Patents by Inventor Yoh Tanaka

Yoh Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8303785
    Abstract: A plasma processing apparatus includes a chamber, substrate stage, electrode, conductive members, and deposition shield. The chamber is maintained at a predetermined potential. The substrate stage serves to hold a substrate within the chamber. The electrode serves to generate a plasma inside the chamber by applying AC power to the chamber. The conductive members connect the substrate stage and the side wall of the chamber by surrounding the plasma space between the substrate stage and the electrode in plasma formation, and at least some of them are separated by being moved by a driving mechanism so as to form an opening for loading a substrate onto the substrate stage while no plasma is being formed. The deposition shield covers the surfaces of the conductive members on the side of the plasma space.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: November 6, 2012
    Assignee: Canon Anelva Corporation
    Inventors: Yoh Tanaka, Kazuya Konaga, Eisaku Watanabe, Eitaro Morimoto
  • Publication number: 20110089023
    Abstract: A plasma processing apparatus includes a chamber, substrate stage, electrode, conductive members, and deposition shield. The chamber is maintained at a predetermined potential. The substrate stage serves to hold a substrate within the chamber. The electrode serves to generate a plasma inside the chamber by applying AC power to the chamber. The conductive members connect the substrate stage and the side wall of the chamber by surrounding the plasma space between the substrate stage and the electrode in plasma formation, and at least some of them are separated by being moved by a driving mechanism so as to form an opening for loading a substrate onto the substrate stage while no plasma is being formed. The deposition shield covers the surfaces of the conductive members on the side of the plasma space.
    Type: Application
    Filed: December 28, 2010
    Publication date: April 21, 2011
    Applicant: CANON ANELVA CORPORATION
    Inventors: YOH TANAKA, KAZUYA KONAGA, EISAKU WATANABE, EITARO MORIMOTO
  • Publication number: 20090283976
    Abstract: A substrate holding apparatus comprises a substrate holding mechanism configured to hold a substrate; a heating mechanism; and a heat-conductive member which is interposed between the substrate holding mechanism and the heating mechanism to be in contact therewith and conducts heat generated by the heating mechanism to the substrate holding mechanism, wherein the heat-conductive member has a recessed section that opens to the substrate.
    Type: Application
    Filed: April 29, 2009
    Publication date: November 19, 2009
    Applicant: CANON ANELVA CORPORATION
    Inventors: Kazuaki Kaneko, Yoh Tanaka, Masayoshi Ikeda, Yohsuke Shibuya