Abstract: Devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like, are provided herein. In particular, the device includes a composite thermal capacitor including a phase change material and a high thermal conductivity material in thermal communication with the phase change material. The high thermal conductivity material is also in thermal communication with an active regeneration cooling device. The heat from the composite thermal capacitor is dissipated by the active regeneration cooling device.

Abstract: Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.

Abstract: Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.

Abstract: Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.

Abstract: A loyalty program business model includes entering into an agreement with loyalty program partners and agreeing on exchange rates between a variety of loyalty unit types. Partner accrual records (PAR's) arc accepted from the loyalty program partners related to the business activity of related loyalty program members. Loyalty units credits are calculated for a member from data obtained in the step of accepting. A partner loyalty account balance is updated according to the standardized loyalty unit debit obtained in the step of calculating. Then an invoice can be billed to a partner according to the partner loyalty account balance.

Abstract: Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peripheral condenser, both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator substantially full at all orientations while leaving a void for accumulation of vapor in the condenser. A cover plate and a parallel base plate of generally similar dimension form the evaporator and condenser. Optionally, an opening in the base plate is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate may be formed with the electronics package from a single piece of material. A boiling enhancement structure is provided in the evaporator to encourage vapor bubble nucleation.

Abstract: Briefly described, embodiments of this disclosure include thermal management devices, systems, and methods, convection cooling devices, convection cooling systems, convection cooling methods, hybrid convection/desorption cooling devices, hybrid convection/desorption cooling systems, hybrid convection/desorption cooling methods, are disclosed.

Abstract: Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one or more flow-regulation features having a first and second manifold to provide and regulate at least a portion of a first fluid flow to the plurality of first channels and to drain at least the portion of the first fluid flow from the plurality of first channels. Other embodiments may be described and claimed.

Abstract: Briefly described, embodiments of this disclosure include thermal management devices, systems, and methods, convection cooling devices, convection cooling systems, convection cooling methods, hybrid convection/desorption cooling devices, hybrid convection/desorption cooling systems, hybrid convection/desorption cooling methods, are disclosed.

Abstract: The present invention discloses a method and system for processing accrual and redemption package offerings in loyalty programs. The method includes identifying a set of accrual package offerings, identifying a plurality of loyalty members satisfying a set of package conditions, calculating accruals for each of the plurality of loyalty members and crediting the loyalty member accounts, and identifying a set of loyalty partners and debiting loyalty partner accounts. The method and system of the present invention enables loyalty programs to fully automate the process of setting up and managing accruals and redemption packages. The present invention also discloses a method and system of recalculating the accrual transactions.

Abstract: A loyalty program business model includes entering into an agreement with loyalty program partners and agreeing on exchange rates between a variety of loyalty unit types. Partner accrual records (PAR's) are accepted from said loyalty program partners related to the business activity of related loyalty program members. Loyalty units credits are calculated for a member from data obtained in the step of accepting. A partner loyalty account balance is updated according to said standardized loyalty unit debit obtained in the step of calculating. Then an invoice can be billed to a partner according to said partner loyalty account balance.

Abstract: The present invention discloses a method and system for accrual transaction processing in loyalty programs. The method according to the present invention includes the steps of setting up an accrual template, and validating accrual transactions received from loyalty partners against transaction attributes in the accrual template. The present invention imparts accrual transaction process an ability to accurately calculate rewards for loyalty member activities of different types undertaken with loyalty partners from diverse industries.

Abstract: An apparatus and a system, as well as a method and article, may operate to circulate a coolant through a thermal conduit thermally coupled to a chassis heat exchange element including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices. The temperature of one or more of the plurality of electronic devices may be sensed, and the flow rate of the coolant adjusted in accordance with the sensed temperature. The thermal conduit may include thermally conductive, flow disrupting elements. The chassis heat exchange element may operate in a downhole environment, including logging and drilling operations.

Abstract: Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement.

Abstract: Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peripheral condenser, both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator substantially full at all orientations while leaving a void for accumulation of vapor in the condenser. A cover plate and a parallel base plate of generally similar dimension form the evaporator and condenser. Optionally, an opening in the base plate is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate may be formed with the electronics package from a single piece of material. A boiling enhancement structure is provided in the evaporator to encourage vapor bubble nucleation.