Abstract: A wafer placement table includes a ceramic plate having a wafer placement surface on its upper surface, a cooling plate on a lower surface of the ceramic plate, a refrigerant flow path in the cooling plate, and an insulating hole located beside the refrigerant flow path in the cooling plate and extending from a lower surface of the cooling plate to a ceiling located higher than 2/3 of a height of the refrigerant flow path from its bottom.

Abstract: A wafer placement table includes a ceramic plate, a cooling plate and a refrigerant flow path. The refrigerant flow path has a first variable section and a second variable section. The first variable section is provided such that the cross-sectional area of the refrigerant flow path gradually decreases as it proceeds in the direction of refrigerant flow from a starting point of the first variable section. The second variable section is provided such that, after the cross-sectional area of the refrigerant flow path is once expanded from the cross-sectional area of the refrigerant flow path at an end point of the first variable section in a first expansion section right before a starting point of the second variable section, the cross-sectional area of the refrigerant flow path gradually decreases as it proceeds in the direction of refrigerant flow from the starting point of the second variable section.

Abstract: A wafer placement table includes: a ceramic plate having a wafer placement surface on its upper surface; a cooling plate provided on a lower surface of the ceramic plate; and a refrigerant flow path provided inside the cooling plate, wherein the refrigerant flow path includes a first portion and a second portion, the second portion continuing from the first portion and being divided into two or more ways forming branches that run side by side, and wherein the first portion has a cross-sectional area smaller than a sum of cross-sectional areas of the respective branches included in the second portion.

Abstract: A wafer placement table includes a ceramic plate having a wafer placement surface on an upper surface, and a cooling plate provided on a lower surface of the ceramic plate. The cooling plate is made of a material having a lower thermal conductivity than Al. A length between an upper surface of a refrigerant flow path and the wafer placement surface is not constant and varies as being long in one part and short in another part. A flow-path cross-sectional area of the refrigerant flow path is not constant and varies as being small in one part and large in another part. An aspect ratio defined as a ratio of a vertical length to a horizontal length of a flow-path cross section of the refrigerant flow path is not constant and varies as being small in one part and large in another part.

Abstract: An inspection device for a pillar shaped honeycomb filter includes: a housing portion that can house a pillar shaped honeycomb filter; an introduction pipe and a discharge pipe through which a gas can flow, each of the introduction pipe and the discharge pipe being connected to the housing portion; a particle generation portion for generating particles; a particle introduction portion for introducing the particles generated by the particle generation portion into the introduction pipe; a gas stirring portion arranged in the introduction pipe on an upstream side of the particle introduction portion in a gas flow direction; and particle counters for measuring the number of particles, the particle counters being arranged in the introduction pipe and the discharge pipe on a downstream side of the particle introduction portion in the gas flow direction.

Abstract: A method of adjusting heat uniformity on a wafer mounting surface of a wafer mount having a ceramic base including the wafer mounting surface which can heat a wafer through energization and a cooling plate includes: a) preparing the wafer mount including the cooling plate including: a base including a flow path of a coolant; and a lid detachable from the base; b) measuring a temperature distribution with the lid being attached on the base while heating through the energization and cooling; c) detaching the lid and locally adjusting a shape of the flow path when the temperature distribution does not satisfy a predetermined criterion; and d) remeasuring the temperature distribution after adjusting the shape of the flow path, with the lid being attached on the base while heating through the energization and cooling, wherein the steps c) and d) are repeated until the remeasured temperature distribution satisfies the criterion.

Abstract: An inspection device for a pillar shaped honeycomb filter includes: a housing portion that can house a pillar shaped honeycomb filter; an introduction pipe and a discharge pipe through which a gas can flow, each of the introduction pipe and the discharge pipe being connected to the housing portion; a particle generation portion for generating particles; a particle introduction portion for introducing the particles generated by the particle generation portion into the introduction pipe; a gas stirring portion arranged in the introduction pipe on an upstream side of the particle introduction portion in a gas flow direction; and particle counters for measuring the number of particles, the particle counters being arranged in the introduction pipe and the discharge pipe on a downstream side of the particle introduction portion in the gas flow direction.