Abstract: A laser oscillation mechanism of a laser beam irradiation unit has a first mode to break growing debris, a second mode to suppress generation of molten debris, and a third mode to break the growing debris and suppress generation of the molten debris. The laser oscillation mechanism includes a selecting part that selects any of the first mode, the second mode, and the third mode. The laser oscillation mechanism sets a repetition frequency with a first group being one unit in the first mode, and sets a repetition frequency with a second group being one unit in the second mode, and sets a repetition frequency with a third group being one unit in the third mode.

Abstract: A laser processing apparatus includes a laser oscillating mechanism for emitting pulsed laser beams. The laser oscillating mechanism includes a group setting section for establishing the number of pulsed laser beams to be applied to a workpiece until a time after which melted debris produced by the pulsed laser beams applied to the workpiece is solidified, and assigns the pulsed laser beams to a group, under conditions that, within a period of time which is shorter than a period of time in which the melted debris is produced, and within a period of time after which a plasma generated by the pulsed laser beam becomes extinct, a next pulsed laser beam is applied to the workpiece to sustain the plasma uninterruptedly to break growing debris, and a time interval setting section for establishing a time interval between the group and another group adjacent thereto.

Abstract: A laser beam irradiating unit of a laser processing apparatus includes a laser oscillating mechanism. The laser oscillating mechanism includes a group setting unit configured to, on a condition that a pulsed laser beam is applied at shorter time intervals than a length of time that molten debris is generated, set the number of pulsed laser beams to be applied until a time that the molten debris is solidified and set the number of pulsed laser beams as one group. A time interval setting unit is configured to set a time until heat generated by application of the pulsed laser beams of the one group is cooled, which serves as a time interval between the one group and an adjacent group, and set time intervals of the pulsed laser beams constituting the one group. The laser oscillating mechanism sets a repetition frequency with the one group as one unit.

Abstract: A laser processing apparatus includes a chuck table that holds a workpiece, a laser beam irradiation unit that irradiates the workpiece with a laser beam, and a feed mechanism that moves the chuck table and the laser beam irradiation unit relative to each other to execute processing feed. The laser beam irradiation unit includes a laser oscillation mechanism that emits a pulsed laser beam and a beam condenser that condenses the pulsed laser beam emitted by the laser oscillation mechanism and irradiates the workpiece with the pulsed laser beam. The laser oscillation mechanism has a group setting part that sets multiple pulsed laser beams into one group and a time interval setting part that sets a time interval of the pulsed laser beams that configure the one group, and sets the repetition frequency in such a manner as to regard the one group as one unit.

Abstract: The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.

Abstract: A gold plating solution containing a gold cyanide salt, a reducing agent that is formaldehyde or its precursor, and an iron cyanide compound, and not containing a chelate compound having two or more iminodiacetic acid groups or aminomethylenephosphonic acid groups, is brought into contact with a chelating resin having an iminodiacetic acid group or an aminomethylenephosphonic acid group, thereby removing iron ions from the gold plating solution.

Abstract: A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ? of the HIPE foam may be 35 kg/m3 or more and 500 kg/m3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×103 or more and 2×105 or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.

Abstract: A method for fabricating an electronic component includes the steps of: forming a base material layer of, for example, nickel on a base material of copper, copper alloy, aluminium, or aluminium alloy; applying, as a catalyst, one or more metals selected from the group consisting of gold, palladium, platinum, silver, rhodium, cobalt, tin, copper, iridium, osmium, and ruthenium, on the base material layer; and forming a surface layer by an electroless tin plating bath including trivalent titanium as an reducing agent and pyrophosphate salt as a complexing agent. The surface layer has a thickness of 0.5 ?m or more.

Abstract: A dispatched vehicle extraction server, a dispatched vehicle extraction device, and a dispatched vehicle extraction method perform: acquiring a dispatching request, a user position and a vehicle position of a dispatched vehicle at the time of the dispatching request; calculating a time the user spends moving from the user position to a meeting site of the dispatched vehicle, calculating a time the user spends waiting, calculating a total time that would be spent by the user from when the user makes the dispatching request until the user arrives at an intended location by boarding the dispatched vehicle; extracting the dispatched vehicle that satisfies constraints relating to the total time and the time would be spent waiting according to the user attribute information at the proposed meeting sites; and outputting a combination of each of the proposed meeting sites and the dispatched vehicle.

