Patents by Inventor Yohan Piccin

Yohan Piccin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12300610
    Abstract: A semiconductor circuit configured to reduce electromigration. The circuit comprises a power rail and ground rail located on a first layer. A power finger and a ground finger are located on a second layer. Cells are located on the second layer, such that the one or more cells are electrically connected to a power finger and a ground finger. The circuit also includes one or more power vias electrically connecting the power rail to the power finger. The one or more power vias extend from the first layer to the second layer. One or more ground vias electrically connecting the ground rail to the ground finger, such that the one or more ground vias extend from the first layer to the second layer. The placement of the fingers on a different level than the rails establishing the fingers as non-contiguous sections thereby reducing electromigration and overcoming design analysis errors.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: May 13, 2025
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventor: Yohan Piccin
  • Publication number: 20230187354
    Abstract: A semiconductor circuit configured to reduce electromigration. The circuit comprises a power rail and ground rail located on a first layer. A power finger and a ground finger are located on a second layer. Cells are located on the second layer, such that the one or more cells are electrically connected to a power finger and a ground finger. The circuit also includes one or more power vias electrically connecting the power rail to the power finger. The one or more power vias extend from the first layer to the second layer. One or more ground vias electrically connecting the ground rail to the ground finger, such that the one or more ground vias extend from the first layer to the second layer. The placement of the fingers on a different level than the rails establishing the fingers as non-contiguous sections thereby reducing electromigration and overcoming design analysis errors.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Inventor: Yohan Piccin