer; and wherein a surface of the branched portion facing outside of the light-blocking wall includes thereon a convex part.

Abstract: A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.

Abstract: A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.

Abstract: A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.

Abstract: A semiconductor device includes: a semiconductor layer; a first area and a second area which are demarcated by a separation insulating layer provided on the semiconductor layer; a nonvolatile memory provided on the first area; a plurality of MOS transistors provided on the second area; a first interlayer insulating layer embedded between the plurality of MOS transistors on the second area; and a second interlayer insulating layer provided above the first area and the second area. The second interlayer insulating layer is provided as if covering the nonvolatile memory on the first area and, on the second area, provided, being above the first interlayer insulating layer, as if covering the MOS transistor.

Abstract: A semiconductor device includes: a semiconductor element provided on a semiconductor layer; a light-blocking wall provided around the semiconductor element; and a wiring layer electrically coupled to the semiconductor element and extended from an aperture not having the light-blocking wall to an outside of the light-blocking wall; wherein the wiring layer has a pattern containing a first section positioned in the aperture and a second section which has a width not narrower than a width of the aperture by providing a branched portion intersecting with an extension direction of the wiring layer; and wherein a surface of the branched portion facing outside of the light-blocking wall includes thereon a convex part.

Abstract: A semiconductor device includes: a semiconductor element provided on a semiconductor layer; a light-blocking wall provided around the semiconductor element; and a wiring layer electrically coupled to the semiconductor element and extended from an aperture not having the light-blocking wall to an outside of the light-blocking wall; wherein the wiring layer has a pattern containing a first section positioned in the aperture and a second section which has a width not narrower than a width of the aperture by providing a branched portion intersecting with an extension direction of the wiring layer; and wherein a surface of the branched portion facing outside of the light-blocking wall includes thereon a convex part.

Abstract: A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.

Abstract: A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.

Abstract: A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.

Abstract: A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.

Abstract: A semiconductor device comprising: a first light shielded region including a first semiconductor element, the first light shielded region being defined by a first light shielding wall provided in the periphery thereof; a second light shielded region including a second semiconductor element, the second light shielded region being defined by a second light shielding wall provided in the periphery thereof and being provided in a position adjacent to the first light shielded region; a first opening provided in the first light shielding wall; a second opening provided in the second light shielding wall and positioned facing to the first opening; a first wiring layer coupled with the first semiconductor element and brought out to the outside of the first light shielded region from the first opening; a second wiring layer coupled with the second semiconductor element and brought out to the outside of the second light shielded region from the second opening; and a light shielding film provided at least above a region

Abstract: A semiconductor device includes: a semiconductor layer; a first area and a second area which are demarcated by a separation insulating layer provided on the semiconductor layer; a nonvolatile memory provided on the first area; a plurality of MOS transistors provided on the second area; a first interlayer insulating layer embedded between the plurality of MOS transistors on the second area; and a second interlayer insulating layer provided above the first area and the second area. The second interlayer insulating layer is provided as if covering the nonvolatile memory on the first area and, on the second area, provided, being above the first interlayer insulating layer, as if covering the MOS transistor.

Abstract: A semiconductor device comprising: a first light shielded region including a first semiconductor element, the first light shielded region being defined by a first light shielding wall provided in the periphery thereof; a second light shielded region including a second semiconductor element, the second light shielded region being defined by a second light shielding wall provided in the periphery thereof and being provided in a position adjacent to the first light shielded region; a first opening provided in the first light shielding wall; a second opening provided in the second light shielding wall and positioned facing to the first opening; a first wiring layer coupled with the first semiconductor element and brought out to the outside of the first light shielded region from the first opening; a second wiring layer coupled with the second semiconductor element and brought out to the outside of the second light shielded region from the second opening; and a light shielding film provided at least above a region

Abstract: A semiconductor device includes: a semiconductor element provided on a semiconductor layer; a light-blocking wall provided around the semiconductor element; and a wiring layer electrically coupled to the semiconductor element and extended from an aperture not having the light-blocking wall to an outside of the light-blocking wall; wherein the wiring layer has a pattern containing a first section positioned in the aperture and a second section which has a width not narrower than a width of the aperture by providing a branched portion intersecting with an extension direction of the wiring layer; and wherein a surface of the branched portion facing outside of the light-blocking wall includes thereon a convex part.

Abstract: A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.