Abstract: A spacecraft includes: a main-reflection unit configured to reflect and emit a radio wave outside, a sub-reflection unit configured to face the main-reflection unit, a radiator arranged to face the sub-reflection unit and configured to radiate the radio wave in a direction of the sub-reflection unit, a main body configured to be able to accommodate at least one part of the sub-reflection unit therein, and a delivery device connected to the sub-reflection unit and configured to deliver the sub-reflection unit, at least one part of which is accommodated in the main body, to a position where the sub-reflection unit is able to reflect the radio wave radiated from the radiator to the main-reflection unit and cause the main-reflection unit to radiate the radio wave outside.

Abstract: Spacecraft and antenna apparatus that can be more easily deployed from a stored state can include: a main-reflection unit including a plurality of ribs formed to be deployable in a stored state in which the ribs are folded and a sheet body provided between a plurality of the ribs and configured to be capable of reflecting a radio wave radiated from a radiator and emitting the radio wave outside, and a restriction member configured to restrict deployment of the plurality of ribs in the stored state, and release the restriction by operation of a restriction release member different from the main-reflection unit.

Abstract: An information storage device includes a storage unit, a control unit, an allocation information storage unit, a QoS parameter storage unit, and a monitoring result storage unit. The control unit creates and manages a logical storage area using the storage area of the storage unit when a storage area allocation request is received. The allocation information storage unit stores allocation information related to logical storage areas. The QoS parameter storage unit stores quality requests expected to be satisfied for a communication for using the logical storage area. The control unit monitors the operating state and characteristics of the storage unit and the communication status, and stores the results in the monitoring result storage unit. The control unit derives internal QoS parameters to be set in the information storage device from the information stored in the allocation information storage unit, the QoS parameter storage unit, and the monitoring result storage unit.

Abstract: A compression mold includes a first mold and a second mold. The first mold includes a side surface member and a bottom surface member. The side surface member includes a step height on a bottom surface member side of the side surface member. The step height includes a first surface of the side surface member, a second surface that extends from the first surface toward the bottom surface member, and a third surface that extends downward from the second surface. The bottom surface member includes an upper surface where a resin material can be arranged and a slide surface that extends downward from the upper surface and is slidable with respect to the third surface of the side surface member. The third surface of the side surface member is not exposed while the resin material is supplied.

Abstract: A resin molding apparatus includes: a first molding mold provided with a first member and a second member configured to move relative to the first member, and configured to form a cavity by the first member and the second member; a second molding mold configured to hold a substrate; and a mask member so as to be relatively immovable with respect to the first member, configured to make contact with a portion of the substrate when the first molding mold and the second molding mold are clamped, and formed with a flow portion through which a resin material existing in the cavity and pressurized by the second member is capable of flowing.

Abstract: The present invention provides a resin leakage prevention member 401 for use in a molding die 1000, wherein the molding die 1000 includes a lower die 200 and an upper die 100, the lower die 200 has a side member 201 and a bottom member 202, a space surrounded by the side member 201 and the bottom member 202 forms a cavity 204, the cavity 204 is configured to accommodate a resin material 20a, the side member 201 is configured to move relatively vertical to the bottom member 202, and the resin leakage prevention member 401 is disposed on a peripheral portion of an upper surface of the bottom member 202 and along an inner peripheral surface of the side member 201, thereby sealing a gap between the side member 201 and the bottom member 202 and preventing a resin from leaking from the cavity 204 into the gap.

Abstract: The present invention provides a resin leakage prevention member 401 for use in a molding die 1000, wherein the molding die 1000 includes a lower die 200 and an upper die 100, the lower die 200 has a side member 201 and a bottom member 202, a space surrounded by the side member 201 and the bottom member 202 forms a cavity 204, the cavity 204 is configured to accommodate a resin material 20a, the side member 201 is configured to move relatively vertical to the bottom member 202, and the resin leakage prevention member 401 is disposed on a peripheral portion of an upper surface of the bottom member 202 and along an inner peripheral surface of the side member 201, thereby sealing a gap between the side member 201 and the bottom member 202 and preventing a resin from leaking from the cavity 204 into the gap.

