Abstract: An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

Abstract: A heat transfer system is provided for a LED lamp. The LED lamp includes a board surface to supply heat energy during an operation of the LED lamp. The LED lamp is mounted within a recessed housing that separates a first area having a first temperature from a second area having a second temperature, where the second temperature is lower than the first temperature. The system includes a thermal dissipator positioned within the second area. The system further includes a heat transfer device with a first end mounted to the board surface, and a second end mounted to the thermal dissipator, to transfer the heat energy from the board surface in the first area to the thermal dissipator in the second area, and dissipate the heat energy within the second area.

Abstract: Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

Abstract: A system for heat transfer along with the method of preparation of the same is described. System includes a first surface, a second surface, and an interface material. The interface material is disposed between the first and second surfaces such that it is solid at an assembling temperature and liquid at an operating temperature. The first surface of the system is configured to adhere to the solid and liquid thermal interface material, and the second surface is configured to adhere to the liquid thermal interface material and be detachable from the solid interface material. The method of preparation of the system includes disposing the first surface, an interface material, and a second surface, heating the interface material to above its melting point and then cooling to a temperature below melting point to detach and remove the second surface from the interface material.

Abstract: A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

Abstract: A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink.

Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.

Abstract: A synthetic jet includes a first backer structure, a first actuator coupled to the first backer structure to form a first composite unit, a second backer structure, a second actuator coupled to the second backer structure to form a second composite unit, and a wall member coupled to and positioned between the first and second backer structures to form a cavity, wherein the first composite unit has an orifice formed through both the first backer structure and the first actuator, the orifice fluidically coupled to the cavity and fluidically coupled to an environment external to the cavity, and wherein the first and second composite units are operable independently from one another.

Abstract: A cooling system for reducing the thermal energy transfer from the heated spots of an RF coil assembly to a patient bore of an MRI system is disclosed. The MRI system includes a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about an RF space, and an RF coil assembly positioned within the RF space and about the patient bore. The cooling system is positioned within the RF space and includes a plurality of cooling modules configured to reduce an operating temperature of the MRI system. Each of the plurality of cooling modules further includes a thermoelectric cooler thermally coupled to the RF coil and a heat sink thermally coupled to the thermoelectric cooler opposite from the RF coil. The thermoelectric cooler is configured to extract heat from the RF coil when a current is applied to the thermoelectric cooler.

Abstract: A thermal management system for an embedded environment is described. The thermal management system includes a pleumo-jet that has at least one wall defining a chamber, at least one piezoelectric device on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening providing fluid communication between said chamber and the embedded environment. A cooling system is also described. A method for making a pleumo-jet is also described.

Abstract: A heat transfer system is provided for a LED lamp. The LED lamp includes a board surface to supply heat energy during an operation of the LED lamp. The LED lamp is mounted within a recessed housing that separates a first area having a first temperature from a second area having a second temperature, where the second temperature is lower than the first temperature. The system includes a thermal dissipator positioned within the second area. The system further includes a heat transfer device with a first end mounted to the board surface, and a second end mounted to the thermal dissipator, to transfer the heat energy from the board surface in the first area to the thermal dissipator in the second area, and dissipate the heat energy within the second area.

Abstract: A synthetic jet includes a first backer structure and a first actuator coupled to the first backer structure to form a first composite unit. The synthetic jet also includes a second backer structure, and a second actuator coupled to the second backer structure to form a second composite unit. A wall member is coupled to and positioned between the first and second backer structures to form a cavity. The first composite unit has an orifice formed therethrough and the orifice is fluidically coupled to the cavity and fluidically coupled to an environment external to the cavity.

Abstract: A synthetic jet includes a first backer structure and a first actuator coupled to the first backer structure to form a first composite unit. The synthetic jet also includes a second backer structure, and a second actuator coupled to the second backer structure to form a second composite unit. A wall member is coupled to and positioned between the first and second backer structures to form a cavity. The first composite unit has an orifice formed therethrough and the orifice is fluidically coupled to the cavity and fluidically coupled to an environment external to the cavity.

Abstract: A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

Abstract: An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

Abstract: A system and method for lowering the structural natural frequency of a synthetic jet actuator is disclosed. A synthetic jet actuator is provided that includes a first plate, a second plate spaced apart from the first plate and arranged parallelly thereto, and a spacer element configured to space the first plate apart from the second plate and define a chamber along with the first and second plates. The spacer element includes at least one orifice formed therein such that the chamber is in fluid communication with an environment external to the chamber, and the spacer element is constructed to deform in a bending motion in response to a deflection of at least one of the first and second plates.

Abstract: A device, such as an absorption chiller sub-system, is provided. The absorption chiller sub-system can include an evaporator and an absorber. The evaporator can be configured to receive a liquid first working fluid and to produce first working fluid vapor. The absorber can be configured to receive and combine first working fluid vapor and a second working fluid, for example, so as to release thermal energy. A divider having opposing first and second sides in respective fluid communication with the evaporator and the absorber can also be included. The divider can be configured to allow first working fluid vapor to pass therethrough between the first and second sides and to inhibit movement of liquid first working fluid therethrough between the first and second sides. Associated systems and methods are also provided.

Abstract: A transverse gradient coil for an MRI system is provided. The transverse gradient coil comprises a first coil layer; and an insulation layer made of thermoplastic insulation resin which has a thermal conductivity greater than 1.5 W/m·K, the insulation layer having one side bonded to the first coil layer. A method for manufacturing the transverse gradient coil by injection molding or compression molding is also provided.

Abstract: A cooling system for reducing the thermal energy transfer from the heated spots of an RF coil assembly to a patient bore of an MRI system is disclosed. The MRI system includes a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about an RF space, and an RF coil assembly positioned within the RF space and about the patient bore. The cooling system is positioned within the RF space and includes a plurality of cooling modules configured to reduce an operating temperature of the MRI system. Each of the plurality of cooling modules further includes a thermoelectric cooler thermally coupled to the RF coil and a heat sink thermally coupled to the thermoelectric cooler opposite from the RF coil. The thermoelectric cooler is configured to extract heat from the RF coil when a current is applied to the thermoelectric cooler.

Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.