Patents by Inventor Yohei Maeno

Yohei Maeno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210228475
    Abstract: The present invention provides a structure suitable for controlling the release quantity of an active ingredient in a state where the structure is in contact with skin. A structure 10 according to the present invention includes a retention part 1 that retains an active ingredient, and a release control layer 3 that controls release of the active ingredient to an outside. In the structure 10, at least one of the following conditions holds: i) the release control layer 3 includes a microporous membrane having an average pore diameter of 0.01 ?m or less; and ii) the release control layer 3 is a nanofiltration membrane or a reverse osmotic membrane.
    Type: Application
    Filed: April 10, 2019
    Publication date: July 29, 2021
    Inventor: Yohei MAENO
  • Patent number: 10879103
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein a ratio of a plan view area of recessed portions occurring in a carbon nanotube aggregate-side surface of the mounting member to a total area of the carbon nanotube aggregate-side surface is 5% or less.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: December 29, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Tomoaki Ichikawa, Yohei Maeno
  • Patent number: 10796941
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: October 6, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Tomoaki Ichikawa, Yohei Maeno
  • Patent number: 10777446
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 ?m or more transferred onto the silicon wafer is 100 particles/cm2 or less.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: September 15, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Tomoaki Ichikawa, Yohei Maeno
  • Publication number: 20200048093
    Abstract: Provided is a carbon nanotube aggregate excellent in gripping force in a wide temperature range including high-temperature conditions. The carbon nanotube aggregate of the present invention is a carbon nanotube aggregate of a sheet shape, including a plurality of carbon nanotubes, wherein the carbon nanotube aggregate satisfies the following condition for FFM differential voltages when a frictional curve is obtained by scanning a front surface and/or a back surface of the carbon nanotube aggregate with a probe of a scanning probe microscope under a state in which the probe is brought into contact therewith: a ratio of an FFM differential voltage at 210° C. to an FFM differential voltage at 25° C. is from 0.3 to 5.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 13, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiharu HATAKEYAMA, Tomoaki ICHIKAWA, Shotaro MASUDA, Yohei MAENO
  • Publication number: 20200039826
    Abstract: Provided is a carbon nanotube aggregate excellent in gripping force. The carbon nanotube aggregate of the present invention is a carbon nanotube aggregate of a sheet shape, including a plurality of carbon nanotubes, wherein the carbon nanotube aggregate has a cohesive strength N of 3 nJ or more on a front surface and/or a back surface thereof, which is measured by a nanoindentation method with an indentation load of 500 ?N.
    Type: Application
    Filed: August 14, 2017
    Publication date: February 6, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiharu HATAKEYAMA, Tomoaki ICHIKAWA, Shotaro MASUDA, Yohei MAENO
  • Publication number: 20190218426
    Abstract: Provided is a pressure-sensitive adhesive structure including a carbon nanotube aggregate formed on a base material in which carbon nanotubes forming the carbon nanotube aggregate are hardly detached. The pressure-sensitive adhesive structure of the present invention includes: a base material; an intermediate layer; and a carbon nanotube aggregate layer, wherein the carbon nanotube aggregate layer includes a plurality of carbon nanotube aggregates, wherein the intermediate layer includes a layer containing the carbon nanotubes and a fixing agent, and wherein the intermediate layer has a thickness of 100 nm or more.
    Type: Application
    Filed: August 2, 2017
    Publication date: July 18, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiharu HATAKEYAMA, Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO
  • Publication number: 20190177165
    Abstract: Provided is a carbon nanotube aggregate that can maintain a sheet shape. The carbon nanotube aggregate of the present invention includes a plurality of carbon nanotubes, the carbon nanotube aggregate being formed into a sheet shape, wherein the carbon nanotube aggregate includes a non-aligned portion of the carbon nanotubes. In one embodiment, the carbon nanotube aggregate further includes an aligned portion of the carbon nanotubes. In one embodiment, the non-aligned portion is present at an end portion in a lengthwise direction of the carbon nanotube aggregate.
    Type: Application
    Filed: July 28, 2017
    Publication date: June 13, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiharu HATAKEYAMA, Tomoaki ICHIKAWA, Shotaro MASUDA, Yohei MAENO
  • Publication number: 20190071265
    Abstract: Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.
    Type: Application
    Filed: March 14, 2017
    Publication date: March 7, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO, Yoshiharu HATAKEYAMA
  • Publication number: 20190051550
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein a ratio of a plan view area of recessed portions occurring in a carbon nanotube aggregate-side surface of the mounting member to a total area of the carbon nanotube aggregate-side surface is 5% or less.
    Type: Application
    Filed: January 10, 2017
    Publication date: February 14, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO
  • Publication number: 20190035672
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.
    Type: Application
    Filed: January 10, 2017
    Publication date: January 31, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO
  • Publication number: 20190027395
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 ?m or more transferred onto the silicon wafer is 100 particles/cm2 or less.
    Type: Application
    Filed: January 10, 2017
    Publication date: January 24, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO
  • Patent number: 7712177
    Abstract: To provide a cleaning sheet that can remove foreign matter adhering on a probe needle without wearing the probe needle and that does not allow the foreign matter to re-adhere on the probe needle, the cleaning sheet has a cleaning layer on at least one surface thereof, the cleaning layer containing a urethane polymer and a vinyl monomer.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: May 11, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Yoshinori Yoshida, Yohei Maeno, Jirou Nukaga
  • Publication number: 20080193728
    Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
    Type: Application
    Filed: March 19, 2008
    Publication date: August 14, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori YOSHIDA, Yohei Maeno, Kouji Akazawa, Takeshi Matsumura, Tomokazu Takahashi
  • Publication number: 20050153129
    Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
    Type: Application
    Filed: January 21, 2005
    Publication date: July 14, 2005
    Inventors: Yoshinori Yoshida, Yohei Maeno, Kouji Akazawa, Takeshi Matsumura, Tomokazu Takahashi
  • Publication number: 20040182418
    Abstract: To provide a cleaning sheet that can remove foreign matter adhering on a probe needle without wearing the probe needle and that does not allow the foreign matter to re-adhere on the probe needle, the cleaning sheet has a cleaning layer on at least one surface thereof, the cleaning layer containing a urethane polymer and a vinyl monomer.
    Type: Application
    Filed: March 18, 2004
    Publication date: September 23, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori Yoshida, Yohei Maeno, Jirou Nukaga
  • Publication number: 20040126575
    Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
    Type: Application
    Filed: July 24, 2003
    Publication date: July 1, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori Yoshida, Yohei Maeno, Kouji Akazawa, Takeshi Matsumura, Tomokazu Takahashi