Abstract: Provided are a dual-frequency power-supply apparatus, a high-frequency heating apparatus, and a high-frequency quenching apparatus having a high durability. A dual-frequency power-supply apparatus 1 includes a power supply 10 that alternately outputs a low-frequency current and a high-frequency current. The power supply 10 has an inverter 30 that converts a direct current into the low-frequency current and the high-frequency current and a controller 40 that controls the inverter 30. The controller 40 repeats, in this order, a first output period T11 in which the low-frequency current is output, a first intermission T12 in which output is stopped, a second output period T13 in which the high-frequency current is output, and a second intermission T14 in which output is stopped.

Abstract: A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to the annular frame, and a second tape pressure bonding unit that includes a second pressure bonding roller for executing pressure bonding of the tape of the tape-attached annular frame to a front surface or a back surface of the wafer. A first heating unit is disposed in one of or both the frame table and the first pressure bonding roller, while a second heating unit is disposed in one of or both the wafer table and the second pressure bonding roller.

Abstract: A tape is stuck to the front surface of a workpiece in such a manner that the direction in which the stretch rate becomes the lowest when a predetermined force is applied to the tape is non-parallel to each of multiple planned dividing lines extending in a lattice manner. In this case, each of the multiple planned dividing lines does not extend along the direction perpendicular to this direction. This can reduce the ratio of the region to which the tape does not stick in the front surface of the workpiece in the vicinity of the boundary between each of the multiple planned dividing lines and a region in which a device is formed and suppress deterioration of the processing quality when the workpiece is divided from the back surface side by a cutting blade.

Abstract: An affixing method includes a pressing step of pressing a tape against a wafer with a tape affixing roller and pressing the wafer against a suction table with the tape affixing roller, an evacuating step of evacuating a vacuum chamber that houses the suction table and the tape affixing roller therein to create a vacuum in the vacuum chamber, and an affixing step of affixing the tape to the wafer with the tape affixing roller by causing the tape affixing roller to roll on the tape while the tape affixing roller is pressing the wafer.

Abstract: This drive device is provided with a motor section (2) and a wheel (102) which is connected to the output section (44) of the motor section (2) and which rotates. The wheel (102) has a circular plate-shaped disk section (104) which is affixed to the output section (44), and a rim section (105) which extends in the axial direction of the output section (44) from the outer periphery of the disk section (104) and on which a tire (103) is mounted. The disk section (104) is provided with a rib (116) surrounding the periphery of the motor section (2).

Abstract: This drive device is provided with a motor section (2) and a wheel (102) which is connected to the output section (44) of the motor section (2) and which rotates. The wheel (102) has a circular plate-shaped disk section (104) which is affixed to the output section (44), and a rim section (105) which extends in the axial direction of the output section (44) from the outer periphery of the disk section (104) and on which a tire (103) is mounted. The disk section (104) is provided with a rib (116) surrounding the periphery of the motor section (2).