Abstract: A resin molding apparatus includes: a first molding mold provided with a first member and a second member configured to move relative to the first member, and configured to form a cavity by the first member and the second member; a second molding mold configured to hold a substrate; and a mask member so as to be relatively immovable with respect to the first member, configured to make contact with a portion of the substrate when the first molding mold and the second molding mold are clamped, and formed with a flow portion through which a resin material existing in the cavity and pressurized by the second member is capable of flowing.

Abstract: A resin molding apparatus capable of suppressing an occurrence of defects related to resin filling. The resin molding apparatus includes: a molding mold which forms a cavity; a pot which is arranged in the molding mold and is capable of accommodating a resin material, and in which an opening portion opening directly to the cavity is formed; and a plunger which is arranged to be slidable in the pot, and transfers the resin material accommodated in the pot toward the cavity via the opening portion by extruding the resin material. An inner diameter of the opening portion is formed to be the same as an outer diameter of the plunger or larger than the outer diameter of the plunger.

Abstract: A lower mold has a bottom surface member and a side surface member. An upper end surface of the bottom surface member forms an inner bottom surface of a cavity and has a planar shape corresponding to an unusual planar shape of a sealing resin. A substrate is disposed on a mold surface of an upper mold such that a component to be sealed attached to the substrate faces downward, and the cavity is filled with a fluid resin. The upper mold and the lower mold are clamped, and the component is immersed in the fluid resin. The bottom surface member is raised, and the fluid resin is pressed at a prescribed resin pressure and cured to form the sealing resin. The bottom surface member and the side surface member are moved relatively, and thereby, a molded product is released from a mold surface of the lower mold.

Abstract: A lower mold has a bottom surface member and a side surface member. An upper end surface of the bottom surface member forms an inner bottom surface of a cavity and has a planar shape corresponding to an unusual planar shape of a sealing resin. A substrate is disposed on a mold surface of an upper mold such that a component to be sealed attached to the substrate faces downward, and the cavity is filled with a fluid resin. The upper mold and the lower mold are clamped, and the component is immersed in the fluid resin. The bottom surface member is raised, and the fluid resin is pressed at a prescribed resin pressure and cured to form the sealing resin. The bottom surface member and the side surface member are moved relatively, and thereby, a molded product is released from a mold surface of the lower mold.

Abstract: A molding module 2 includes: a mold 11 including a lower mold 10 and an upper mold 7 facing each other; a cavity 12 provided in the lower mold; a bottom member 9 forming the inner bottom surface 14 of the cavity; a circumferential member 8 forming the inner circumferential surface 13 of the cavity; a mold-driving mechanism for opening and closing the mold 11; a lower base 3; a support member 4 vertically provided on the lower base; an upper base 5 provided in the upper portion of the support member; and an elevating platen 6 mounted on the middle portion of the support member in a vertically moveable manner. Motors 16 and 23 included in the mold-driving mechanism are respectively attached to the lower base and the elevating platen. The upper mold is attached to the upper base. The circumferential member is connected to the elevating platen. The bottom member is connected to the motor 23. The circumferential member is driven vertically by the elevating platen which is driven vertically by the motor 16.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces. Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: A resin encapsulation molding apparatus comprises die assembly of triple die structure and mold release film for covering two cavities respectively corresponding to two substrates. Each of the two cavities comprises inferior die cavity face, cavity side face and cavity face consisting of communication channel face. The mold release film in the state of being tensioned covers each of the two cavities along the morphology thereof. In this condition, molten resin is injected into the two cavities. The molten resin is evenly distributed into the two cavities through communication channel communicating the two cavities with each other. Thereafter, the multiple electronic parts on the two substrates are almost simultaneously immersed in the molten resin within the two cavities and are compression molded.

Abstract: An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is also covered with the release film. Therefore, releasability of a cured resin from the cavity side surface is increased. As a result, the cured resin is prevented from being damaged near the cavity side surface.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.