Abstract: An adjustment-determining method includes obtaining a mathematical model relating an operating parameter of the deposition line to a quality function defined from a quality measurement of a stack of thin layers deposited by the deposition line on a transparent substrate; obtaining a value of the quality function from a value of the quality measurement measured at the outlet of the deposition line on a stack of thin layers deposited by the deposition line on a substrate while the deposition line was set so that an operating parameter had a current value; and automatically determining by the mathematical model an adjustment value for the current value of the operating parameter serving to reduce a difference that exists between the value obtained for the quality function and a target value selected for the quality function for the stack of thin layers.

Abstract: A method for locating, in a deposition line including a succession of compartments, an origin of a defect affecting a stack of thin layers deposited on a substrate in the compartments, in which each thin layer is deposited in one or more successive compartments of the deposition line and pieces of debris remaining on the surface of a thin layer deposited in a compartment act as masks for the subsequent depositions of thin layers and are the origin of defects, includes obtaining at least one image showing the defect, determining, from the at least one image, a signature of the defect, the signature containing at least one characteristic representative of the defect, and identifying at least one compartment of the deposition line liable to be the origin of the defect from the signature of the defect and using reference signatures associated with the compartments of the deposition line.

Abstract: An adjustment-determining method includes obtaining a mathematical model relating an operating parameter of the deposition line to a quality function defined from a quality measurement of a stack of thin layers deposited by the deposition line on a transparent substrate; obtaining a value of the quality function from a value of the quality measurement measured at the outlet of the deposition line on a stack of thin layers deposited by the deposition line on a substrate while the deposition line was set so that an operating parameter had a current value; and automatically determining by the mathematical model an adjustment value for the current value of the operating parameter serving to reduce a difference that exists between the value obtained for the quality function and a target value selected for the quality function for the stack of thin layers.

Abstract: A method for locating, in a deposition line including a succession of compartments, an origin of a defect affecting a stack of thin layers deposited on a substrate in the compartments, in which each thin layer is deposited in one or more successive compartments of the deposition line and pieces of debris remaining on the surface of a thin layer deposited in a compartment act as masks for the subsequent depositions of thin layers and are the origin of defects, includes obtaining at least one image showing the defect, determining, from the at least one image, a signature of the defect, the signature containing at least one characteristic representative of the defect, and identifying at least one compartment of the deposition line liable to be the origin of the defect from the signature of the defect and using reference signatures associated with the compartments of the deposition line.