Abstract: The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.

Abstract: The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R1, R2, and R3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.

Abstract: The present invention provides an inexpensive valve unit fixing structure that enables a valve unit to be easily fixed without the need for unitization in advance, and a fluid pump that enables a discharge valve and a relief valve to be incorporated in a compact manner. The valve unit fixing structure includes a main body (3), a discharge communication passage (9) provided inside the main body (3), a discharge valve unit (10) which is provided in the main body (3) and which opens/closes the discharge communication passage (9), and deformed fixing parts (35) which are formed by plastically deforming the main body (3) and which fix the discharge valve unit (10) to the main body (3).

Abstract: The purpose of the present invention is to provide a gold plating method and a plating film for preventing a decrease of wire bonding characteristic by a thermal hysteresis by implementation and else. In addition, the purpose of the present invention is to provide a gold plating method and a plating film for preventing a decrease of wire bonding characteristic by a thermal hysteresis by implementation and else, even when a film thickness of a gold plating film is thin. A gold plating method for wire bonding connection by plating using a silver catalyst on a copper or copper alloy film, comprising: a silver catalyst forming step for forming a silver film as the silver catalyst for forming a palladium film; a palladium film forming step for forming the palladium film on the silver catalyst; a gold plating film forming step for forming a gold plating film on the palladium film, wherein a film thickness of the silver film is 0.05 ?m to 0.5 ?m.

Abstract: The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R1, R2, and R3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.

Abstract: The present invention provides an inexpensive valve unit fixing structure that enables a valve unit to be easily fixed without the need for unitization in advance, and a fluid pump that enables a discharge valve and a relief valve to be incorporated in a compact manner. The valve unit fixing structure includes a main body (3), a discharge communication passage (9) provided inside the main body (3), a discharge valve unit (10) which is provided in the main body (3) and which opens/closes the discharge communication passage (9), and deformed fixing parts (35) which are formed by plastically deforming the main body (3) and which fix the discharge valve unit (10) to the main body (3).

Abstract: An apparatus for measuring an impedance of a fuel cell is configured to: output an AC current to a fuel cell; and adjust an impedance so that an impedance between the fuel cell and a load device becomes higher than an impedance between a secondary battery and the load device at a frequency of the AC current output to the fuel cell. The apparatus is also configured to: adjust the AC current so that a positive-electrode side AC potential difference matches a negative-electrode side AC potential difference; and calculate an impedance of the fuel cell on the basis of the adjusted AC current and at least one AC potential difference of the positive-electrode side AC potential difference and the negative-electrode side AC potential difference.

Abstract: An apparatus for measuring an impedance of a fuel cell is configured to: output an AC current to a fuel cell; and adjust an impedance so that an impedance between the fuel cell and a load device becomes higher than an impedance between a secondary battery and the load device at a frequency of the AC current outputted to the fuel cell.

Abstract: A non-transitory computer-readable recording medium storing a program causing a computer to execute a process, the process includes starting N (two or more) processes from a first program; and controlling variation in the number of processes for which a second program is deployed, depending on a load on the processes for which the second program is deployed, within a range of the N processes by deploying the second program to a storage area corresponding to one process of the N processes and undeploying the second program deployed to the storage area.

Abstract: A network device includes: a connector connected to a network; a receiving line connected to the connector; a transmitting line connected to the connector; a communication control unit configured to control communication with an external network device by receiving a signal from the network through the connector and the receiving line, and transmitting the signal to the network through the transmitting line and the connector; and a loop-back processing unit configured to loop back the signal transmitted through the receiving line, to the transmitting line when the communication control unit is in a power-off state or a standby state.

Abstract: A non-transitory computer-readable recording medium storing a program causing a computer to execute a process, the process includes starting N (two or more) processes from a first program; and controlling variation in the number of processes for which a second program is deployed, depending on a load on the processes for which the second program is deployed, within a range of the N processes by deploying the second program to a storage area corresponding to one process of the N processes and undeploying the second program deployed to the storage area.