Abstract: In a transfer method used in a substrate processing apparatus including a vacuum transfer chamber and a first and a second processing chamber and a preliminary chamber connected to the vacuum transfer chamber, a first and a second processing chamber are heated such that a temperature of the first processing chamber becomes lower than a temperature of the second processing chamber. A processed substrate is transferred from the first processing chamber to the second processing chamber and an unprocessed substrate is transferred from the preliminary chamber to the first processing chamber using a substrate transfer device disposed in the vacuum transfer chamber. Further, the transfer of the processed substrate and the transfer of the unprocessed substrate are repeatedly executed for each of substrates, and the transfer of the unprocessed substrate is executed when no substrate is mounted in the first processing chamber.

Abstract: In a transfer method used in a substrate processing apparatus including a vacuum transfer chamber and a first and a second processing chamber and a preliminary chamber connected to the vacuum transfer chamber, a first and a second processing chamber are heated such that a temperature of the first processing chamber becomes lower than a temperature of the second processing chamber. A processed substrate is transferred from the first processing chamber to the second processing chamber and an unprocessed substrate is transferred from the preliminary chamber to the first processing chamber using a substrate transfer device disposed in the vacuum transfer chamber. Further, the transfer of the processed substrate and the transfer of the unprocessed substrate are repeatedly executed for each of substrates, and the transfer of the unprocessed substrate is executed when no substrate is mounted in the first processing chamber.