Abstract: A packaged integrated circuit (IC) includes a substrate including a first substrate pad disposed on a first side of the substrate, an IC die disposed on the first side of the substrate, and a first insulating layer molded over the IC die and the substrate. The IC die includes a first die pad on a side of the die opposite from a side of the die adjacent to the first side of the substrate. The first insulating layer includes a first channel extending through the first insulating layer to the first substrate pad, a second channel extending through the first insulating layer to the first die pad, conductive paste filling the first channel and in contact with the first substrate pad, and conductive paste filling the second channel and in contact with the die pad.

Abstract: A packaged integrated circuit (IC) includes a substrate including a first substrate pad disposed on a first side of the substrate, an IC die disposed on the first side of the substrate, and a first insulating layer molded over the IC die and the substrate. The IC die includes a first die pad on a side of the die opposite from a side of the die adjacent to the first side of the substrate. The first insulating layer includes a first channel extending through the first insulating layer to the first substrate pad, a second channel extending through the first insulating layer to the first die pad, conductive paste filling the first channel and in contact with the first substrate pad, and conductive paste filling the second channel and in contact with the die pad.

Abstract: A semiconductor package assembly includes a substrate having an upper surface with a die attachment region thereon. A layer of die attachment material is positioned on top of the die attachment region. The semiconductor package assembly also includes an integrated circuit (“IC”) die. The die has a top portion including a laterally extending top wall surface and a plurality of generally vertically extending wall surfaces extending downwardly from the top wall surface. The die has a metallized bottom portion. The bottom portion has at least two metallized laterally extending wall surfaces and a plurality of metallized generally vertically extending connecting surfaces that connect the metallized laterally extending surfaces of the bottom portion. The layer of die attachment material interfaces with one or both of the metallized laterally extending surfaces and the plurality of metallized generally vertically extending connecting wall surfaces.