Patents by Inventor Yohei HOTANI

Yohei HOTANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamide resin composition, molded body thereof, and method for manufacturing laser-welded body
    Patent number: 11673341
    Abstract: This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (?HR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: June 13, 2023
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kohei Nishino, Yohei Hotani, Isao Washio
  • POLYAMIDE RESIN COMPOSITION, MOLDED BODY THEREOF, AND METHOD FOR MANUFACTURING LASER-WELDED BODY
    Publication number: 20210101347
    Abstract: This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (?HR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.
    Type: Application
    Filed: February 15, 2019
    Publication date: April 8, 2021
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kohei NISHINO, Yohei HOTANI, Isao WASHIO