Patents by Inventor Yohei OSHIMA

Yohei OSHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128020
    Abstract: In a method for manufacturing a laminated coil component, in which a laminated coil component is manufactured by laminating insulator sheets in order on which conductors having predetermined patterns are formed, the insulator sheets are laminated such that a distance in a lamination direction between a first lead-out conductor laminated first and a first coil conductor laminated next is larger than a distance in the lamination direction between a second lead-out conductor laminated last and a second coil conductor laminated immediately before the second lead-out conductor.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 18, 2024
    Applicant: TDK CORPORATION
    Inventors: Yuya OSHIMA, Junichi OTSUKA, Yohei TADAKI, Shinichi KONDO, Koki ITO, Yoji TOZAWA, Shigeshi OSAWA, Tsubasa OZAWA, Makoto YOSHINO
  • Publication number: 20240080979
    Abstract: There is provided a printed wiring board including an outermost conductive layer that includes a plurality of conductive pads, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the first conductive layer, a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other, a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other, and a stitching via that is connected to a ground. The first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads are arranged.
    Type: Application
    Filed: July 19, 2023
    Publication date: March 7, 2024
    Inventors: Goro HAMAMOTO, Keisuke YAMAMOTO, Yutaka UEMATSU, Shinsuke ONOE, Yohei OSHIMA
  • Patent number: 11612055
    Abstract: In a printed wiring board, one transmitting circuit and N (N is an integer of 3 or more) receiving circuits are coupled by a multi-point wiring. First to N-th branch points are provided in sequence in the multi-point wiring having one end coupled to the transmitting circuit. Wirings branched at the respective branch points are coupled to the respective receiving circuits. Here, a wiring length from a coupling point of the transmitting circuit to a first branch point is configured to be longer than a wiring length from the first branch point to the second branch point. Wiring lengths between the adjacent branch points at and after a second branch point are configured to be shorter than the wiring length from the first branch point to the second branch point.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: March 21, 2023
    Assignee: HITACHI, LTD.
    Inventors: Goro Hamamoto, Yutaka Uematsu, Yohei Oshima, Maya Hyakudomi
  • Publication number: 20220030706
    Abstract: In a printed wiring board, one transmitting circuit and N (N is an integer of 3 or more) receiving circuits are coupled by a multi-point wiring. First to N-th branch points are provided in sequence in the multi-point wiring having one end coupled to the transmitting circuit. Wirings branched at the respective branch points are coupled to the respective receiving circuits. Here, a wiring length from a coupling point of the transmitting circuit to a first branch point is configured to be longer than a wiring length from the first branch point to the second branch point. Wiring lengths between the adjacent branch points at and after a second branch point are configured to be shorter than the wiring length from the first branch point to the second branch point.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 27, 2022
    Inventors: Goroh HAMAMOTO, Yutaka UEMATSU, Yohei OSHIMA, Maya HYAKUDOMI